5AGXFB7H4F35I5G

IC FPGA 544 I/O 1152FBGA
Part Description

Arria V GX Field Programmable Gate Array (FPGA) IC 544 27695104 504000 1152-BBGA, FCBGA

Quantity 686 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA, FC (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O544Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs23780Number of Logic Elements/Cells504000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits27695104

Overview of 5AGXFB7H4F35I5G – Arria V GX FPGA, 504,000 logic elements, 544 I/O, 1152-BBGA

The 5AGXFB7H4F35I5G is an Intel Arria V GX field programmable gate array (FPGA) offering high logic capacity, abundant I/O, and substantial on-chip memory for complex, programmable digital designs. Its combination of 504,000 logic elements, approximately 27.7 Mbits of embedded memory, and 544 I/O pins makes it suitable for designs that require dense logic integration and flexible interfacing.

Key Features

  • Core Logic 504,000 logic elements provide a large programmable fabric for implementing complex digital functions and custom logic blocks.
  • Embedded Memory Approximately 27.7 Mbits of on-chip RAM deliver significant storage for buffering, FIFOs, and memory-intensive processing within the FPGA.
  • I/O Density 544 programmable I/O pins enable extensive external connectivity for high-pin-count system interfaces and peripherals.
  • Power Supply Operates from a specified core voltage range of 1.07 V to 1.13 V for the device core supply requirements.
  • Package and Mounting Supplied in a 1152-BBGA, FCBGA package (supplier device package: 1152-FBGA, FC (35x35)) and designed for surface-mount assembly.
  • Industrial Temperature Range Rated for operation from -40 °C to 100 °C, suitable for industrial environments requiring extended temperature tolerance.
  • RoHS Compliant Meets RoHS environmental requirements as indicated by its compliance status.

Typical Applications

  • High-density digital processing — Implement complex custom logic, parallel processing, and protocol engines using the large logic resource pool.
  • Memory-intensive designs — Use the on-chip RAM for buffering, packet processing, and storage of intermediate data in embedded systems.
  • High-pin-count interfacing — Leverage 544 I/O pins to connect to multiple peripherals, high-speed transceivers, or multi-lane interfaces in system designs.
  • Industrial systems — Deploy in applications that require extended temperature operation and robust surface-mount packaging.

Unique Advantages

  • Large programmable fabric: 504,000 logic elements enable implementation of extensive custom logic without external ASICs or additional FPGAs.
  • Substantial on-chip memory: Approximately 27.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
  • Extensive I/O capability: 544 I/O pins simplify system integration by supporting multiple interfaces and parallel connections directly to the FPGA.
  • Industrial-grade temperature range: -40 °C to 100 °C rating supports deployment in temperature-challenging environments.
  • Compact FCBGA package: 1152-ball BGA packaging in the supplier-specified 1152-FBGA, FC (35x35) format enables high-density PCB designs with reliable surface-mount assembly.
  • Tight core supply specification: The defined 1.07 V to 1.13 V core voltage range supports predictable power design and supply rail planning.

Why Choose 5AGXFB7H4F35I5G?

The 5AGXFB7H4F35I5G positions itself as a high-capacity, industrial-grade FPGA suited for dense logic implementations and memory-rich designs. Its combination of 504,000 logic elements, roughly 27.7 Mbits of on-chip RAM, and 544 I/O pins provides a balanced platform for integrating complex processing, buffering, and extensive external interfacing within a single device.

Engineers and procurement teams seeking scalability, robust temperature performance, and a compact BGA package will find this FPGA advantageous for mid-to-high complexity systems where integration and I/O count are critical. The device’s clear electrical and package specifications support predictable integration into tight board-level designs.

Request a quote or submit an inquiry to receive pricing and availability information for 5AGXFB7H4F35I5G and to discuss how it fits your project requirements.

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