5CEFA9F27I7N

The 5CEFA9F27I7N is an Intel Cyclone® V E Field Programmable Gate Array (FPGA) in a 672-BGA package targeted at industrial applications. It combines a dense logic fabric with on-chip embedded memory and broad I/O capability to support control, signal processing, and protocol-bridging roles in cost- and power-sensitive systems.

Built on the Cyclone V family architecture, this device leverages the 28‑nm low‑power process and integrated FPGA hard IP to deliver scalable logic capacity, embedded memory, and flexible interfaces within a compact surface-mount package.

Key Features

• Logic Capacity  Approximately 301,000 logic elements for implementing complex control, glue-logic, and acceleration functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM (14,251,008 bits) for buffering, LUT-based storage, and soft memory structures.
• I/O Density  336 general-purpose I/Os to support wide parallel interfaces, high-pin-count peripherals, and mixed-signal front-end connectivity.
• Process and Core Voltage  Cyclone V family silicon built on TSMC 28‑nm low‑power (28LP) technology with a nominal 1.1 V core and supported supply range of 1.07 V to 1.13 V.
• Embedded FPGA Hard IP  Architecture includes enhanced adaptive logic modules, variable‑precision DSP blocks, M10K embedded memory blocks, integrated transceivers, and hard memory controllers as part of the Cyclone V feature set.
• Package and Mounting  672‑ball BGA (672‑FBGA, 27×27) surface‑mount package for compact board layouts and high pin density.
• Industrial Temperature  Rated for -40 °C to 100 °C operating temperature range suitable for industrial environments.
• Compliance  RoHS‑compliant manufacturing.

Typical Applications

• Industrial Control  Implements motor control logic, sensor aggregation, and deterministic I/O handling where robust temperature range and dense logic are required.
• Wireless and Wireline Infrastructure  Provides programmable interfaces, protocol bridging, and signal processing acceleration using embedded DSP and transceiver IP.
• Defense and Aerospace Systems  Supports custom logic, data buffering, and interface consolidation in applications that leverage embedded memory and abundant I/O.
• Embedded System SoC Integration  Acts as the programmable fabric for mixed hardware/software solutions that require close coupling of logic, memory, and I/O resources.

Unique Advantages

• Dense, programmable logic:  About 301k logic elements let you implement large, custom digital functions without external glue logic.
• Significant on‑chip RAM:  Approximately 14.25 Mbits of embedded memory reduces external memory dependence and simplifies board routing.
• High I/O count:  336 I/Os enable connection to multiple peripherals, parallel busses, and front-end devices without extensive multiplexing.
• Industrial temperature support:  Rated from -40 °C to 100 °C for reliable operation in factory, field, and harsh environments.
• Compact, manufacturable package:  672‑FBGA (27×27) surface-mount package balances pin density with board area for space-constrained designs.
• Family-level hard IP:  Cyclone V features—such as enhanced ALMs, DSP blocks, M10K memory, transceivers, and hard memory controllers—provide integrated building blocks to accelerate design implementation.

Why Choose 5CEFA9F27I7N?

The 5CEFA9F27I7N positions itself as a practical, industrial-grade FPGA choice where a combination of dense logic, substantial on-chip memory, and high I/O count are required within a compact BGA package. Its Cyclone V family heritage provides access to integrated hard IP and a low‑power 28‑nm process node with a nominal 1.1 V core supply.

This device is suited to engineering teams designing industrial control, communications infrastructure, or embedded systems that need programmable flexibility, embedded storage, and robust temperature performance while keeping board footprint and BOM complexity under control.

Request a quote or submit a request for pricing and availability to evaluate 5CEFA9F27I7N for your next design.