10AX115R3F40E2LG

The 10AX115R3F40E2LG is an Intel Arria 10 GX field programmable gate array (FPGA) in a 1517-FCBGA (40×40) package. It is part of the Arria 10 device family of 20 nm mid-range FPGAs designed for high-performance, power-sensitive applications.

With a high logic density, large embedded memory, and abundant I/O, this device targets markets such as wireless infrastructure, wireline networking, broadcast, computing and storage, and other midrange systems that require a balance of performance and efficiency.

Key Features

• Logic Capacity — 1,150,000 logic elements (cells) for complex digital designs and large-scale hardware acceleration.
• Embedded Memory — 68,857,856 total RAM bits to support extensive on-chip buffering and memory-intensive functions.
• I/O Resources — 342 I/O pins to interface with external devices, memories, and high-speed ports.
• Package & Mounting — 1517-BBGA, FCBGA package; supplier device package listed as 1517-FCBGA (40×40); surface-mount mounting type for compact board integration.
• Voltage Supply — Operational supply range from 870 mV to 930 mV to match target system power rails.
• Operating Temperature — Rated for 0 °C to 100 °C, suitable for extended-temperature applications.
• Compliance & Grade — Extended grade device and RoHS compliant.
• Arria 10 Family Capabilities — Family-level features include power-efficiency and architecture elements described in the Intel Arria 10 device overview (20 nm mid-range FPGA family).

Typical Applications

• Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and on-chip memory.
• Wireline Networking — 40G/100G muxponders, transponders, and line cards where logic density and I/O resources support high-throughput data paths.
• Broadcast & Professional AV — Studio switches, videoconferencing, and professional video transport applications leveraging programmable I/O and on-chip memory.
• Computing & Storage — Flash cache, server acceleration, and cloud computing server functions that benefit from large logic and memory resources.

Unique Advantages

• High Logic Density: 1,150,000 logic elements enable implementation of complex algorithms and large-scale hardware designs without partitioning across multiple devices.
• Substantial On-Chip Memory: 68,857,856 RAM bits reduce dependence on external memory and simplify buffering and packet-processing designs.
• Generous I/O Count: 342 I/O pins provide flexibility for interfacing multiple peripherals, memory interfaces, and board-level connectivity.
• Compact FCBGA Package: 1517-FCBGA (40×40) surface-mount package supports dense PCB layouts while delivering high integration.
• Extended Temperature Rating: 0 °C to 100 °C operating range suits applications requiring extended commercial-grade thermal operation.
• Vendor Family Support: Part of the Intel Arria 10 family, which is documented with device handbooks and overview material for design reference.

Why Choose 10AX115R3F40E2LG?

The 10AX115R3F40E2LG delivers a combination of high logic capacity, large embedded memory, and plentiful I/O in a compact 1517-FCBGA package, making it suitable for midrange applications that demand performance and efficiency. Its extended-grade rating and RoHS compliance provide predictable thermal and environmental behavior for deployed systems.

This Arria 10 GX device is appropriate for engineering teams developing wireless infrastructure, high-speed networking, broadcast, or server-acceleration designs that require a programmable, high-density FPGA backed by Intel Arria 10 family documentation.

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