5AGXFB7H4F35I5

The 5AGXFB7H4F35I5 is an Arria V GX Field Programmable Gate Array (FPGA) IC from Intel. It delivers a high-density programmable fabric with 504,000 logic elements and approximately 27.7 Mbits of embedded memory for complex logic and buffering tasks.

Designed as an industrial-grade device, this surface-mount FCBGA package provides a broad I/O count and a tightly specified core supply window, making it suitable for systems that require high integration, significant on-chip resources, and extended operating temperature range.

Key Features

• Core Capacity — 504,000 logic elements to implement large-scale, custom digital logic and complex datapaths.
• Embedded Memory — Approximately 27.7 Mbits of on-chip RAM for buffering, FIFOs, and embedded data structures.
• I/O Density — 544 user I/O pins to support wide parallel interfaces, high-pin-count peripherals, and multi-channel connectivity.
• Package & Mounting — 1152-BBGA (FCBGA exposed pad) / supplier package 1152-FBGA (35×35) in a surface-mount form factor for compact board integration.
• Power — Core voltage supply specified at 1.07 V to 1.13 V for predictable power design and supply sequencing.
• Temperature Range — Industrial operating temperature range from −40 °C to 100 °C for deployment in harsh environments.
• Compliance — RoHS-compliant construction for regulatory and manufacturing compatibility.

Typical Applications

• Industrial control systems — Use the industrial temperature rating and high I/O count to manage sensors, actuators, and real-time control logic.
• High-density signal processing — Leverage 504,000 logic elements and on-chip RAM for parallel processing, filtering, and protocol handling.
• Telecommunications and networking — Employ the large logic fabric and abundant I/O for custom packet processing, aggregation, and interface bridging.

Unique Advantages

• Substantial logic resources: 504,000 logic elements enable implementation of large, integrated designs on a single device, reducing external component count.
• Significant embedded memory: Approximately 27.7 Mbits of RAM support on-chip buffering and state storage, helping to minimize external memory dependency.
• High I/O capacity: 544 I/Os provide flexibility for parallel interfaces, multi-lane data paths, and high-pin-count peripherals.
• Industrial robustness: Specified for −40 °C to 100 °C operation to support deployment in extended-temperature environments.
• Compact, serviceable package: 1152-BBGA FCBGA with exposed pad and surface-mount construction for dense PCB layouts and thermal management.
• Controlled core supply: A defined 1.07 V–1.13 V supply window aids in consistent power design and validation.

Why Choose 5AGXFB7H4F35I5?

The 5AGXFB7H4F35I5 Arria V GX FPGA combines a high-density logic fabric, substantial embedded RAM, and a large I/O complement in an industrial-grade, surface-mount FCBGA package. These characteristics make it well-suited for designs that require integrated digital processing, extensive interfacing, and operation across extended temperature ranges.

Supported by Intel’s Arria V device documentation, this device is positioned for engineers and system designers seeking a programmable, high-capacity silicon building block that reduces external components while providing deterministic supply and thermal parameters for reliable system integration.

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