5AGXFB7H4F35C4G
| Part Description |
Arria V GX Field Programmable Gate Array (FPGA) IC 544 2975744 504140 1152-BBGA, FCBGA |
|---|---|
| Quantity | 272 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA, FC (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 23786 | Number of Logic Elements/Cells | 504140 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 2975744 |
Overview of 5AGXFB7H4F35C4G – Arria V GX Field Programmable Gate Array (FPGA) IC, 504,140 Logic Elements, 544 I/O
The 5AGXFB7H4F35C4G is an Intel Arria V GX FPGA in a 1152-ball FCBGA package, offered in a commercial grade. It provides a high-capacity programmable fabric with 504,140 logic elements and approximately 2.98 Mbits of embedded memory, paired with 544 general-purpose I/O pins for dense system integration.
This device targets designs that require large logic capacity and dense I/O in a surface-mount BGA footprint. The available datasheet includes comprehensive electrical, switching, configuration, and I/O timing specifications for design and validation.
Key Features
- Logic Capacity 504,140 logic elements and 23,786 logic array blocks provide substantial on-chip resources for complex digital designs and custom accelerators.
- Embedded Memory Approximately 2.98 Mbits of on-chip RAM to support buffering, state storage, and memory-intensive logic functions.
- High I/O Density 544 I/O pins enable wide parallel interfaces and connection to multiple peripherals or high-speed buses.
- Package and Mounting 1152-ball FBGA (FCBGA) package, supplier package specified as 1152-FBGA, FC (35×35 mm), designed for surface-mount PCB assembly.
- Power Core supply operating range specified at 1.07 V to 1.13 V to match system power delivery requirements.
- Temperature Grade Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
- Compliance RoHS compliant.
- Documentation Datasheet coverage includes electrical characteristics, switching characteristics, transceiver and core performance specifications, configuration timing, and I/O timing to support development and validation.
Typical Applications
- Custom digital designs Large logic and memory resources enable implementation of complex, application-specific digital circuits and accelerators.
- High-density I/O systems 544 I/O pins support multiport interfaces and integration with numerous external devices and buses.
- Embedded system integration Surface-mount FCBGA package and defined core voltage range simplify integration into compact, board-level designs.
Unique Advantages
- Significant on-chip resources: 504,140 logic elements and approximately 2.98 Mbits of embedded RAM enable dense logic implementations without extensive external memory.
- High I/O count: 544 I/O pins provide flexibility for multi-channel interfaces, parallel data paths, and complex board-level interconnects.
- Compact, manufacturable package: 1152-ball FCBGA (35×35 mm) supports surface-mount assembly and high-density PCB layouts.
- Commercial-grade operation: Specified for 0 °C to 85 °C operation and RoHS compliance for standard commercial applications.
- Documented electrical and configuration specs: Detailed datasheet material available for electrical, switching, configuration, and I/O timing ensures predictable integration and verification.
Why Choose 5AGXFB7H4F35C4G?
The 5AGXFB7H4F35C4G Arria V GX FPGA combines a very large logic fabric and embedded memory with a high I/O count in a compact 1152-ball FCBGA package, making it suitable for designs that demand substantial on-chip resources and dense external connectivity. Its specified core voltage range and commercial operating temperature make it a fit for mainstream embedded and communications-oriented applications where validated electrical and timing documentation is required.
For engineering teams needing scalable logic capacity, predictable power and thermal parameters, and detailed datasheet guidance, this device provides the documented specifications necessary to evaluate fit and integrate into board-level systems.
If you would like pricing, availability, or a formal quote for 5AGXFB7H4F35C4G, submit an inquiry or request a quote referencing the full part number and your desired quantities and delivery timeline.

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