5CEFA4M13C6N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 223 3464192 49000 383-TFBGA |
|---|---|
| Quantity | 1,778 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 223 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 18480 | Number of Logic Elements/Cells | 49000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3464192 |
Overview of 5CEFA4M13C6N – Cyclone® V E FPGA, 49,000 logic elements, 223 I/O (383-TFBGA)
The 5CEFA4M13C6N is an Intel Cyclone V E field-programmable gate array (FPGA) packaged in a 383-TFBGA (supplier: 383-MBGA 13×13) surface-mount package. This commercial-grade FPGA integrates a mid-range logic fabric with substantial on-chip memory and a large I/O count, making it suitable for demanding embedded and high-bandwidth applications in industrial, wireless/wireline, and military segments.
As a member of the Cyclone V family, the device follows family design principles for low power and integration. Key device-level characteristics include 49,000 logic elements, approximately 3.46 Mbits of embedded memory, and a 1.07 V–1.13 V core supply range, supporting cost- and power-conscious system designs.
Key Features
- Logic Capacity 49,000 logic elements suitable for mid-density FPGA designs that require substantial programmable logic resources.
- Embedded Memory Approximately 3.46 Mbits of on-chip RAM to support buffering, frame storage, and custom memory structures without immediate external RAM dependency.
- I/O Density 223 general-purpose I/O pins to support multi-channel interfaces, parallel buses, or mixed-signal front-end connections via external components.
- Power and Core Supply Operates with a core supply range of 1.07 V to 1.13 V, enabling low-voltage system architectures and predictable power budgeting.
- Package and Mounting 383-TFBGA (supplier package 383-MBGA 13×13) in a surface-mount form factor for compact board integration.
- Operating Range and Grade Commercial temperature grade rated for 0 °C to 85 °C operation to meet standard industrial and commercial application requirements.
- Compliance RoHS-compliant status for regulatory and environmental alignment in finished products.
- Cyclone V Family Capabilities Part of the Cyclone V family, which is documented for low-power 28 nm process operation and includes family-level features such as integrated memory blocks and device-level design migration options.
Typical Applications
- Industrial Control Motor control, PLC interfacing and sensor aggregation where a mix of logic density and plentiful I/O are required within commercial temperature ranges.
- Wireless and Wireline Infrastructure Protocol handling, data buffering and peripheral interfacing in communications equipment that benefits from on-chip memory and flexible I/O.
- Defense and Tactical Systems Custom signal processing and I/O aggregation in military-grade system blocks (use within commercial temperature range as specified).
- Embedded Computing Custom offload and pre/post-processing tasks in embedded platforms that require a balance of logic resources and embedded RAM.
Unique Advantages
- Balanced Logic and Memory Combines 49,000 logic elements with approximately 3.46 Mbits of embedded RAM to support complex finite-state machines, buffering and moderate-sized lookup tables without immediate external memory.
- High I/O Count With 223 I/O, the device can interface to multiple peripherals and parallel buses, reducing the need for external interface chips.
- Low-Voltage Core Operation Core supply range of 1.07 V–1.13 V supports low-power board-level designs and simplifies power-rail planning.
- Compact Surface-Mount Package The 383-TFBGA (13×13) package enables dense board layouts while maintaining thermal and signal routing compatibility expected for surface-mount FPGA solutions.
- Commercial-Grade Reliability Rated for 0 °C to 85 °C operation and RoHS compliance for mainstream commercial deployments.
- Family-Level Migration As part of the Cyclone V family, designers can leverage family documentation and compatible device options for future scaling and migration.
Why Choose 5CEFA4M13C6N?
The 5CEFA4M13C6N delivers a balanced mid-density FPGA option for designers who need substantial programmable logic, significant on-chip memory, and a high I/O count within a compact 383-TFBGA surface-mount package. Its low-voltage core range and commercial operating temperature make it well suited for cost- and power-conscious embedded systems in industrial, wireless/wireline, and military applications.
Choosing this Cyclone V E device provides a practical path for systems that require reliable logic capacity, efficient on-chip memory use, and flexible interfacing, with family-level documentation to support design migration and scalability.
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