10AX115R2F40I2SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,070 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R2F40I2SGES – Arria 10 GX Field Programmable Gate Array (FPGA)
The 10AX115R2F40I2SGES is an Intel Arria 10 GX FPGA built on a 20 nm mid-range architecture that balances high performance with power efficiency. It targets high-performance, power-sensitive midrange applications across wireless, wireline, broadcast, computing, medical, and defense markets.
This device combines large programmable logic capacity and embedded memory with advanced I/O and transceiver capabilities, providing a platform for complex signal processing, packet processing, and accelerator functions where integration and thermal/mechanical surface-mount packaging matter.
Key Features
- Logic Capacity 1,150,000 logic elements for implementing large-scale custom logic, algorithms, and parallel datapaths.
- Embedded Memory 68,857,856 total RAM bits to support on-chip buffering, frame storage, and scratch memory for high-throughput designs.
- I/O 342 user I/O pins to interface with external peripherals, memory interfaces, and high-speed serial links.
- Transceiver and Hard IP Support Arria 10 family features in the device series include PCIe Gen1/2/3 hard IP, low-power serial transceivers, and support for 10 Gbps Ethernet and Interlaken as documented for the family.
- Process and Power 20 nm device family architecture delivering power-efficient operation; device supply voltage range is 870 mV to 980 mV.
- Packaging 1517-FCBGA (40 × 40) package case (1517-BBGA, FCBGA) for surface-mount PCB assembly and high pin-count routing.
- Industrial Temperature Grade Operating range from −40 °C to 100 °C for use in temperature-variable environments.
- Standards and Compliance RoHS compliant.
- Configuration and Reliability Features Arria 10 family documentation highlights features such as dynamic and partial reconfiguration, SEU detection and correction, clock networks and PLLs, and power management options for system reliability and flexible deployment.
Typical Applications
- Wireless Infrastructure Channel and switch cards, remote radio head processing, and mobile backhaul applications that require high logic density and on-chip memory for signal processing and protocol handling.
- Wireline Networking 40G/100G muxponders, transponders, and line cards where large FPGA fabrics, embedded memory, and hard IP for serial protocols accelerate packet and transport functions.
- Compute and Storage Acceleration Cloud server accelerators and flash cache controllers that use the device’s logic density and memory to offload compute-intensive or latency-sensitive tasks.
- Defense and Radar Systems Signal processing and electronic warfare functions that benefit from the device’s programmable resources, industrial temperature range, and high-speed I/O.
Unique Advantages
- High logic density: 1,150,000 logic elements enable complex, parallel implementations and large custom accelerators on a single device.
- Substantial on-chip memory: Nearly 69 Mbit of embedded RAM reduces external memory dependency and supports large frame buffers and state storage.
- Extensive I/O and package: 342 I/O in a 1517-FCBGA package supports dense board-level integration and multiple high-speed interfaces.
- Power-efficient 20 nm architecture: Family-level design emphasizes performance per watt, with a device supply range of 870 mV–980 mV to support power-managed systems.
- Industrial temperature range: −40 °C to 100 °C operation suits deployments with wide thermal excursions.
- Arria 10 family ecosystem: Backed by Intel Arria 10 device documentation and development resources for configuration, IP, and system integration guidance.
Why Choose 10AX115R2F40I2SGES?
The 10AX115R2F40I2SGES positions itself as a high-capacity, power-conscious FPGA solution for midrange applications that demand large programmable logic, significant embedded memory, and robust I/O in a surface-mount FCBGA package. Its combination of 1,150,000 logic elements, 68,857,856 RAM bits, and family-level support for advanced transceivers and hard IP makes it suitable for complex signal-processing, networking, and acceleration tasks.
Designers and procurement teams looking for a scalable FPGA platform with industrial temperature capability and a broad set of documented Arria 10 features will find this device appropriate for applications that require integration, configurability, and access to Intel Arria 10 development resources.
If you would like pricing, availability, or a quote for 10AX115R2F40I2SGES, submit an inquiry or request a quote through your preferred procurement channel.

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