10AX115R3F40I2SG

The 10AX115R3F40I2SG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1517-FCBGA (40×40) package designed for mid-range, performance- and power-sensitive applications. This device is part of the Arria 10 family of 20 nm FPGAs and SoCs and delivers a balance of logic capacity, embedded memory, and I/O resources for a wide range of system designs.

Typical use cases and market segments called out for Arria 10 devices include wireless and wireline communications, broadcast and media transport, computing and storage acceleration, medical imaging, and defense systems where performance, integration, and power efficiency are priorities.

Key Features

• Logic Capacity — 1,150,000 logic elements provide extensive programmable logic for complex designs and high-level integration.
• On‑chip Memory — 68,857,856 total RAM bits of embedded memory to support buffering, caching, and high-throughput data paths.
• I/O Resources — 342 user I/O pins enable broad interfacing options for parallel and serial connectivity.
• High‑performance DSP and Transceiver Blocks — Includes variable‑precision DSP blocks and low‑power serial transceivers suited for signal processing and high‑speed link implementations (as described in the device overview).
• Protocol and PHY Hard IP — Device overview references PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet to simplify implementation of standard interfaces.
• Clocking and PLL Resources — Comprehensive clock networks with PLL clock sources and fractional synthesis options for flexible timing architectures.
• Package and Mounting — 1517-FCBGA (40×40) surface-mount package designed for high-density board integration.
• Power and Operating Range — Supported supply range of 870 mV to 930 mV and industrial operating temperature range from −40 °C to 100 °C.
• Compliance — RoHS compliant.

Typical Applications

• Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems leveraging on-chip DSP and high-speed transceivers.
• Wireline transport — 40G/100G muxponders, transponders, and line-card designs using integrated protocol hard IP and high-density logic.
• Broadcast and media — Studio switches, video transport and conferencing systems benefitting from large memory and flexible I/O.
• Computing and storage — Flash cache, server acceleration, and cloud computing appliances that require high logic capacity and embedded memory.
• Defense and imaging — Radar, secure communications, and diagnostic imaging applications that require robust temperature range and high-performance signal processing.

Unique Advantages

• High logic density: 1,150,000 logic elements enable consolidation of complex functions into a single device, reducing board-level BOM.
• Large on‑chip memory: Nearly 69 million bits of embedded RAM support deep buffering, high-throughput data paths, and memory-intensive algorithms.
• Comprehensive interface IP: Built-in PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet accelerate time-to-market for standard protocol implementations.
• Flexible clocking and DSP resources: Dedicated PLLs and variable‑precision DSP blocks support precision timing and signal-processing workloads.
• Industrial temperature capability: −40 °C to 100 °C operating range supports deployment in temperature-challenging environments.
• Compact, board-friendly package: 1517-FCBGA (40×40) surface-mount footprint facilitates high-density PCB designs.

Why Choose 10AX115R3F40I2SG?

The 10AX115R3F40I2SG positions itself as a mid-range, high-capacity FPGA offering a balance of programmable logic, substantial embedded memory, and flexible I/O in an industrial-grade package. Its inclusion in the Arria 10 family emphasizes power efficiency and performance on a 20 nm process, and the device overview documents integrated resources such as DSP blocks, PLLs, and protocol hard IP that streamline implementation of complex systems.

This device is well-suited for engineers designing communication infrastructure, high-performance data-paths, and compute-acceleration modules who require a scalable, robust FPGA platform with strong on-chip memory and interface support. The combination of logic density, memory, and industrial operating limits supports long-term deployment and scalable designs.

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