10AX115R3F40I2LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 976 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R3F40I2LG – Arria 10 GX FPGA, 1,150,000 logic elements, 1517‑FCBGA (40×40)
The 10AX115R3F40I2LG is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) provided in a 1517‑FCBGA (1517‑BBGA) package. It is a 20 nm mid‑range FPGA family member designed for high‑density, power‑sensitive applications across communications, broadcast, computing, medical and defense markets.
With 1,150,000 logic elements, 68,857,856 bits of embedded RAM and 342 I/Os, this device targets systems that require substantial on‑chip logic, large embedded memory, and flexible I/O in an industrial‑grade, surface‑mount package.
Key Features
- Logic Capacity — 1,150,000 logic elements provide high logic density for complex processing, control and packet‑processing functions.
- Embedded Memory — 68,857,856 total RAM bits to support large buffers, caches and state machines on chip.
- I/O Density — 342 I/O pins to connect multiple external interfaces, memory buses and high‑speed links.
- Transceiver and SerDes Capabilities — Arria 10 family features include low‑power serial transceivers and multi‑Gbps channel support suitable for high‑speed data links (as described in the device overview).
- DSP and Timing Resources — Variable‑precision DSP blocks and comprehensive clock networks with PLL clock sources for fractional synthesis and precise timing control.
- Hard IP Support — Integrated hard IP options described for PCIe Gen1/Gen2/Gen3 and enhanced PCS hard IP for high‑speed Ethernet and Interlaken (per device family documentation).
- Package and Mounting — Surface mount 1517‑FCBGA package (40×40) for compact board integration.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for use in industrial environments.
- Core Voltage — Core supply range of 870 mV to 930 mV to match system power delivery constraints.
- RoHS Compliant — Meets RoHS environmental requirements.
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems requiring programmable logic and DSP acceleration.
- Wireline networking — 40G/100G muxponders, transponders and line cards where high logic density and transceiver capabilities are required.
- Broadcast systems — Studio switches and professional audio/video processing that benefit from on‑chip memory and flexible I/O.
- Computing and storage — Flash cache, server acceleration and cloud computing tasks leveraging embedded memory and programmable logic resources.
- Medical and defense equipment — Diagnostic imaging, radar and secure communications in systems that require industrial temperature operation and high integration.
Unique Advantages
- High logic density: 1,150,000 logic elements enable consolidation of complex functions onto a single device, reducing board count and interconnect complexity.
- Substantial on‑chip memory: Nearly 69 Mbits of embedded RAM lowers external memory dependency and supports large buffering and real‑time data processing.
- Extensive I/O and transceiver support: 342 I/Os and family‑level transceiver features accommodate varied interface requirements and high‑speed links.
- Industrial‑grade operation: −40 °C to 100 °C rating and surface‑mount FCBGA packaging suit industrial environments and compact board designs.
- Power‑aware core: Specified core voltage range of 870–930 mV supports modern low‑voltage power architectures.
- Ecosystem and hard IP: Device family documentation includes support for PCIe and high‑speed Ethernet hard IP, enabling faster integration of standard interfaces.
Why Choose 10AX115R3F40I2LG?
The 10AX115R3F40I2LG Arria 10 GX FPGA combines high logic capacity, large embedded memory and extensive I/O in a compact 1517‑FCBGA package rated for industrial operation. It is suited for mid‑range systems that need programmable performance and integration without sacrificing temperature or power constraints.
Design teams building communications, compute acceleration, broadcast or medical systems can leverage this device’s on‑chip resources and family‑level IP to shorten development time, reduce external BOM and scale logic and memory as system requirements evolve.
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