5CEFA9F31C8N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 480 14251008 301000 896-BGA |
|---|---|
| Quantity | 1,128 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 896-FBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 896-BGA | Number of I/O | 480 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 113560 | Number of Logic Elements/Cells | 301000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 14251008 |
Overview of 5CEFA9F31C8N – Cyclone® V E FPGA, 301,000 logic elements, 896‑BGA
The 5CEFA9F31C8N is a Cyclone® V E field-programmable gate array (FPGA) in an 896‑ball BGA (31×31) package. It integrates a large programmable fabric—301,000 logic elements—with substantial on-chip memory and a 480‑pin I/O footprint to address high-volume, cost-sensitive applications.
Built for designs that need a balance of integration, low-power operation, and I/O density, this commercial‑grade device is suited to industrial, wireless and wireline networking, and military applications where a compact FPGA solution is required.
Key Features
- Logic Capacity 301,000 logic elements for complex glue logic, protocol handling, and custom datapath implementation.
- Embedded Memory Approximately 13.59 Mbits of on‑chip RAM (14,251,008 bits) to support buffering, FIFOs, and on‑chip data storage.
- I/O Density 480 user I/O pins to connect multiple parallel interfaces, high‑speed peripherals, and external memory buses.
- Process and Core Voltage Manufactured on TSMC 28‑nm low‑power (28LP) process technology with a measured supply window of 1.07 V to 1.13 V for core operation.
- Adaptive Logic and DSP Architecture includes enhanced 8‑input adaptive logic modules and variable‑precision DSP blocks for efficient arithmetic and logic implementations.
- Memory and Reliability M10K embedded memory blocks with support for soft error correction code (ECC) for improved data integrity.
- Package and Mounting 896‑FBGA (31×31) surface‑mount package providing a compact footprint for board‑level integration.
- Operating Range Commercial operating temperature range of 0 °C to 85 °C, RoHS‑compliant.
Typical Applications
- Wireless and Wireline Networking High logic density, embedded memory, and integrated transceiver support make the device suitable for packet processing, fronthaul/backhaul, and protocol offload engines.
- Industrial Control and Automation Large I/O count and on‑chip memory enable motor control, real‑time sensor aggregation, and deterministic control logic.
- Military Systems Programmable fabric and flexible DSP resources support custom signal processing and interface consolidation for mission‑specific applications.
- SoC and Heterogeneous Designs Family features such as hard memory controllers and processor integration options support FPGA+processor hybrid architectures and external memory subsystems.
Unique Advantages
- High Integration Density: 301,000 logic elements and approximately 13.59 Mbits of embedded memory reduce the need for external glue logic and SRAM, simplifying board design.
- Robust I/O Capability: 480 I/O pins provide flexibility to connect multiple high‑speed interfaces and parallel buses without external multiplexing.
- Low‑Power Silicon: Built on a 28‑nm low‑power process with a narrow core supply window, enabling predictable power budgeting for cost‑sensitive systems.
- Compact, Manufacturable Package: The 896‑FBGA (31×31) surface‑mount package offers a dense, repeatable footprint for volume production and automated assembly.
- Data Integrity Options: On‑chip M10K memory blocks with ECC support help protect critical state and buffering from soft errors.
- Family Ecosystem: Leverages Cyclone V family architecture and features—such as adaptive ALMs and DSP blocks—enabling migration across device densities within the family.
Why Choose 5CEFA9F31C8N?
The 5CEFA9F31C8N balances sizable programmable logic, substantial embedded memory, and a high I/O count in a compact 896‑BGA package. Its 28‑nm low‑power foundation and defined core supply range make it suitable for designers targeting efficient, integrated FPGA solutions for industrial, wireless/wireline, and military applications.
Choose this part when your design requires a mid‑to‑high capacity FPGA with on‑chip memory and flexible I/O, while maintaining a compact board footprint and commercial operating range. The device's family‑level features support scalable designs and straightforward migration within the Cyclone V portfolio.
Request a quote or submit an inquiry to receive pricing and availability information for 5CEFA9F31C8N and to discuss how this Cyclone® V E FPGA can fit your next design.

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