5CEFA9U19A7N

The 5CEFA9U19A7N is a Cyclone® V E series FPGA provided in a 484‑FBGA package, designed for applications that require high logic density, embedded memory, and wide operating temperature range. As part of the Cyclone V family, this device delivers integrated FPGA fabric with series-level capabilities such as embedded memory blocks and hard IP elements suitable for industrial, wireless/wireline, military, and automotive markets.

This device combines 301,000 logic elements with approximately 14.25 Mbits of on‑chip embedded memory, a 240‑pin I/O complement, and an automotive AEC‑Q100 qualification, making it appropriate for designs that demand integration, on‑chip memory resources, and automotive‑grade qualification.

Key Features

• Logic Capacity 301,000 logic elements to implement complex custom logic and state machines.
• Embedded Memory Approximately 14.25 Mbits of on‑chip RAM for buffering, tables, and local data storage.
• I/O 240 user I/O pins for broad peripheral and interface connectivity.
• Power and Core Voltage Core supply range specified at 1.07 V to 1.13 V, compatible with the Cyclone V series low‑voltage operation.
• Package and Mounting 484‑FBGA package (supplier device package: 484‑UBGA, 19×19) with surface‑mount mounting for standard PCB assembly.
• Automotive Qualification Grade: Automotive with AEC‑Q100 qualification for designs requiring automotive component qualification.
• Operating Temperature Rated for −40 °C to 125 °C ambient operation to meet extended temperature requirements.
• Cyclone V Series Architecture Built on the Cyclone V device family architecture, which includes series features such as low‑power 28‑nm process characteristics and embedded memory block structures described in the Cyclone V documentation.
• RoHS Compliance RoHS‑compliant material status for regulatory and manufacturing compatibility.

Typical Applications

• Automotive Systems Automotive‑grade qualification (AEC‑Q100) and −40 °C to 125 °C operation make this FPGA suitable for in‑vehicle compute, sensor aggregation, and control subsystems.
• Industrial Equipment High logic density and substantial on‑chip memory support industrial control, data acquisition, and protocol bridging applications.
• Wireless and Wireline Infrastructure Series capabilities such as embedded memory and high I/O count enable protocol processing, timing, and interface functions in communications equipment.
• Defense and Military Electronics Qualified operating range and Cyclone V family feature set support ruggedized electronic subsystems where extended temperature and integration are required.

Unique Advantages

• High Logic Density: 301,000 logic elements provide the capacity to implement complex control, signal processing, and glue logic in a single device.
• Substantial On‑Chip Memory: Approximately 14.25 Mbits of embedded RAM reduces external memory dependencies and simplifies board design.
• Automotive‑Grade Qualification: AEC‑Q100 qualification and broad temperature range let you specify this FPGA in automotive designs with component‑level qualification evidence.
• Standard BGA Packaging: 484‑FBGA (484‑UBGA, 19×19) surface‑mount package supports compact PCB layouts and industry assembly processes.
• Controlled Core Voltage: Narrow supply range (1.07–1.13 V) supports predictable core power design and power sequencing.
• Compliance and Documentation: RoHS compliance and inclusion in the Cyclone V device family documentation provide traceability for manufacturing and design validation.

Why Choose 5CEFA9U19A7N?

The 5CEFA9U19A7N positions itself as a high‑capacity Cyclone® V E FPGA option for designs that need a balance of logic density, on‑chip memory, and automotive qualification. Its combination of 301,000 logic elements, roughly 14.25 Mbits of embedded RAM, and a 240‑pin I/O complement enables integration of multiple subsystems on a single device, reducing bill‑of‑materials and board complexity.

As a member of the Cyclone V family, this device benefits from the documented feature set and series‑level architecture, making it suitable for engineering teams developing automotive, industrial, communications, or defense electronics that require a qualified, high‑integration FPGA solution.

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