10AX115S4F45I3SGE2
| Part Description |
Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 481 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Discontinued |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 624 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 427200 | Number of Logic Elements/Cells | 1150000 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 68857856 |
Overview of 10AX115S4F45I3SGE2 – Arria 10 GX Field Programmable Gate Array (FPGA)
The 10AX115S4F45I3SGE2 is an Intel Arria 10 GX family FPGA — a 20 nm, high-performance, power-efficient mid-range programmable device. It combines large logic capacity, extensive embedded memory, and a high I/O count to address demanding processing and connectivity tasks across wireless, wireline, broadcast, computing, medical, and defense markets.
Designed for surface-mount deployment in a 1932-FCBGA (45×45) package, this industrial-grade device targets applications that require significant programmable logic, large on-chip RAM, and robust I/O interfacing within a controlled voltage and temperature envelope.
Key Features
- Core Logic 1,150,000 logic elements provide substantial programmable logic resources for complex digital designs and system-level integration.
- Embedded Memory 68,857,856 total RAM bits of on-chip memory support large buffering, caching, and high-throughput data paths.
- I/O Capacity 624 general-purpose I/O pins enable wide interfacing options for external peripherals, memory, and high-speed data lanes.
- Transceivers and Protocol IP Arria 10 GX devices include low-power serial transceivers and dedicated hard IP such as PCIe Gen1/2/3 and enhanced PCS for interfaces like 10 Gbps Ethernet and Interlaken, as detailed in the device overview.
- Clocking and PLLs Comprehensive clock networks with fractional synthesis and I/O PLLs support flexible timing architectures and multiple clock domains.
- Power and Process 20 nm process technology combined with integrated power-saving features and a documented operating voltage range of 870 mV to 930 mV for core supply.
- Package & Mounting Surface-mount 1932-BBGA FCBGA package (45×45 mm) suitable for high-density board designs.
- Operating Range & Grade Industrial-grade device rated for operation from −40 °C to 100 °C.
Typical Applications
- Wireless infrastructure Channel processing and aggregation functions in remote radio heads and mobile backhaul equipment leveraging large logic and memory resources.
- Wireline networking Line cards, muxponders, and transponders for 40G/100G systems that require programmable protocol handling and high-speed I/O.
- Broadcast and media Studio switching, video transport, and conferencing systems benefiting from large on-chip RAM and flexible transceiver support.
- Computing and storage Server acceleration, flash cache, and cloud computing tasks that use dense logic and embedded memory for data-path acceleration.
- Medical and defense systems Diagnostic imaging, radar, and secure communications where high logic capacity and industrial temperature operation are required.
Unique Advantages
- High logic capacity: 1,150,000 logic elements enable integration of complex, system-level functions onto a single device, reducing external component count.
- Large on-chip memory: 68,857,856 RAM bits support deep buffering and high-throughput data processing without immediate reliance on external memory.
- Extensive I/O: 624 I/Os give designers flexibility to connect multiple peripherals, interfaces, and memory subsystems directly to the FPGA fabric.
- Built-in protocol IP and transceiver support: Hard IP for PCIe Gen1/2/3 and enhanced PCS options simplify implementation of common high-speed interfaces.
- Robust industrial operation: Rated for −40 °C to 100 °C and supplied in a 1932-FCBGA surface-mount package for deployment in industrial environments.
- Power-conscious 20 nm design: Core supply range of 870–930 mV and integrated power-saving features support power-sensitive applications.
Why Choose 10AX115S4F45I3SGE2?
The 10AX115S4F45I3SGE2 positions itself as a high-capacity, mid-range FPGA offering a combination of large programmable logic, substantial embedded memory, and a high I/O count—all delivered in a 20 nm Arria 10 GX device architecture. This balance of resources is well suited for designs that require significant on-chip computation, flexible I/O, and established interface IP.
Backed by Intel Arria 10 device documentation and development resources, the device is appropriate for engineering teams building scalable, performance-focused systems across networking, broadcast, computing, medical, and defense applications that operate within the specified voltage and industrial temperature ranges.
Request a quote or submit an inquiry to purchase the 10AX115S4F45I3SGE2 and discuss availability and lead times for your design needs.

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