10AX115R2F40I2SG

IC FPGA 342 I/O 1517FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 110 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R2F40I2SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1,150,000 logic elements, 1517‑FCBGA

The 10AX115R2F40I2SG is an Intel Arria 10 GX family FPGA targeted at high‑performance, power‑sensitive midrange applications. It delivers a high logic density architecture with embedded memory and extensive I/O to support demanding communications, computing, and video system designs.

Designed for industrial environments, this surface‑mount FCBGA device combines up to 1,150,000 logic elements, 68,857,856 bits of embedded RAM, and 342 I/O pins while operating over a wide voltage and temperature range to meet robust system requirements.

Key Features

  • High Logic Density  Up to 1,150,000 logic elements provide the capacity for complex custom logic, parallel processing pipelines, and large FPGA fabric implementations.
  • Large Embedded Memory  68,857,856 total RAM bits for on‑chip buffering, packet/stream processing, and data‑intensive algorithm implementation.
  • Extensive I/O  342 available I/O pins to support broad interfacing needs, external memory controllers, and multi‑lane high‑speed I/O topologies.
  • Industrial Grade Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial and rugged deployments requiring extended ambient tolerance.
  • Power Supply Range  Core voltage operation between 870 mV and 980 mV to match system power rails and support power planning for energy‑sensitive designs.
  • Package and Mounting  1517‑FCBGA (1517‑BBGA) package in a 40 × 40 format; surface‑mount construction for standard PCB assembly workflows.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.
  • Arria 10 Family Capabilities  Part of the Arria 10 device family documented for features such as adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, and advanced clocking (as referenced in the device overview).

Typical Applications

  • Wireless Infrastructure  Channel processing, aggregation, and backhaul functions where high logic density and embedded RAM support complex PHY and MAC processing.
  • Wireline Networking  Line cards, muxponder and transponder functions for 40G/100G systems that need substantial on‑chip logic and I/O resources.
  • Broadcast and Professional Video  High‑performance switching, transport, and imaging pipelines that leverage large embedded memory and abundant I/O.
  • Computing and Storage  Server acceleration tasks and flash cache controllers that benefit from dense logic and on‑chip RAM for low‑latency processing.

Unique Advantages

  • Scale for Midrange to Complex Designs: 1,150,000 logic elements enable implementation of large, multi‑function FPGA designs without external logic expansion.
  • On‑Chip Memory Capacity: Nearly 69Mbits of embedded RAM reduces dependency on external memory for buffering and state storage, simplifying board design.
  • Broad System I/O: 342 I/O pins provide flexibility for diverse interfaces and parallel data paths, reducing the need for additional I/O expander components.
  • Industrial Robustness: −40 °C to 100 °C operating range and surface‑mount FCBGA packaging support deployment in industrial and ruggedized equipment.
  • Power Planning Flexibility: Specified core voltage range (870 mV–980 mV) assists in precise power budgeting for power‑sensitive applications.
  • Standards‑Aware Manufacturing: RoHS compliance aligns with environmental requirements for commercial and industrial electronics.

Why Choose 10AX115R2F40I2SG?

The 10AX115R2F40I2SG positions itself as a high‑density Arria 10 GX FPGA option for designers who need substantial on‑chip logic and memory combined with broad I/O and industrial‑grade operating limits. Its specification set is tailored to midrange applications in networking, wireless, broadcast, and compute acceleration where integration and predictable environmental performance matter.

Choosing this device provides design teams with the capacity to consolidate functionality on a single FPGA, reduce external BOM complexity, and leverage the Arria 10 device family documentation and device capabilities for implementation and system integration.

Request a quote or submit an inquiry to receive pricing, availability, and support information for the 10AX115R2F40I2SG.

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