10AX115R3F40E2SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 45 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R3F40E2SG – Arria 10 GX FPGA, 1517-FCBGA

The Intel Arria 10 GX 10AX115R3F40E2SG is a high-performance, power-efficient 20 nm mid-range Field Programmable Gate Array (FPGA) in a 1517-FCBGA (40×40) package. It combines a large programmable fabric with embedded memory, DSP resources and hardened IP to address demanding midrange applications.

Targeted market segments include wireless and wireline infrastructure, broadcast, computing and storage, medical imaging and defense systems where performance, power efficiency and flexible integration are required.

Key Features

  • Logic Capacity  The device provides 1,150,000 logic elements for complex digital designs and high-density integration.
  • Embedded Memory  68,857,856 total RAM bits of on-chip memory to support large buffers, frame storage and memory-intensive algorithms.
  • I/O and Packaging  342 user I/Os in a 1517-BBGA (1517-FCBGA, 40×40) surface-mount package for dense board-level integration.
  • Power Supply  Operates with a core supply range of 870 mV to 930 mV, enabling low-voltage power management strategies.
  • Operating Range  Specified for 0°C to 100°C operation and supplied in an Extended grade.
  • Transceivers and Connectivity  Supports low-power serial transceivers and includes hard IP for Ethernet and Interlaken use cases, with documented support for 10 Gbps Ethernet.
  • Hard IP and Interfaces  Includes PCIe Gen1/Gen2/Gen3 hard IP and enhanced PCS hard IP for high-speed protocols.
  • Compute and DSP  Variable-precision DSP blocks and adaptive logic modules provide flexible datapath and signal-processing resources.
  • Clocking and PLLs  Flexible clock networks with fractional synthesis and I/O PLLs for precise timing and multi-clock-domain designs.
  • Reconfiguration and Development  Device architecture and documentation reference dynamic and partial reconfiguration and support for hardware and software development flows.

Typical Applications

  • Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul equipment leveraging the device's performance and DSP resources.
  • Wireline Networks  40G/100G muxponders, transponders and line cards where high-speed I/O and hardened protocol IP (PCIe, Ethernet) are required.
  • Broadcast and Media  Studio switching, videoconferencing and professional audio/video processing using embedded memory and high-density logic.
  • Computing & Storage  Flash cache, cloud server acceleration and server offload tasks that benefit from large on-chip memory and programmable compute fabric.
  • Medical and Defense Systems  Diagnostic imaging, radar and electronic warfare applications that require midrange FPGA performance with extended temperature operation.

Unique Advantages

  • High logic density: 1,150,000 logic elements enable consolidation of complex functions into a single device, reducing board-level BOM.
  • Large on-chip memory: Nearly 69Mbits of RAM supports deep buffering and memory-hungry algorithms without relying solely on external memory.
  • Integrated hardened IP: Built-in PCIe Gen1/2/3 and Ethernet/Interlaken PCS hard IP simplify high-speed interface implementation and reduce development time.
  • Flexible clocking and transceivers: Fractional synthesis PLLs and low-power serial transceivers provide precise timing and high-speed connectivity options.
  • Extended-grade operation: Specified 0°C to 100°C operating range and Extended grade part selection for applications requiring broader temperature range than commercial-only parts.
  • Scalable development model: Support for dynamic and partial reconfiguration and documented hardware/software development flows to accelerate system integration.

Why Choose 10AX115R3F40E2SG?

The 10AX115R3F40E2SG Arria 10 GX device positions itself for midrange designs that demand a balance of performance, power efficiency and integration. With a large logic fabric, substantial embedded memory and hardened protocol IP, it is suited to systems that consolidate multiple functions on a single FPGA while maintaining power-conscious operation.

Engineers designing wireless backhaul, high-speed networking, broadcast processing, server acceleration or advanced imaging and defense systems will find the device's combination of logic density, I/O capability and transceiver/connectivity support valuable for scalable, robust designs backed by Intel's device documentation and development ecosystem.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the 10AX115R3F40E2SG Arria 10 GX FPGA. Our team can provide lead times and support for your procurement and design evaluation needs.

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