10AX115R2F40I2SG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 110 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R2F40I2SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1,150,000 logic elements, 1517‑FCBGA
The 10AX115R2F40I2SG is an Intel Arria 10 GX family FPGA targeted at high‑performance, power‑sensitive midrange applications. It delivers a high logic density architecture with embedded memory and extensive I/O to support demanding communications, computing, and video system designs.
Designed for industrial environments, this surface‑mount FCBGA device combines up to 1,150,000 logic elements, 68,857,856 bits of embedded RAM, and 342 I/O pins while operating over a wide voltage and temperature range to meet robust system requirements.
Key Features
- High Logic Density Up to 1,150,000 logic elements provide the capacity for complex custom logic, parallel processing pipelines, and large FPGA fabric implementations.
- Large Embedded Memory 68,857,856 total RAM bits for on‑chip buffering, packet/stream processing, and data‑intensive algorithm implementation.
- Extensive I/O 342 available I/O pins to support broad interfacing needs, external memory controllers, and multi‑lane high‑speed I/O topologies.
- Industrial Grade Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial and rugged deployments requiring extended ambient tolerance.
- Power Supply Range Core voltage operation between 870 mV and 980 mV to match system power rails and support power planning for energy‑sensitive designs.
- Package and Mounting 1517‑FCBGA (1517‑BBGA) package in a 40 × 40 format; surface‑mount construction for standard PCB assembly workflows.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
- Arria 10 Family Capabilities Part of the Arria 10 device family documented for features such as adaptive logic modules, variable‑precision DSP blocks, embedded memory blocks, and advanced clocking (as referenced in the device overview).
Typical Applications
- Wireless Infrastructure Channel processing, aggregation, and backhaul functions where high logic density and embedded RAM support complex PHY and MAC processing.
- Wireline Networking Line cards, muxponder and transponder functions for 40G/100G systems that need substantial on‑chip logic and I/O resources.
- Broadcast and Professional Video High‑performance switching, transport, and imaging pipelines that leverage large embedded memory and abundant I/O.
- Computing and Storage Server acceleration tasks and flash cache controllers that benefit from dense logic and on‑chip RAM for low‑latency processing.
Unique Advantages
- Scale for Midrange to Complex Designs: 1,150,000 logic elements enable implementation of large, multi‑function FPGA designs without external logic expansion.
- On‑Chip Memory Capacity: Nearly 69Mbits of embedded RAM reduces dependency on external memory for buffering and state storage, simplifying board design.
- Broad System I/O: 342 I/O pins provide flexibility for diverse interfaces and parallel data paths, reducing the need for additional I/O expander components.
- Industrial Robustness: −40 °C to 100 °C operating range and surface‑mount FCBGA packaging support deployment in industrial and ruggedized equipment.
- Power Planning Flexibility: Specified core voltage range (870 mV–980 mV) assists in precise power budgeting for power‑sensitive applications.
- Standards‑Aware Manufacturing: RoHS compliance aligns with environmental requirements for commercial and industrial electronics.
Why Choose 10AX115R2F40I2SG?
The 10AX115R2F40I2SG positions itself as a high‑density Arria 10 GX FPGA option for designers who need substantial on‑chip logic and memory combined with broad I/O and industrial‑grade operating limits. Its specification set is tailored to midrange applications in networking, wireless, broadcast, and compute acceleration where integration and predictable environmental performance matter.
Choosing this device provides design teams with the capacity to consolidate functionality on a single FPGA, reduce external BOM complexity, and leverage the Arria 10 device family documentation and device capabilities for implementation and system integration.
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