5CEFA4M13I7N

The 5CEFA4M13I7N is an Intel Cyclone V E field-programmable gate array (FPGA) in a 383-TFBGA package optimized for industrial applications. Built on TSMC 28 nm low-power process technology with a nominal 1.1 V core, this device delivers a balance of logic capacity, embedded memory and I/O for mid-density system designs.

With 49,000 logic elements, approximately 3.46 Mbits of embedded memory and 223 I/O, the part is targeted at industrial, wireless/wireline and military applications that require robust temperature range, surface-mount packaging and integrated system-level features from the Cyclone V family.

Key Features

• Logic Capacity — 49,000 logic elements to implement complex control, signal-processing and glue-logic functions.
• Embedded Memory — Approximately 3.46 Mbits of on-chip RAM for buffering, FIFOs and local data storage.
• I/O — 223 I/O pins, enabling multi-interface connectivity and flexible board-level integration.
• Core and Supply Voltage — Core/nominal 1.1 V technology with a specified supply range of 1.07 V to 1.13 V for predictable power planning.
• Package & Mounting — 383-TFBGA package (supplier package: 383-MBGA, 13×13) designed for surface-mount assembly.
• Temperature & Grade — Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• System-Level Integration — Part of the Cyclone V family that includes integrated transceivers and hard memory controllers to simplify system design.
• Standards Compliance — RoHS-compliant construction for regulatory alignment in global production.

Typical Applications

• Industrial automation and control — Use the device's 49,000 logic elements and 223 I/Os for deterministic control, sensor interfacing and real-time logic tasks across −40 °C to 100 °C operating range.
• Wireless and wireline infrastructure — Leverage embedded memory and Cyclone V family I/O features to implement protocol bridging, buffering and mid-density packet processing.
• Defense and rugged systems — Industrial temperature rating and surface-mount packaging support deployment in ruggedized equipment where reliable logic and I/O count matter.

Unique Advantages

• Balanced mid-density logic and memory — 49,000 logic elements paired with approximately 3.46 Mbits of embedded RAM provide a compact platform for complex designs without overprovisioning.
• Predictable power envelope — Built on 28 nm low-power process with a narrow supply range (1.07–1.13 V), aiding power budgeting and thermal design.
• Industrial-ready thermal range — −40 °C to 100 °C operation addresses a wide spectrum of industrial and mission-critical applications.
• Flexible board-level integration — 223 I/Os and a 383-TFBGA surface-mount package simplify routing and enable dense system designs.
• RoHS compliance — Facilitates regulatory and environmental requirements for commercial production.

Why Choose 5CEFA4M13I7N?

The 5CEFA4M13I7N delivers a practical combination of logic capacity, embedded memory and I/O in a compact, industrial-grade FPGA package. Its 28 nm low-power heritage and narrow supply window make it suitable for designs that require controlled power characteristics and reliable operation across a wide temperature range.

This device is well suited to engineering teams building mid-density systems in industrial, wireless/wireline and defense segments who need a field-programmable platform with integrated Cyclone V family system capabilities and manufacturable surface-mount packaging.

If you would like pricing, availability or a formal quote for 5CEFA4M13I7N, submit a request or inquiry and our team will respond with details tailored to your project needs.