10AX115S3F45I3SGES
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,226 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S3F45I3SGES – Arria 10 GX Field Programmable Gate Array (FPGA), 1932‑FCBGA (45×45)
The 10AX115S3F45I3SGES is an Intel Arria 10 GX FPGA in a 1932‑BBGA FCBGA surface‑mount package. Built on a 20‑nm architecture, this industrial‑grade device delivers a large programmable fabric and on‑chip memory for midrange, performance‑sensitive applications.
Typical use cases include wireless and wireline communications, broadcast and video processing, computing and storage acceleration, and other applications that benefit from high logic density, extensive I/O, and integrated system features.
Key Features
- Core Logic — 1,150,000 logic elements provide a large programmable fabric for complex digital designs and system integration.
- Embedded Memory — 68,857,856 total RAM bits of on‑chip memory to support buffering, packet processing, and large local data stores.
- I/O and Packaging — 624 I/O pins in a 1932‑BBGA FCBGA package (supplier package: 1932‑FCBGA, 45×45). Surface‑mount mounting type for high‑density board designs.
- Power and Operating Range — Core voltage supply range 870 mV to 930 mV and industrial operating temperature range −40 °C to 100 °C; RoHS compliant.
- High‑Speed Interfaces and Hard IP — Device family includes support for PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low‑power serial transceivers as described in the Arria 10 device overview.
- DSP and Logic Building Blocks — Adaptive logic modules and variable‑precision DSP blocks provide capability for signal processing and algorithm acceleration.
- Clocking and Configuration — Integrated clock networks, PLL clock sources, fractional synthesis and I/O PLLs, plus support for dynamic and partial reconfiguration and SEU error detection and correction as documented in the device overview.
Typical Applications
- Wireless Infrastructure — Channel and switch cards for remote radio heads and mobile backhaul using the device's logic density and high‑speed interfaces.
- Wireline Networking — 40G/100G muxponders, transponders and 100G line cards leveraging on‑chip memory and hard IP for packet and transport processing.
- Broadcast and Professional AV — Studio switches, video conferencing and transport systems that require flexible I/O and real‑time processing.
- Computing and Storage — Server acceleration, flash cache and cloud computing tasks that benefit from programmable logic and embedded memory.
- Medical and Imaging — Diagnostic imaging and scanner systems requiring high compute density and robust operation across industrial temperature ranges.
Unique Advantages
- High logic density: 1,150,000 logic elements enable consolidation of complex functions onto a single device, reducing board count and system complexity.
- Substantial on‑chip RAM: 68,857,856 total RAM bits support extensive buffering and local data storage to improve throughput and latency.
- Extensive I/O in a compact package: 624 I/O pins in a 1932‑FCBGA (45×45) package balance high connectivity with a compact PCB footprint.
- Industrial reliability: Specified for −40 °C to 100 °C operation and RoHS compliance for deployment in industrial environments.
- Integrated system IP: Included device family features such as PCIe hard IP, transceivers and DSP blocks simplify implementation of common high‑speed subsystems.
- Flexible clocking and configuration: Robust clock networks, PLL options and support for dynamic/partial reconfiguration enable adaptable designs and in‑field updates.
Why Choose 10AX115S3F45I3SGES?
The 10AX115S3F45I3SGES positions itself as a high‑density, industrial‑grade FPGA suitable for midrange applications that require significant programmable logic, abundant on‑chip memory, and extensive I/O. Its feature set—drawn from the Arria 10 GX device family—provides a balanced combination of performance, power efficiency, and system integration for communications, broadcast, computing, and imaging systems.
For designs that need scalability and support for high‑speed protocols alongside robust configuration and clocking capabilities, this Arria 10 GX device offers a platform that simplifies integration and supports complex system requirements backed by Intel’s Arria 10 device family documentation.
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