10AX115S4F45I3SGES

IC FPGA 624 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 1,127 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S4F45I3SGES – Arria 10 GX FPGA, 1,150,000 logic elements

The 10AX115S4F45I3SGES is an Intel Arria 10 GX Field Programmable Gate Array (FPGA) IC built on the Arria 10 device family architecture. It delivers a high-density, power-efficient FPGA fabric suitable for mid-range designs that require substantial logic capacity, embedded memory, and rich I/O.

Designed for applications across wireless, wireline, broadcast, computing and storage, and industrial markets, this device combines performance and power-efficiency with a broad set of family-level features including hard IP, serial transceivers, and SoC capabilities as described in Arria 10 device documentation.

Key Features

  • Core Logic
    1,150,000 logic elements provide capacity for complex digital processing, custom accelerators, and large FPGA designs.
  • Embedded Memory
    68,857,856 total RAM bits for on-chip buffering, frame buffering, and working storage for compute pipelines.
  • I/O and Interface Density
    624 general-purpose I/O pins support high pin-count designs and external device interfacing; Arria 10 family features include low-power serial transceivers and enhanced PCS hard IP.
  • Power Supply
    Operating core voltage range of 870 mV to 930 mV, aligning with the device’s power-optimized architecture.
  • Package & Mounting
    1932-BBGA (1932-FCBGA, 45×45) surface-mount package for high I/O density in compact board layouts.
  • Industrial Temperature & Grade
    Rated for industrial operation from –40°C to 100°C, suitable for temperature-variable environments.
  • System and Reliability Features
    Family-level capabilities documented for SEU error detection and correction, dynamic and partial reconfiguration, clock networks with PLL support, and power management.
  • Hard IP and SoC Integration
    Arria 10 device family documentation describes integrated hard IP blocks including PCIe Gen1/Gen2/Gen3 and options for SoC Hard Processor System integration.

Typical Applications

  • Wireless Infrastructure — Channel and switch cards in remote radio heads and mobile backhaul systems leveraging large logic and memory resources for signal processing.
  • High-Speed Networking — 40G/100G muxponders, transponders and 100G line cards using the device’s I/O capacity and family transceiver/PCS features.
  • Data Center & Server Acceleration — Flash cache, server acceleration and cloud computing server functions that benefit from programmable logic and embedded memory.
  • Broadcast and Professional AV — Studio switches, transport, and video processing where large on-chip memory and flexible I/O improve data handling and routing.
  • Medical & Industrial Systems — Diagnostic imaging and control systems that require industrial temperature operation and substantial logic/memory resources.

Unique Advantages

  • High Logic Capacity: 1,150,000 logic elements enable complex algorithms, multi-channel processing, and large-scale integration within a single device.
  • Substantial On-Chip Memory: 68,857,856 total RAM bits reduce dependency on external memory for buffering and intermediate data storage.
  • Broad I/O and Interface Support: 624 I/O pins combined with Arria 10 family serial transceivers and hard IP simplify high-bandwidth system design.
  • Industrial Temperature Range: –40°C to 100°C operation supports deployment in demanding environmental conditions.
  • Compact High-Density Package: 1932-FCBGA (45×45) surface-mount package delivers high I/O in a board-friendly footprint for space-constrained designs.
  • Power-Optimized Architecture: Documented family-level power-saving technologies and a defined core voltage range (870 mV–930 mV) help manage system power budgets.

Why Choose 10AX115S4F45I3SGES?

The 10AX115S4F45I3SGES positions itself as a high-capacity, power-aware FPGA option within the Intel Arria 10 family, targeting mid-range designs that need a balance of logic density, embedded memory, and extensive I/O. Its industrial temperature rating and compact 1932-FCBGA package make it suitable for applications that combine performance and environmental robustness.

Designers benefit from the Arria 10 family’s documented system features—hard IP blocks, transceivers, reconfiguration capabilities, and reliability mechanisms—providing a clear development path for complex systems in wireless, networking, broadcast, compute, and industrial markets.

Request a quote or submit an inquiry to check availability and pricing for the 10AX115S4F45I3SGES Arria 10 GX FPGA.

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