10AX115S3F45I2SG

IC FPGA 624 I/O 1932FCBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 584 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S3F45I2SG – Arria 10 GX FPGA, 1932-FCBGA (45×45)

The 10AX115S3F45I2SG is an Arria 10 GX Field Programmable Gate Array (FPGA) IC built on Intel’s 20 nm mid-range FPGA architecture. It combines high logic density and embedded memory to address compute- and bandwidth-intensive designs that require configurable hardware acceleration and flexible I/O.

Designed for power-sensitive, mid-range applications across communications, broadcast, computing, medical and defense markets, this device delivers a balance of performance and efficiency with up to 1,150,000 logic elements, 68,857,856 total RAM bits, and 624 I/O pins in a 1932-FCBGA package.

Key Features

  • Core & Logic  Up to 1,150,000 logic elements provide high logic density for complex custom logic, protocol handling, and hardware acceleration tasks.
  • Embedded Memory  68,857,856 total RAM bits support large on-chip buffers, queues, and fast local storage for data-path and packet processing.
  • I/O and Interfaces  624 I/O pins enable extensive external connectivity for high-pin-count systems and multi-channel interfaces.
  • Transceiver and IP Features (Series)  Arria 10 series documentation includes low-power serial transceivers, PCIe Gen1/2/3 hard IP and enhanced PCS hard IP for common high-speed protocols, enabling integration of high-bandwidth links at the device-family level.
  • Clocking and Reconfiguration (Series)  Series-level features include flexible clock networks, PLL clock sources, and support for dynamic and partial reconfiguration to adapt hardware behavior at runtime.
  • Package & Mounting  Surface-mount 1932-FCBGA (45×45 mm) package for high-density board designs with robust leadframe and thermal characteristics.
  • Power  Core voltage range of 870 mV to 930 mV supports modern low-voltage power domains for power-efficient operation.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Wireless Infrastructure  Channel and switch card implementations and mobile backhaul designs can leverage the device’s high logic density and embedded memory for real-time signal processing and packet aggregation.
  • Wireline Networking  40G/100G muxponders, transponders and line cards benefit from the device-family’s high-speed serial interfaces and on-chip resources for protocol processing and traffic management.
  • Broadcast and Professional AV  Studio switches, video processing and transport applications use the large logic and memory capacity for multi-format video paths and buffering.
  • Compute and Storage Acceleration  Cloud and server acceleration tasks, including flash cache controllers and custom offloads, can use the plentiful logic and embedded RAM to implement hardware accelerators.

Unique Advantages

  • High logic density: 1,150,000 logic elements allow implementation of complex systems-on-fabric and multiple concurrent hardware functions.
  • Large on-chip memory: 68,857,856 RAM bits reduce external memory dependence and improve deterministic buffering and low-latency data paths.
  • Extensive I/O capacity: 624 I/O pins support broad interfacing options for multi-lane and multi-protocol systems.
  • Industrial temperature range: Rated for −40 °C to 100 °C to support deployment in temperature-challenging environments.
  • Compact high-density package: 1932-FCBGA (45×45) surface-mount package enables integration into space-constrained, high-performance boards.
  • Series-level system features: Arria 10 family capabilities such as advanced clocking, transceivers, and PCIe hard IP simplify integration of standard high-speed functions.

Why Choose 10AX115S3F45I2SG?

The 10AX115S3F45I2SG positions itself as a high-density, power-conscious FPGA option within the Arria 10 family. Its combination of 1,150,000 logic elements, substantial embedded memory, and wide I/O count makes it suitable for mid-range designs that require significant programmable logic, on-chip storage, and flexible interfacing.

For teams building communications, broadcast, compute-acceleration, or industrial systems, this device provides a scalable platform with series-level features for high-speed links and dynamic reconfiguration, all in an industrial-grade package designed for demanding environments.

Request a quote or submit a purchase inquiry to get availability, pricing, and lead-time information for the 10AX115S3F45I2SG. Our team can assist with technical requirements and volume needs.

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