10AX115R4F40I3SGE2

IC FPGA 342 I/O 1517FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA

Quantity 277 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Device Package1517-FCBGA (40x40)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1517-BBGA, FCBGANumber of I/O342Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115R4F40I3SGE2 – Arria 10 GX FPGA, 1,150,000 logic elements, 1517-FCBGA (40×40)

The 10AX115R4F40I3SGE2 is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-FCBGA (40×40) package designed for mid-range, high-performance and power-sensitive applications. As part of the Arria 10 device family, it brings a combination of high logic density, substantial embedded RAM, and a broad set of device-family features for wireless, wireline, broadcast, computing, storage, medical, and military applications listed in the series documentation.

Key Features

  • Core Logic  1,150,000 logic elements provide high-density programmable logic for complex mid-range designs.
  • Embedded Memory  68,857,856 total RAM bits for on-chip data buffering, packet processing, and algorithm storage.
  • I/O Capacity  342 I/O pins support diverse interfacing and board-level connectivity requirements.
  • Power  Supported core voltage supply range of 870 mV to 930 mV for the device core.
  • Package & Mounting  1517-BBGA / 1517-FCBGA (40×40) surface-mount package suitable for compact board integration.
  • Operating Range  Industrial-grade operating temperature range from −40 °C to 100 °C.
  • Device-Family Capabilities  Series-level features documented for the Arria 10 family include adaptive logic modules, variable-precision DSP blocks, embedded memory block types and configurations, clock networks and PLL sources, fractional synthesis and I/O PLLs, and support for dynamic and partial reconfiguration.
  • High-Speed Interfaces & Hard IP  The Arria 10 family description includes PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers and transceiver channel features.
  • Environmental Compliance  RoHS-compliant manufacturing status.

Typical Applications

  • Wireless infrastructure  Channel and switch cards in remote radio heads and mobile backhaul designs leveraging the device family’s performance and I/O capacity.
  • Wireline networking  40G/100G muxponders, transponders, and line cards that benefit from embedded memory and high-speed interface hard IP.
  • Broadcast and professional AV  Studio switches, video transport and videoconferencing equipment that require large on-chip RAM and flexible I/O.
  • Computing and storage  Server acceleration, flash cache, and cloud infrastructure modules making use of the device’s logic density and DSP capabilities.
  • Medical and defense systems  Diagnostic imaging, radar, and electronic warfare where industrial temperature range and robust logic resources are required.

Unique Advantages

  • High logic density: 1,150,000 logic elements allow consolidation of complex functions into a single FPGA.
  • Large on-chip RAM: 68,857,856 total RAM bits reduce external memory dependence for many buffering and processing tasks.
  • Extensive I/O: 342 I/O pins support diverse interface requirements without excessive external multiplexing.
  • Series-level high-speed IP: Arria 10 family documentation includes PCIe Gen1/2/3 hard IP and Ethernet/Interlaken PCS options to simplify high-speed link integration.
  • Industrial-grade operation: Specified for −40 °C to 100 °C, enabling deployment in demanding thermal environments.
  • Compact FCBGA package: 1517-FCBGA (40×40) surface-mount package supports high-density board designs.

Why Choose 10AX115R4F40I3SGE2?

The 10AX115R4F40I3SGE2 delivers a balance of high logic capacity, substantial embedded RAM, and a comprehensive set of device-family features from the Arria 10 lineup. It is positioned for engineers and system designers building mid-range, performance- and power-sensitive applications that require integrated DSP, memory, and high-speed interface capabilities within an industrial temperature envelope.

Choosing this Arria 10 GX device supports scalable designs that leverage series-level IP and architectural features, helping reduce board complexity while addressing the I/O and processing demands of wireless, wireline, broadcast, compute, medical, and defense applications.

Request a quote or submit an inquiry to receive pricing and availability for part number 10AX115R4F40I3SGE2.

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