10AX115S4F45I3LG
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 364 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S4F45I3LG – Arria 10 GX FPGA, 1,150,000 logic elements, 624 I/O
The 10AX115S4F45I3LG is an Arria 10 GX Field Programmable Gate Array (FPGA) offered in a 1932-FCBGA (45×45) package and intended for industrial-grade applications. This device is part of the Arria 10 family of 20 nm mid-range FPGAs and SoCs, designed for high-performance, power-efficient implementations in communications, networking, compute acceleration and other demanding embedded systems.
With 1,150,000 logic elements, 68,857,856 total RAM bits and 624 user I/O, the device targets designs that require high logic density, large on-chip memory and extensive I/O while operating across a wide industrial temperature range.
Key Features
- Core Logic Density 1,150,000 logic elements to support complex, highly parallel digital designs and large FPGA-based systems.
- Embedded Memory 68,857,856 total RAM bits for on-chip buffering, caching and data-path storage to reduce external memory dependence.
- High I/O Count 624 user I/O pins to interface with multiple peripherals, memory subsystems and high-density board designs.
- Industrial Operating Range Rated for -40 °C to 100 °C to meet robust thermal requirements in industrial environments.
- Power Supply Supported core voltage range of 870 mV to 930 mV for the device core supply.
- Package & Mounting 1932-FCBGA (45×45) package in a surface-mount form factor suitable for compact, board-level integration.
- Family-Level Interfaces & IP Arria 10 family features include embedded memory blocks, variable-precision DSP blocks, fractional synthesis and I/O PLLs, PCIe Gen1/Gen2/Gen3 hard IP, enhanced PCS hard IP for Interlaken and 10 Gbps Ethernet, and low-power serial transceivers.
- Power Efficiency & Performance Part of a 20 nm device family described as high-performance and power-efficient, enabling balanced performance and thermal/power budgets.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Wireless Infrastructure Channel processing and switch/cards in remote radio heads and mobile backhaul where high logic density and embedded memory accelerate signal processing.
- Wireline Networking Line cards, muxponders and transponders (40G/100G) that require high-speed interfaces, PCIe connectivity and extensive I/O.
- Broadcast & Professional AV Studio switches, transport and videoconferencing equipment leveraging large on-chip RAM and DSP resources for media processing.
- Compute & Storage Acceleration Server acceleration, flash cache and cloud compute tasks using dense logic and memory to implement custom accelerators and data-paths.
- Medical & Defense Systems Diagnostic imaging, radar and secure communications that benefit from high logic capacity and industrial temperature operation.
Unique Advantages
- High Logic Capacity: 1,150,000 logic elements enable implementation of large, complex RTL designs without partitioning across multiple devices.
- Substantial On-Chip Memory: 68,857,856 RAM bits reduce external memory bandwidth needs and simplify memory hierarchy design.
- Extensive I/O Flexibility: 624 I/O pins support dense system interfaces and multiple simultaneous high-speed connections.
- Industrial Robustness: -40 °C to 100 °C operating range and surface-mount FCBGA packaging support deployment in thermally and mechanically demanding environments.
- Integrated High-Speed Interfaces: Family-level hard IP for PCIe Gen1/2/3, Interlaken and 10 Gbps Ethernet simplifies integration of common high-performance links.
- Power-Performance Balance: As a 20 nm Arria 10 device, it combines performance capability with power-efficiency characteristics useful for constrained power budgets.
Why Choose 10AX115S4F45I3LG?
The 10AX115S4F45I3LG Arria 10 GX FPGA combines large logic and memory resources with extensive I/O and family-provided high-speed interfaces to address mid-range applications that demand both performance and power efficiency. Its industrial temperature rating and compact 1932-FCBGA package make it suitable for robust embedded systems where board space and thermal considerations are critical.
This device is well suited for engineering teams developing communication systems, network infrastructure, compute accelerators and professional AV equipment who require a scalable, high-capacity FPGA platform with proven family-level IP and power-optimized silicon.
Request a quote or submit an inquiry for availability and pricing to get started with the 10AX115S4F45I3LG for your next design.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018