5AGXFB7H4F35I3G

The 5AGXFB7H4F35I3G is an Arria V GX field‑programmable gate array (FPGA) IC offering high logic density and substantial on‑chip memory in a compact FCBGA package. It delivers a combination of abundant logic resources, extensive I/O, and an industrial operating range for demanding embedded designs.

Designed for systems that require large programmable fabric, significant embedded RAM, and a high pin‑count interface, this device is suitable for applications where integration and reliability across a wide temperature span are important.

Key Features

• Logic Capacity 504,000 logic elements to implement large-scale, custom digital functions and parallel processing pipelines.
• Embedded Memory Approximately 27.7 Mbits of on‑chip RAM to support buffering, lookup tables, and state storage without external memory in many use cases.
• I/O Density 544 user I/O pins to support complex, high‑pin‑count interfaces and multi‑bus connectivity.
• Package and Mounting 1152‑BBGA, FCBGA package (supplier package: 1152‑FBGA, FC, 35×35 mm) designed for surface‑mount assembly in compact system designs.
• Power Core voltage supply range of 1.12 V to 1.18 V for defined power budgeting and system power‑rail planning.
• Industrial Temperature Range Rated for operation from −40°C to 100°C, supporting deployment in industrial and harsh thermal environments.
• Regulatory Compliance RoHS‑compliant manufacturing status for environmental compliance in many global markets.

Typical Applications

• High‑density signal processing — Implement complex, parallel algorithms and custom data paths using the device’s 504,000 logic elements and substantial embedded memory.
• Complex I/O interfacing — Support multi‑lane, multi‑bus systems and extensive peripheral connectivity with 544 available I/O pins.
• Industrial control and automation — Deploy in industrial systems that require reliable operation across −40°C to 100°C and robust, programmable control logic.

Unique Advantages

• High logic density: 504,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing board complexity.
• Substantial on‑chip memory: Approximately 27.7 Mbits of embedded RAM minimizes dependence on external memory for many buffering and state‑storage needs.
• Extensive I/O capability: 544 I/O pins provide flexibility for interfacing with high‑pin‑count subsystems and multiple parallel buses.
• Industrial temperature range: Rated −40°C to 100°C for deployment in environments with wide thermal variation.
• Compact FCBGA package: 1152‑BBGA/1152‑FBGA (35×35 mm) package supports dense system integration while enabling surface‑mount assembly.
• Defined core voltage range: 1.12 V to 1.18 V simplifies power supply design and system power budgeting.

Why Choose 5AGXFB7H4F35I3G?

The 5AGXFB7H4F35I3G Arria V GX FPGA combines high logic element count, significant embedded RAM, and a large I/O complement in a compact FCBGA package, positioning it for complex embedded applications that demand programmable logic density and reliable operation across industrial temperatures. Its defined voltage and mounting characteristics simplify system integration and power planning.

This device is well suited for engineering teams building high‑capacity, programmable digital systems that require on‑device memory and extensive I/O. Its resource set supports consolidation of functions onto a single FPGA to reduce board-level complexity and provide design scalability within the same package footprint.

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