5CEFA4M13C6N

IC FPGA 223 I/O 383MBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 223 3464192 49000 383-TFBGA

Quantity 1,778 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package383-MBGA (13x13)GradeCommercialOperating Temperature0°C – 85°C
Package / Case383-TFBGANumber of I/O223Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs18480Number of Logic Elements/Cells49000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3464192

Overview of 5CEFA4M13C6N – Cyclone® V E FPGA, 49,000 logic elements, 223 I/O (383-TFBGA)

The 5CEFA4M13C6N is an Intel Cyclone V E field-programmable gate array (FPGA) packaged in a 383-TFBGA (supplier: 383-MBGA 13×13) surface-mount package. This commercial-grade FPGA integrates a mid-range logic fabric with substantial on-chip memory and a large I/O count, making it suitable for demanding embedded and high-bandwidth applications in industrial, wireless/wireline, and military segments.

As a member of the Cyclone V family, the device follows family design principles for low power and integration. Key device-level characteristics include 49,000 logic elements, approximately 3.46 Mbits of embedded memory, and a 1.07 V–1.13 V core supply range, supporting cost- and power-conscious system designs.

Key Features

  • Logic Capacity  49,000 logic elements suitable for mid-density FPGA designs that require substantial programmable logic resources.
  • Embedded Memory  Approximately 3.46 Mbits of on-chip RAM to support buffering, frame storage, and custom memory structures without immediate external RAM dependency.
  • I/O Density  223 general-purpose I/O pins to support multi-channel interfaces, parallel buses, or mixed-signal front-end connections via external components.
  • Power and Core Supply  Operates with a core supply range of 1.07 V to 1.13 V, enabling low-voltage system architectures and predictable power budgeting.
  • Package and Mounting  383-TFBGA (supplier package 383-MBGA 13×13) in a surface-mount form factor for compact board integration.
  • Operating Range and Grade  Commercial temperature grade rated for 0 °C to 85 °C operation to meet standard industrial and commercial application requirements.
  • Compliance  RoHS-compliant status for regulatory and environmental alignment in finished products.
  • Cyclone V Family Capabilities  Part of the Cyclone V family, which is documented for low-power 28 nm process operation and includes family-level features such as integrated memory blocks and device-level design migration options.

Typical Applications

  • Industrial Control  Motor control, PLC interfacing and sensor aggregation where a mix of logic density and plentiful I/O are required within commercial temperature ranges.
  • Wireless and Wireline Infrastructure  Protocol handling, data buffering and peripheral interfacing in communications equipment that benefits from on-chip memory and flexible I/O.
  • Defense and Tactical Systems  Custom signal processing and I/O aggregation in military-grade system blocks (use within commercial temperature range as specified).
  • Embedded Computing  Custom offload and pre/post-processing tasks in embedded platforms that require a balance of logic resources and embedded RAM.

Unique Advantages

  • Balanced Logic and Memory  Combines 49,000 logic elements with approximately 3.46 Mbits of embedded RAM to support complex finite-state machines, buffering and moderate-sized lookup tables without immediate external memory.
  • High I/O Count  With 223 I/O, the device can interface to multiple peripherals and parallel buses, reducing the need for external interface chips.
  • Low-Voltage Core Operation  Core supply range of 1.07 V–1.13 V supports low-power board-level designs and simplifies power-rail planning.
  • Compact Surface-Mount Package  The 383-TFBGA (13×13) package enables dense board layouts while maintaining thermal and signal routing compatibility expected for surface-mount FPGA solutions.
  • Commercial-Grade Reliability  Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
  • Family-Level Migration  As part of the Cyclone V family, designers can leverage family documentation and compatible device options for future scaling and migration.

Why Choose 5CEFA4M13C6N?

The 5CEFA4M13C6N delivers a balanced mid-density FPGA option for designers who need substantial programmable logic, significant on-chip memory, and a high I/O count within a compact 383-TFBGA surface-mount package. Its low-voltage core range and commercial operating temperature make it well suited for cost- and power-conscious embedded systems in industrial, wireless/wireline, and military applications.

Choosing this Cyclone V E device provides a practical path for systems that require reliable logic capacity, efficient on-chip memory use, and flexible interfacing, with family-level documentation to support design migration and scalability.

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