10AX115S4F45I3SGE2

IC FPGA 624 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 481 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S4F45I3SGE2 – Arria 10 GX Field Programmable Gate Array (FPGA)

The 10AX115S4F45I3SGE2 is an Intel Arria 10 GX family FPGA — a 20 nm, high-performance, power-efficient mid-range programmable device. It combines large logic capacity, extensive embedded memory, and a high I/O count to address demanding processing and connectivity tasks across wireless, wireline, broadcast, computing, medical, and defense markets.

Designed for surface-mount deployment in a 1932-FCBGA (45×45) package, this industrial-grade device targets applications that require significant programmable logic, large on-chip RAM, and robust I/O interfacing within a controlled voltage and temperature envelope.

Key Features

  • Core Logic  1,150,000 logic elements provide substantial programmable logic resources for complex digital designs and system-level integration.
  • Embedded Memory  68,857,856 total RAM bits of on-chip memory support large buffering, caching, and high-throughput data paths.
  • I/O Capacity  624 general-purpose I/O pins enable wide interfacing options for external peripherals, memory, and high-speed data lanes.
  • Transceivers and Protocol IP  Arria 10 GX devices include low-power serial transceivers and dedicated hard IP such as PCIe Gen1/2/3 and enhanced PCS for interfaces like 10 Gbps Ethernet and Interlaken, as detailed in the device overview.
  • Clocking and PLLs  Comprehensive clock networks with fractional synthesis and I/O PLLs support flexible timing architectures and multiple clock domains.
  • Power and Process  20 nm process technology combined with integrated power-saving features and a documented operating voltage range of 870 mV to 930 mV for core supply.
  • Package & Mounting  Surface-mount 1932-BBGA FCBGA package (45×45 mm) suitable for high-density board designs.
  • Operating Range & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C.

Typical Applications

  • Wireless infrastructure  Channel processing and aggregation functions in remote radio heads and mobile backhaul equipment leveraging large logic and memory resources.
  • Wireline networking  Line cards, muxponders, and transponders for 40G/100G systems that require programmable protocol handling and high-speed I/O.
  • Broadcast and media  Studio switching, video transport, and conferencing systems benefiting from large on-chip RAM and flexible transceiver support.
  • Computing and storage  Server acceleration, flash cache, and cloud computing tasks that use dense logic and embedded memory for data-path acceleration.
  • Medical and defense systems  Diagnostic imaging, radar, and secure communications where high logic capacity and industrial temperature operation are required.

Unique Advantages

  • High logic capacity: 1,150,000 logic elements enable integration of complex, system-level functions onto a single device, reducing external component count.
  • Large on-chip memory: 68,857,856 RAM bits support deep buffering and high-throughput data processing without immediate reliance on external memory.
  • Extensive I/O: 624 I/Os give designers flexibility to connect multiple peripherals, interfaces, and memory subsystems directly to the FPGA fabric.
  • Built-in protocol IP and transceiver support: Hard IP for PCIe Gen1/2/3 and enhanced PCS options simplify implementation of common high-speed interfaces.
  • Robust industrial operation: Rated for −40 °C to 100 °C and supplied in a 1932-FCBGA surface-mount package for deployment in industrial environments.
  • Power-conscious 20 nm design: Core supply range of 870–930 mV and integrated power-saving features support power-sensitive applications.

Why Choose 10AX115S4F45I3SGE2?

The 10AX115S4F45I3SGE2 positions itself as a high-capacity, mid-range FPGA offering a combination of large programmable logic, substantial embedded memory, and a high I/O count—all delivered in a 20 nm Arria 10 GX device architecture. This balance of resources is well suited for designs that require significant on-chip computation, flexible I/O, and established interface IP.

Backed by Intel Arria 10 device documentation and development resources, the device is appropriate for engineering teams building scalable, performance-focused systems across networking, broadcast, computing, medical, and defense applications that operate within the specified voltage and industrial temperature ranges.

Request a quote or submit an inquiry to purchase the 10AX115S4F45I3SGE2 and discuss availability and lead times for your design needs.

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