5CEFA9F23I7N

The 5CEFA9F23I7N is a Cyclone® V E family Field Programmable Gate Array (FPGA) in a 484-ball BGA (23 × 23) surface-mount package. This industrial-grade device delivers high logic capacity and on-chip memory for system-level integration in demanding embedded and communications applications.

Key device characteristics include approximately 301,000 logic elements, roughly 14.25 Mbits of embedded memory, 224 user I/O pins, a core supply window of 1.07 V–1.13 V, and an operating temperature range of −40 °C to 100 °C. The Cyclone V family is built on TSMC 28‑nm low‑power process technology and includes integrated hard IP such as transceivers and memory controllers across the series.

Key Features

• Logic Capacity  Approximately 301,000 logic elements for complex combinational and sequential designs.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
• I/O Density  224 user I/O pins to interface with peripherals, memory, and high-pin-count systems.
• Package and Mounting  484‑BGA (supplier package: 484‑FBGA 23×23) surface-mount package for compact board-level integration.
• Voltage and Power  Core voltage supply range of 1.07 V to 1.13 V consistent with low-power 28‑nm design practices.
• Temperature and Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for extended-environment deployments.
• Standards and Compliance  RoHS compliant material set for regulatory compatibility.
• Cyclone V Series Capabilities  Series-level features include 28‑nm low‑power process technology, integrated transceivers, hard memory controllers, and SoC-level HPS options for designs requiring processor integration (as documented for the Cyclone V family).

Typical Applications

• Industrial control and automation  Leverage high logic density and extended temperature range for motor control, machine vision preprocessing, and deterministic I/O handling.
• Communications infrastructure  Use embedded memory and series-level integrated transceivers and memory controllers for wireless and wireline data-path functions.
• Defense and ruggedized systems  Industrial-grade operation and robust I/O make the device suitable for military and mission-oriented subsystems requiring reliable logic and memory resources.

Unique Advantages

• High integration density: Approximately 301,000 logic elements and substantial on-chip RAM reduce external component count and simplify system architecture.
• Significant on-chip memory: Roughly 14.25 Mbits of embedded RAM supports packet buffering, lookup tables, and local data storage without immediate reliance on external memory.
• Wide industrial temperature range: Rated −40 °C to 100 °C for reliable operation in harsh and temperature-variable environments.
• Robust I/O resources: 224 I/O pins accommodate multi-channel interfaces, parallel peripherals, and broad sensor connectivity.
• Compact BGA footprint: 484‑BGA (23×23) package enables dense board layouts while providing the pin count necessary for complex systems.
• Low-voltage core: Core supply range of 1.07 V–1.13 V aligns with low-power design targets typical of the Cyclone V family.

Why Choose 5CEFA9F23I7N?

The 5CEFA9F23I7N combines high logic density, substantial embedded memory, and a wide operating temperature range in a compact 484‑BGA package, making it a practical choice for industrial, communications, and defense applications that demand reliable on-board processing and flexible I/O. Its low-voltage core and Cyclone V series heritage provide a path for designers seeking scalable FPGA resources and series-level integration options such as hard memory controllers and transceiver support.

This device is well suited to engineering teams who require a robust, RoHS‑compliant FPGA with significant logic and memory resources, industrial-grade thermal performance, and the package density needed for space-constrained PCBs.

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