5CEFA4U19A7N

The 5CEFA4U19A7N is a Cyclone® V E field‑programmable gate array (FPGA) in a 484‑FBGA package, designed for applications across automotive, industrial, wireless/wireline, and military markets. It combines a high‑density FPGA fabric with embedded memory and a broad I/O complement to support system integration and bandwidth‑oriented designs.

This part is AEC‑Q100 qualified for automotive designs, RoHS‑compliant, and optimized for low‑voltage core operation, making it suitable for temperature‑sensitive and reliability‑focused applications.

Key Features

• Logic Density  Approximately 49,000 logic elements for mid‑to‑high complexity FPGA implementations.
• Embedded Memory  Approximately 3.46 Mbits of on‑chip RAM to support buffering, state storage, and small memory‑mapped functions.
• I/O Resources  224 device I/O pins for flexible interfacing and system connectivity.
• Package and Mounting  484‑FBGA (supplier package: 484‑UBGA, 19×19) in a surface‑mount format for compact board integration.
• Power and Voltage  Core supply operating range of 1.07 V to 1.13 V, consistent with low‑voltage FPGA architectures.
• Operating Temperature  Qualified for operation from −40 °C to 125 °C to meet demanding thermal environments.
• Automotive Qualification  AEC‑Q100 qualification for use in automotive applications that require component qualification to this standard.
• Regulatory Compliance  RoHS‑compliant to support modern manufacturing and environmental requirements.
• Series‑Level Architecture  Part of the Cyclone V family, which includes low‑power process technology and integrated hard IP such as memory controllers and transceivers (series features described in the device documentation).

Typical Applications

• Automotive systems  AEC‑Q100 qualification and a −40 °C to 125 °C operating range make this FPGA suitable for automotive electronic modules that require certified components and extended temperature operation.
• Wireless and wireline equipment  Designed for bandwidth‑oriented markets where integrated transceivers and hard memory controllers (series features) help streamline board‑level design.
• Industrial platforms  Provides programmable logic and embedded memory to support control, data aggregation, and protocol bridging in industrial applications.
• Military and ruggedized designs  High I/O count and extended temperature range support applications that demand robustness and system‑level flexibility.

Unique Advantages

• Automotive‑grade qualification: AEC‑Q100 certification supports use in automotive designs that require qualified components.
• High logic capacity: Roughly 49,000 logic elements allow implementation of complex logic, glue logic, and mid‑level processing functions on a single device.
• Embedded memory on‑chip: Approximately 3.46 Mbits of RAM reduces dependence on external memory for many control and buffering tasks.
• Wide operating range: −40 °C to 125 °C supports deployment in thermally challenging environments.
• Compact, high‑pin package: 484‑FBGA (19×19) delivers high I/O density in a surface‑mount footprint for space‑constrained boards.
• Low‑voltage core operation: Nominal core range around 1.1 V (1.07 V to 1.13 V) aligns with modern low‑power system designs.

Why Choose 5CEFA4U19A7N?

The 5CEFA4U19A7N brings a balanced combination of logic density, embedded memory, and I/O capacity in an AEC‑Q100 qualified Cyclone V E device. Its low‑voltage core, RoHS compliance, and extended operating temperature range make it appropriate for automotive and other reliability‑focused applications where component qualification and thermal resilience are required.

Engineers designing systems that need scalable programmable logic, on‑chip RAM, and dense I/O in a compact FBGA package will find this device suitable for reducing board count and simplifying system integration while leveraging the Cyclone V family architecture.

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