10AX115R4F40I3SGE2
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 277 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R4F40I3SGE2 – Arria 10 GX FPGA, 1,150,000 logic elements, 1517-FCBGA (40×40)
The 10AX115R4F40I3SGE2 is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) package designed for mid-range, high-performance and power-sensitive applications. As part of the Arria 10 device family, it brings a combination of high logic density, substantial embedded RAM, and a broad set of device-family features for wireless, wireline, broadcast, computing, storage, medical, and military applications listed in the series documentation.
Key Features
- Core Logic 1,150,000 logic elements provide high-density programmable logic for complex mid-range designs.
- Embedded Memory 68,857,856 total RAM bits for on-chip data buffering, packet processing, and algorithm storage.
- I/O Capacity 342 I/O pins support diverse interfacing and board-level connectivity requirements.
- Power Supported core voltage supply range of 870 mV to 930 mV for the device core.
- Package & Mounting 1517-BBGA / 1517-FCBGA (40×40) surface-mount package suitable for compact board integration.
- Operating Range Industrial-grade operating temperature range from −40 °C to 100 °C.
- Device-Family Capabilities Series-level features documented for the Arria 10 family include adaptive logic modules, variable-precision DSP blocks, embedded memory block types and configurations, clock networks and PLL sources, fractional synthesis and I/O PLLs, and support for dynamic and partial reconfiguration.
- High-Speed Interfaces & Hard IP The Arria 10 family description includes PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers and transceiver channel features.
- Environmental Compliance RoHS-compliant manufacturing status.
Typical Applications
- Wireless infrastructure Channel and switch cards in remote radio heads and mobile backhaul designs leveraging the device family’s performance and I/O capacity.
- Wireline networking 40G/100G muxponders, transponders, and line cards that benefit from embedded memory and high-speed interface hard IP.
- Broadcast and professional AV Studio switches, video transport and videoconferencing equipment that require large on-chip RAM and flexible I/O.
- Computing and storage Server acceleration, flash cache, and cloud infrastructure modules making use of the device’s logic density and DSP capabilities.
- Medical and defense systems Diagnostic imaging, radar, and electronic warfare where industrial temperature range and robust logic resources are required.
Unique Advantages
- High logic density: 1,150,000 logic elements allow consolidation of complex functions into a single FPGA.
- Large on-chip RAM: 68,857,856 total RAM bits reduce external memory dependence for many buffering and processing tasks.
- Extensive I/O: 342 I/O pins support diverse interface requirements without excessive external multiplexing.
- Series-level high-speed IP: Arria 10 family documentation includes PCIe Gen1/2/3 hard IP and Ethernet/Interlaken PCS options to simplify high-speed link integration.
- Industrial-grade operation: Specified for −40 °C to 100 °C, enabling deployment in demanding thermal environments.
- Compact FCBGA package: 1517-FCBGA (40×40) surface-mount package supports high-density board designs.
Why Choose 10AX115R4F40I3SGE2?
The 10AX115R4F40I3SGE2 delivers a balance of high logic capacity, substantial embedded RAM, and a comprehensive set of device-family features from the Arria 10 lineup. It is positioned for engineers and system designers building mid-range, performance- and power-sensitive applications that require integrated DSP, memory, and high-speed interface capabilities within an industrial temperature envelope.
Choosing this Arria 10 GX device supports scalable designs that leverage series-level IP and architectural features, helping reduce board complexity while addressing the I/O and processing demands of wireless, wireline, broadcast, compute, medical, and defense applications.
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