5AGXFB7H4F35I5N

The 5AGXFB7H4F35I5N is an Arria V GX field programmable gate array (FPGA) manufactured by Intel. It provides a high logic density fabric with 504,000 logic elements and approximately 27.7 Mbits of embedded memory, paired with a large programmable I/O count for complex system integration.

Designed and specified for industrial applications, this surface-mount device is offered in a 1152-BBGA exposed-pad package and supports an operating temperature range of −40 °C to 100 °C with a core supply window of 1.07 V to 1.13 V.

Key Features

• High Logic Density — 504,000 logic elements for large combinational and sequential designs.
• Embedded Memory — Total on-chip RAM of 27,695,104 bits (approximately 27.7 Mbits) to support data buffering and state storage.
• Extensive I/O — 544 programmable I/O pins to interface with multiple peripherals and high-pin-count systems.
• Industrial Grade — Specified as Industrial grade with an operating temperature range from −40 °C to 100 °C.
• Package and Mounting — 1152-BBGA (FCBGA exposed pad), supplier device package identified as 1152-FBGA (35×35); surface-mount mounting type.
• Supply Voltage — Core voltage operating range from 1.07 V to 1.13 V for predictable power domain design.
• Standards and Compliance — RoHS-compliant construction.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and high I/O count make the device suitable for control systems and factory automation interfaces.
• High-Density FPGA Computing — Large logic element count and substantial on-chip RAM enable complex algorithm implementation and data-path processing.
• System Integration and Prototyping — The 1152-FBGA package and broad I/O complement support integration into high-pin-count boards and system validation platforms.

Unique Advantages

• Scalable Logic Capacity: 504,000 logic elements allow designers to consolidate multiple functions into a single device, reducing board-level complexity.
• Significant Embedded Memory: Approximately 27.7 Mbits of on-chip RAM supports buffering, lookup tables, and state retention without external memory in many use cases.
• High I/O Count: 544 I/O pins provide the flexibility to connect numerous peripherals, sensors, and high-speed interfaces.
• Industrial Reliability: Specified for −40 °C to 100 °C operation, enabling deployment in harsher environments than typical commercial-grade devices.
• Compact, Serviceable Package: 1152-BBGA exposed-pad FCBGA package suitable for surface-mount assembly on dense PCBs.
• Regulatory Compliance: RoHS-compliant to meet environmental and manufacturing requirements.

Why Choose 5AGXFB7H4F35I5N?

The 5AGXFB7H4F35I5N positions itself as a high-density Arria V GX FPGA option for designs that require substantial logic capacity, sizable on-chip memory, and broad I/O in an industrial-grade package. Its combination of 504,000 logic elements, approximately 27.7 Mbits of embedded RAM, and 544 I/O pins makes it appropriate for engineers consolidating complex digital functions on a single device while maintaining board-level simplicity.

Backed by Intel’s Arria V device documentation, the device is suitable for development teams and procurement focused on robust FPGA platforms for industrial applications, offering a clear specification set for power, thermal, and packaging considerations.

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