5AGXFB7H4F35C4N

The 5AGXFB7H4F35C4N is an Intel Arria V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA exposed-pad package. It provides a high logic capacity, substantial on‑chip RAM, and a large number of I/O for designs that require dense programmable logic and extensive peripheral connectivity.

Packaged for surface-mount assembly and offered as a commercial-grade device, this FPGA targets applications and designs that need abundant logic resources, embedded memory, and flexible I/O in a single IC while operating within standard commercial temperature and supply ranges.

Key Features

• Large logic capacity — 504,000 logic elements to support complex programmable logic implementations.
• Embedded memory — Approximately 27.7 Mbits of on‑chip RAM for buffering, state storage, and memory-mapped logic functions.
• Extensive I/O — 544 general-purpose I/O pins to connect to a wide range of peripherals and high‑pin‑count systems.
• Core power supply — Nominal voltage supply range of 1.07 V to 1.13 V to meet the device’s core power requirements.
• Commercial operating range — Rated for 0°C to 85°C operation for standard commercial deployments.
• Package and mounting — 1152-BBGA (FCBGA exposed pad) supplier device package 1152-FBGA (35×35); surface-mount mounting for PCB assembly.
• RoHS compliant — Meets RoHS environmental requirements.

Typical Applications

• High-density programmable logic — Use where large numbers of logic elements and embedded RAM are required to implement complex custom logic and state machines.
• Multi‑I/O systems — Suitable for designs that require many external interfaces or parallel connections thanks to 544 I/O pins.
• Embedded processing and buffering — On‑chip RAM supports data buffering, FIFOs, and local storage for deterministic processing.

Unique Advantages

• Significant logic resources: 504,000 logic elements enable larger, more feature-rich FPGA designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 27.7 Mbits of on‑chip RAM reduces external memory dependencies for many use cases.
• High I/O density: 544 I/Os simplify board-level routing and integration with peripherals, sensors, and interfaces.
• Commercial-grade readiness: Rated for 0°C to 85°C operation to meet standard commercial deployment conditions.
• Surface-mount, exposed-pad package: 1152-BBGA FCBGA package supports compact PCB implementations and thermal conduction through the exposed pad.
• RoHS compliant: Environmentally compliant for global commercial product assembly.

Why Choose 5AGXFB7H4F35C4N?

The 5AGXFB7H4F35C4N Arria V GX FPGA combines a very large logic element count, substantial on-chip RAM, and extensive I/O in a single commercial-grade, surface-mount package. It is well suited to designs that require compact integration of high-density programmable logic with significant local memory and many external connections.

For engineers and procurement teams seeking a robust Intel Arria V GX device with clear electrical and mechanical parameters—core supply range, operating temperature, package type, and RoHS compliance—this part provides a defined platform for scalable, high-capacity FPGA designs.

If you would like pricing, availability, or a formal quote for 5AGXFB7H4F35C4N, submit a request and our team will respond with details to support your design and procurement process.