5AGXFB7H4F35I3

The 5AGXFB7H4F35I3 is an Arria V GX field programmable gate array (FPGA) IC in a 1152‑BBGA FCBGA surface‑mount package. It provides a high density of programmable logic with integrated on‑chip memory and a large user I/O complement.

With 504,000 logic elements, approximately 27.7 Mbits of embedded memory and 544 user I/O, this industrial‑grade device is intended for designs that require substantial logic resources and memory capacity within a compact package and an operating range of -40 °C to 100 °C.

Key Features

• Core Logic  504,000 logic elements available for implementing complex programmable logic and custom functions.
• Embedded Memory  Approximately 27.7 Mbits of on‑chip RAM to support data buffering, state storage, and application logic.
• I/O Capacity  544 user I/O pins to support multiple external interfaces and parallel connections.
• Power  Operates from a 1.12 V to 1.18 V supply range to match system power rail design constraints.
• Package and Mounting  Surface‑mount 1152‑BBGA FCBGA; supplier device package listed as 1152‑FBGA, FC (35×35) for compact board integration.
• Temperature and Grade  Industrial grade device with an operating temperature range of -40 °C to 100 °C for deployment in thermally demanding environments.
• Environmental Compliance  RoHS compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control  Use the FPGA’s logic density and industrial temperature rating to implement control algorithms, signal processing, and timing-critical functions in industrial equipment.
• I/O‑Intensive Interfaces  Leverage 544 user I/O to aggregate and bridge multiple high‑pin‑count interfaces or to provide extensive peripheral connectivity.
• High‑Density Logic Integration  Consolidate custom logic, glue logic, and embedded computation into a single device using the large logic element count and on‑chip RAM.
• Embedded System Development  Deploy as a compact, surface‑mount FPGA building block in systems that require substantial memory and programmable resources.

Unique Advantages

• Highly integrated logic and memory: Combines 504,000 logic elements with approximately 27.7 Mbits of embedded RAM to reduce external memory requirements and board complexity.
• Large I/O capacity: 544 user I/O pins provide flexibility for complex interfacing and parallel data paths.
• Industrial temperature range: Rated from -40 °C to 100 °C for reliable operation in temperature‑challenging environments.
• Compact FCBGA package: 1152‑BBGA (1152‑FBGA, FC 35×35) surface‑mount footprint enables high‑density board layouts.
• Low‑voltage operation: Narrow supply window (1.12 V to 1.18 V) supports integration into tightly specified power architectures.
• RoHS compliant: Supports lead‑free assembly processes and environmental regulatory requirements.

Why Choose 5AGXFB7H4F35I3?

The 5AGXFB7H4F35I3 positions itself as a high‑density FPGA option for designs that demand substantial programmable logic, significant on‑chip memory and broad I/O capability in a compact surface‑mount package. Its industrial temperature rating and RoHS compliance make it suitable for deployments where thermal resilience and lead‑free manufacturing are required.

Engineers and system designers who need a scalable, high‑capacity FPGA building block—providing logic, memory and I/O in a single device—will find this part appropriate for consolidating functions and simplifying PCB design while meeting industrial operating constraints.

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