10AX115R4F40I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 342 68857856 1150000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 825 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FCBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 342 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115R4F40I3LG – Arria 10 GX FPGA, 1,150,000 Logic Elements, 1517-FCBGA
The 10AX115R4F40I3LG is an Intel Arria 10 GX field-programmable gate array (FPGA) in a 1517-ball FCBGA package. It is a 20 nm mid-range FPGA family device that delivers higher performance and power efficiency for demanding, power-sensitive applications.
Built for markets such as wireless, wireline, broadcast, computing and storage, medical, and defense, this device combines high logic density, substantial on-chip memory, and advanced I/O options to support complex system designs.
Key Features
- Core Logic — 1,150,000 logic elements provide high design density for complex digital logic and custom acceleration functions.
- Embedded Memory — 68,857,856 total RAM bits of on-chip memory to support large buffers, caches, and data-path storage.
- I/O Capacity — 342 general-purpose I/O pins to accommodate extensive peripheral, memory, and high-speed interface requirements.
- Transceivers and Interfaces — Family-level features include low-power serial transceivers and hard IP such as PCIe Gen1/Gen2/Gen3 and enhanced PCS for 10 Gbps Ethernet and Interlaken (described in device overview).
- DSP and Processing Blocks — Variable-precision DSP blocks and adaptive logic modules for signal processing, algorithm acceleration, and arithmetic-intensive tasks (device family feature).
- Power and Configuration — Core voltage supply specified from 870 mV to 930 mV, with device-level power management and configuration options described in the Arria 10 device overview.
- Package and Mounting — 1517-FCBGA (40 × 40 mm) ball-grid package; surface-mount mounting for system board integration.
- Operating Range — Industrial-grade operating temperature from −40 °C to 100 °C.
- Family-Level System Features — Device overview describes clock networks and PLLs, external memory interface support, dynamic and partial reconfiguration, and system reliability features such as SEU detection and correction (family-level capabilities).
Typical Applications
- Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul equipment requiring high-density logic and flexible I/O.
- Wireline and transport — 40G/100G muxponders, transponders, and line cards where high-speed serial interfaces and packet processing are required.
- Broadcast and professional AV — Studio switches and video transport systems that benefit from on-chip memory and deterministic processing resources.
- Compute and storage — Server acceleration, flash cache, and cloud infrastructure designs needing programmable acceleration and large on-chip RAM.
- Medical and defense systems — Diagnostic imaging, radar, and secure communications that use high logic density and industrial operating temperature range.
Unique Advantages
- High logic density: 1,150,000 logic elements enable consolidation of complex subsystems into a single device, reducing board-level component count.
- Large on-chip RAM: Nearly 69 Mb of embedded RAM supports deep buffering and high-throughput data paths without relying solely on external memory.
- Extensive I/O and protocol support: 342 I/O pins combined with family-level hard IP for PCIe and high-speed Ethernet simplify integration of industry-standard interfaces.
- Industrial temperature range: Specified operation from −40 °C to 100 °C accommodates deployment in temperature-challenging environments.
- Power-aware design: Core supply range of 870 mV–930 mV and Arria 10 family power-management features support power-sensitive applications.
- System-level features: Family capabilities such as dynamic/partial reconfiguration, clocking architecture, and SEU detection/correction support advanced system reliability and runtime flexibility.
Why Choose 10AX115R4F40I3LG?
The 10AX115R4F40I3LG positions itself as a high-density, power-conscious FPGA option within the Intel Arria 10 GX family, combining 1,150,000 logic elements, substantial embedded RAM, and rich I/O resources in a 1517-FCBGA package. These characteristics make it suitable for mid-range systems that require a balance of performance, integration, and configurable hardware acceleration.
Designers targeting wireless infrastructure, high-speed networking, compute acceleration, or industrial and defense applications will find the device’s combination of logic capacity, memory, serial interfaces, and family-level system capabilities align with long-term product scalability and support needs.
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