10AX115S1F45I1SG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 945 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S1F45I1SG – Arria 10 GX Field Programmable Gate Array (FPGA), 1932-FCBGA (45×45)

The 10AX115S1F45I1SG is an Intel Arria 10 GX FPGA device built on a 20 nm architecture for mid-range, performance-sensitive applications. It combines a large logic fabric with substantial embedded memory, programmable DSP resources and on-chip system features to address demanding communications, compute and industrial applications.

Designed for systems requiring high logic density, extensive I/O and low-voltage operation, this device targets markets such as wireless infrastructure, wireline communications, broadcast, computing and storage, medical imaging and military systems where performance, power efficiency and integration matter.

Key Features

  • Logic Capacity  Provides 1,150,000 logic elements to implement complex programmable logic and control functions.
  • Embedded Memory  Includes 68,857,856 total RAM bits for large on-chip buffering and data storage.
  • I/O and Packaging  Offers 624 I/O pins in a 1932-BBGA / 1932-FCBGA (45×45) surface-mount package for dense board-level integration.
  • Voltage and Thermal  Operates from 870 mV to 980 mV and supports an industrial operating temperature range of -40°C to 100°C.
  • Core Architecture  Arria 10 family characteristics: 20 nm mid-range FPGA/SoC architecture delivering improved performance and power efficiency versus prior mid-range generations.
  • DSP and Memory Subsystems  Variable-precision DSP blocks and multiple embedded memory block types support flexible signal processing and data-path implementations.
  • High‑Speed Interfaces  Device family includes hard IP and features such as PCIe Gen1/Gen2/Gen3 support, enhanced PCS for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
  • System and Reliability Features  Supports dynamic and partial reconfiguration, SEU error detection and correction, PLL clock networks and power-management capabilities described in the device overview.

Typical Applications

  • Wireless Infrastructure  Implements channel and switch cards in remote radio heads and mobile backhaul equipment where programmable logic and DSP are required.
  • Wireline Communications  Used in 40G/100G muxponders, transponders and line cards for bridging and aggregation functions that need high-speed serial interfaces and hard IP.
  • Broadcast and Professional AV  Enables studio switching, transport and videoconferencing systems requiring large buffers and flexible I/O topology.
  • Computing and Storage  Accelerates server functions, flash cache and cloud compute tasks that benefit from programmable logic, embedded memory and high I/O density.

Unique Advantages

  • High Logic Density:  1,150,000 logic elements allow implementation of large, integrated designs on a single device, reducing board-level complexity.
  • Substantial On‑Chip Memory:  68,857,856 total RAM bits support deep buffering and data-path storage without immediate dependence on external memory.
  • Extensive I/O Connectivity:  624 I/O pins in a 1932-FCBGA package provide flexible interface options for dense systems and multiple peripherals.
  • Low‑Voltage Operation:  870 mV–980 mV core supply range supports low-power system designs and efficient power management strategies.
  • Industrial Temperature Range:  Rated for -40°C to 100°C to meet a range of demanding environmental conditions.
  • Integrated High‑Speed and System IP:  Includes PCIe hard IP, enhanced PCS for Interlaken and 10 Gbps Ethernet support, low-power serial transceivers, and DSP blocks to shorten development time for communication and compute designs.

Why Choose 10AX115S1F45I1SG?

The 10AX115S1F45I1SG positions itself as a high-capacity, power-conscious FPGA for mid-range systems that require significant logic, on-chip memory and extensive I/O. Its Arria 10 architecture delivers the performance and power-efficiency characteristics described for the device family, combined with system-level features such as PCIe hard IP, serial transceivers and DSP resources.

This device is suited to engineering teams building communications infrastructure, professional AV, compute acceleration and other embedded systems that need a scalable, feature-rich FPGA with industrial temperature support and a compact 1932-FCBGA package footprint.

Request a quote or submit a pricing and availability inquiry to discuss how the 10AX115S1F45I1SG fits your design and volume requirements.

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