5AGXBB1D4F35C4NAA
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 17358848 300000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 982 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 14151 | Number of Logic Elements/Cells | 300000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | 0000.00.0000 | ||
| Qualification | N/A | Total RAM Bits | 17358848 |
Overview of 5AGXBB1D4F35C4NAA – Arria V GX FPGA, 300,000 logic elements, 544 I/Os
The 5AGXBB1D4F35C4NAA is an Arria V GX field-programmable gate array (FPGA) IC from Intel, supplied in a 1152-BBGA FCBGA package (35×35 mm). It combines high logic density, substantial embedded memory, and a large I/O count for complex, programmable digital designs.
With 300,000 logic elements and approximately 17.36 Mbits of on-chip RAM, this commercial-grade device is designed for applications that require high-density programmable logic, extensive I/O connectivity (544 I/Os), and compact surface-mount packaging while operating within a 1.07–1.13 V core supply window and a 0 °C to 85 °C temperature range.
Key Features
- High Logic Density Approximately 300,000 logic elements providing substantial resources for complex programmable logic implementations and system-level integration.
- Logic Block Count Designed with 14,151 logic blocks to structure and distribute logic resources efficiently across the device.
- Embedded Memory Total on-chip RAM of 17,358,848 bits (approximately 17.36 Mbits) to support large buffering, lookup tables, and state storage without external memory for many designs.
- Extensive I/O 544 I/O pins to support broad peripheral interfacing, multi-channel data paths, and dense connector routing.
- Packaging & Mounting 1152-BBGA (FCBGA) surface-mount package, supplier package listed as 1152-FBGA, FC (35×35), enabling compact board integration.
- Power and Operating Conditions Core voltage range of 1.07 V to 1.13 V and commercial operating temperature range of 0 °C to 85 °C to match standard commercial designs.
- Compliance RoHS compliant, simplifying regulatory considerations for commercial product assembly.
Unique Advantages
- High-capacity programmable fabric: Large logic element count enables integration of complex algorithms and multiple hardware functions on a single device, reducing system BOM.
- Substantial embedded RAM: Approximately 17.36 Mbits of on-chip memory lowers dependence on external memory for many buffering and storage tasks, simplifying board design and timing.
- Wide I/O bandwidth: 544 I/Os support extensive peripheral connectivity and multi-channel interfaces, accommodating dense signal routing requirements.
- Compact, production-ready package: 1152-BBGA FCBGA (35×35) surface-mount package provides a small footprint for space-constrained PCBs while maintaining high pin count.
- Commercial-grade operating range: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial product deployments.
Why Choose 5AGXBB1D4F35C4NAA?
The 5AGXBB1D4F35C4NAA Arria V GX FPGA delivers a high-density, commercially rated programmable solution with a balance of logic capacity, embedded memory, and broad I/O for complex digital systems. Its 1152-BBGA surface-mount package and defined voltage and temperature ranges make it suitable for compact, production-oriented designs that require reliable, programmable hardware resources.
This device is a fit for engineering teams seeking a single-chip, high-resource FPGA solution to consolidate functions, reduce external componentry, and maintain a streamlined board layout while adhering to commercial environmental and power limits.
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