5CEFA9F31C8N

IC FPGA 480 I/O 896FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA

Quantity 1,128 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeCommercialOperating Temperature0°C – 85°C
Package / Case896-BGANumber of I/O480Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs113560Number of Logic Elements/Cells301000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits14251008

Overview of 5CEFA9F31C8N – Cyclone® V E FPGA, 301,000 logic elements, 896‑BGA

The 5CEFA9F31C8N is a Cyclone® V E field-programmable gate array (FPGA) in an 896‑ball BGA (31×31) package. It integrates a large programmable fabric—301,000 logic elements—with substantial on-chip memory and a 480‑pin I/O footprint to address high-volume, cost-sensitive applications.

Built for designs that need a balance of integration, low-power operation, and I/O density, this commercial‑grade device is suited to industrial, wireless and wireline networking, and military applications where a compact FPGA solution is required.

Key Features

  • Logic Capacity 301,000 logic elements for complex glue logic, protocol handling, and custom datapath implementation.
  • Embedded Memory Approximately 13.59 Mbits of on‑chip RAM (14,251,008 bits) to support buffering, FIFOs, and on‑chip data storage.
  • I/O Density 480 user I/O pins to connect multiple parallel interfaces, high‑speed peripherals, and external memory buses.
  • Process and Core Voltage Manufactured on TSMC 28‑nm low‑power (28LP) process technology with a measured supply window of 1.07 V to 1.13 V for core operation.
  • Adaptive Logic and DSP Architecture includes enhanced 8‑input adaptive logic modules and variable‑precision DSP blocks for efficient arithmetic and logic implementations.
  • Memory and Reliability M10K embedded memory blocks with support for soft error correction code (ECC) for improved data integrity.
  • Package and Mounting 896‑FBGA (31×31) surface‑mount package providing a compact footprint for board‑level integration.
  • Operating Range Commercial operating temperature range of 0 °C to 85 °C, RoHS‑compliant.

Typical Applications

  • Wireless and Wireline Networking High logic density, embedded memory, and integrated transceiver support make the device suitable for packet processing, fronthaul/backhaul, and protocol offload engines.
  • Industrial Control and Automation Large I/O count and on‑chip memory enable motor control, real‑time sensor aggregation, and deterministic control logic.
  • Military Systems Programmable fabric and flexible DSP resources support custom signal processing and interface consolidation for mission‑specific applications.
  • SoC and Heterogeneous Designs Family features such as hard memory controllers and processor integration options support FPGA+processor hybrid architectures and external memory subsystems.

Unique Advantages

  • High Integration Density: 301,000 logic elements and approximately 13.59 Mbits of embedded memory reduce the need for external glue logic and SRAM, simplifying board design.
  • Robust I/O Capability: 480 I/O pins provide flexibility to connect multiple high‑speed interfaces and parallel buses without external multiplexing.
  • Low‑Power Silicon: Built on a 28‑nm low‑power process with a narrow core supply window, enabling predictable power budgeting for cost‑sensitive systems.
  • Compact, Manufacturable Package: The 896‑FBGA (31×31) surface‑mount package offers a dense, repeatable footprint for volume production and automated assembly.
  • Data Integrity Options: On‑chip M10K memory blocks with ECC support help protect critical state and buffering from soft errors.
  • Family Ecosystem: Leverages Cyclone V family architecture and features—such as adaptive ALMs and DSP blocks—enabling migration across device densities within the family.

Why Choose 5CEFA9F31C8N?

The 5CEFA9F31C8N balances sizable programmable logic, substantial embedded memory, and a high I/O count in a compact 896‑BGA package. Its 28‑nm low‑power foundation and defined core supply range make it suitable for designers targeting efficient, integrated FPGA solutions for industrial, wireless/wireline, and military applications.

Choose this part when your design requires a mid‑to‑high capacity FPGA with on‑chip memory and flexible I/O, while maintaining a compact board footprint and commercial operating range. The device's family‑level features support scalable designs and straightforward migration within the Cyclone V portfolio.

Request a quote or submit an inquiry to receive pricing and availability information for 5CEFA9F31C8N and to discuss how this Cyclone® V E FPGA can fit your next design.

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