10AX115R3F40I2SGE2

The 10AX115R3F40I2SGE2 is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) in a 1517-FCBGA (40×40) package. It is part of the Arria 10 family of 20 nm mid-range FPGAs that deliver high performance with power-efficiency for demanding embedded and communications applications.

This device targets markets such as wireless, wireline, broadcast, computing and storage, medical, and military systems. Key value propositions include a large logic capacity, substantial on-chip RAM, a high I/O count, and operation across an industrial temperature range.

Key Features

• Core Logic  Provides 1,150,000 logic elements for complex digital designs and high-density integration.
• On-Chip Memory  Includes 68,857,856 total RAM bits to support buffering, packet processing, and on-chip data storage.
• I/O Connectivity  342 I/O pins enable broad external interface support for high-bandwidth and multi-protocol designs.
• Process and Architecture  Built on a 20 nm mid-range FPGA architecture focused on balancing performance and power efficiency.
• Transceiver and Timing Resources  Includes advanced clock networks, PLLs, and transceiver features as described in Arria 10 device documentation for high-speed serial interfaces.
• Package & Mounting  1517-BBGA / 1517-FCBGA (40×40) package; surface-mount mounting for PCB integration.
• Power & Supply  Core voltage supply range 0.870 V to 0.930 V to match system power domains.
• Operating Range  Industrial temperature rating from −40 °C to 100 °C for extended-environment deployment.
• Compliance  RoHS compliant.

Typical Applications

• Wireless Infrastructure  Channel and switch cards in remote radio heads and mobile backhaul systems that require programmable logic and high I/O density.
• Wireline Networking  40G/100G muxponders, transponders, and line cards for aggregation and bridging functions.
• Broadcast and Media  Studio switches, video processing, and transport systems that benefit from on-chip memory and flexible I/O.
• Computing & Storage  Server acceleration, flash cache, and cloud computing infrastructure tasks that use FPGA offload and custom logic.
• Medical & Defense Systems  Diagnostic imaging, radar, and electronic warfare applications that require high logic density and temperature resilience.

Unique Advantages

• High Logic Capacity: 1,150,000 logic elements enable complex algorithms and large-scale integration within a single device, reducing board-level complexity.
• Large On‑Chip Memory: 68,857,856 RAM bits support deep buffering, packet processing, and in-hardware data manipulation without external memory for many functions.
• Broad I/O Count: 342 I/O pins provide flexibility for multi-channel interfaces, parallel buses, and mixed-signal front-ends.
• Industrial Temperature Operation: Rated for −40 °C to 100 °C to support deployments in extended-environment and industrial systems.
• Power-Efficient 20 nm Architecture: Arria 10 family design balances performance with power savings for energy-conscious designs.
• Standard Surface-Mount FCBGA Package: 1517-FCBGA (40×40) simplifies PCB layout and supports dense board-level integration.

Why Choose 10AX115R3F40I2SGE2?

The 10AX115R3F40I2SGE2 positions itself as a high-capacity, power-aware FPGA option within the Intel Arria 10 family. With 1,150,000 logic elements, substantial on-chip RAM, and 342 I/Os in a 1517-FCBGA package, it is suitable for mid-range applications that require significant programmable resources and robust I/O connectivity.

Designers building wireless infrastructure, high-speed networking, broadcast processing, server acceleration, or advanced medical and defense electronics can leverage this device’s balance of logic, memory, and operating range to deliver scalable, reliable solutions while aligning with Arria 10 device documentation and ecosystem resources.

Request a quote or submit a procurement inquiry to get pricing and availability information for the 10AX115R3F40I2SGE2 Arria 10 GX FPGA.