10AX115S3F45I2SGE2

IC FPGA 624 I/O 1932FBGA
Part Description

Arria 10 GX Field Programmable Gate Array (FPGA) IC 624 68857856 1150000 1932-BBGA, FCBGA

Quantity 682 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusDiscontinued
Manufacturer Standard Lead Time9 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O624Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs427200Number of Logic Elements/Cells1150000
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits68857856

Overview of 10AX115S3F45I2SGE2 – Arria 10 GX FPGA, 1932‑FCBGA

The 10AX115S3F45I2SGE2 is an Intel Arria 10 GX field-programmable gate array (FPGA) delivered in a 1932‑FCBGA (45×45) surface-mount package. It combines a high logic capacity FPGA fabric with on‑chip embedded memory and transceiver and hard-IP capabilities targeted at midrange, performance‑sensitive applications.

Typical market segments for the Arria 10 device family include wireless, wireline, broadcast, computing and storage, medical, and military applications where a combination of performance, integration, and industrial-grade operating range is required.

Key Features

  • Logic Capacity — 1,150,000 logic element cells enabling complex digital designs and high-density implementation.
  • Embedded Memory — 68,857,856 total RAM bits for on‑chip buffering, packet processing, and application state storage.
  • I/O Resources — 624 I/O pins to support broad external interfacing and high pin-count connectivity.
  • Transceivers and Hard IP — Device family documentation highlights low-power serial transceivers and hard IP blocks for PCIe Gen1/2/3 and advanced serial protocols; refer to device documentation for implementation details.
  • Clocking and PLLs — Comprehensive clock networks with PLL clock sources and fractional synthesis options are part of the device family architecture.
  • Reconfiguration — Device family supports dynamic and partial reconfiguration capabilities for runtime flexibility and incremental design updates.
  • Power and Voltage — Core voltage supply range specified at 870 mV to 930 mV, enabling power-optimized operation within the documented range.
  • Package and Mounting — 1932‑BGA FCBGA package (45×45) in a surface-mount form factor suitable for high-density board designs.
  • Operating Temperature — Industrial-grade operating range from -40 °C to 100 °C for deployment in rugged environments.
  • Standards and Design Resources — The Arria 10 device family includes documentation covering embedded memory types, interface options, transceiver PMA/PCS features, and device errata and design recommendations.

Typical Applications

  • Wireless infrastructure — Channel and switch cards in remote radio heads and mobile backhaul where high logic density and transceiver integration are required.
  • Wireline networking — Line cards, muxponders, and transponders that benefit from on‑chip memory and hard IP for high-speed serial protocols.
  • Broadcast and media — Studio switches and professional audio/video processing leveraging large on‑chip RAM and abundant I/O.
  • Computing and storage — Server acceleration and flash cache offload that use dense logic fabric and embedded memory for data‑path processing.
  • Medical and defense systems — Diagnostic imaging, radar, and secure communications benefiting from the device’s performance and industrial temperature rating.

Unique Advantages

  • High logic density: 1,150,000 logic element cells provide headroom for large, integrated designs and parallel processing tasks.
  • Substantial on‑chip memory: Nearly 69 million RAM bits reduce external memory dependence and improve deterministic buffering and packet handling.
  • Robust I/O count: 624 I/Os enable extensive external interfacing without immediate need for expansion devices, simplifying board-level design.
  • Industrial thermal range: Rated for -40 °C to 100 °C operation to meet rugged deployment requirements.
  • Power-configurable core: Operation within a defined 870–930 mV core voltage window supports power-optimized system designs.
  • Packaged for high-density boards: 1932‑FCBGA (45×45) package provides a compact footprint for high-pin-count FPGA implementations.

Why Choose 10AX115S3F45I2SGE2?

The 10AX115S3F45I2SGE2 Arria 10 GX FPGA balances significant logic and memory resources with a large I/O complement and industrial operating range. It is positioned for midrange, performance‑sensitive systems that require substantial on‑chip capacity and flexible interface options.

This part is suited to teams designing network, wireless, compute acceleration, broadcast, medical, or defense equipment that must combine integration density with the documented device family features such as reconfiguration capabilities, clocking resources, and serial/transceiver options. The Arria 10 device family documentation provides further implementation guidance and hard-IP details to support design and system integration.

Request a quote or submit an inquiry to obtain pricing and availability for the 10AX115S3F45I2SGE2 Arria 10 GX FPGA and to discuss how it fits your next design project.

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