5CEFA7U19I7N

The Intel Cyclone V E FPGA 5CEFA7U19I7N is an industrial-grade, surface-mount FPGA in a 484‑FBGA package designed for cost- and power-sensitive systems. It combines a high logic density of 149,500 logic elements with approximately 7.88 Mbits of embedded memory and 240 I/Os to support complex embedded logic, memory buffering, and multi‑interface designs.

Built on a low-power 28 nm process and supporting a core supply range of 1.07 V to 1.13 V (around a 1.1 V core), this device targets industrial, wireless/wireline and defense applications that require a balance of integration, I/O capacity, and extended temperature operation from -40 °C to 100 °C.

Key Features

• High Logic Density — 149,500 logic elements provide substantial programmable capacity for control, signal processing, and glue logic.
• Embedded Memory — Approximately 7.88 Mbits of on‑chip RAM for frame buffers, FIFOs, and local data storage.
• I/O and Packaging — 240 general-purpose I/Os in a 484‑FBGA (484‑UBGA 19×19) package, delivered in a surface-mount format for compact, board-level integration.
• Low-Voltage Core — Core supply range 1.07 V to 1.13 V (1.1 V class) optimized for low power operation on 28 nm process technology.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C for use in demanding environmental conditions.
• Family-Level Architecture — Cyclone V device features such as 8‑input adaptive logic modules, M10K memory blocks with ECC, and variable‑precision DSP blocks are available across the family to accelerate common FPGA tasks.
• Standards and Compliance — RoHS‑compliant manufacturing to support regulatory and assembly requirements.

Typical Applications

• Industrial Control and Automation — Implement real-time control logic, I/O expansion, and protocol bridging while meeting industrial temperature requirements.
• Wireless and Wireline Communications — Use embedded memory and DSP resources for packet buffering, protocol processing, and interface adaptation.
• Defense and Aerospace Systems — Deploy in environments that require rugged temperature ranges and high integration for custom signal processing and I/O aggregation.

Unique Advantages

• Substantial Programmable Capacity: 149,500 logic elements enable complex custom logic and system integration on a single device, reducing board-level component count.
• Integrated On-Chip Memory: Approximately 7.88 Mbits of embedded RAM provide local storage for buffering and state retention without external memory in many use cases.
• Flexible I/O and Compact Packaging: 240 I/Os in a 484‑FBGA (19×19) package deliver dense connectivity for multi‑interface designs in a compact surface-mount footprint.
• Low-Power 28 nm Technology: Built on a 28 nm low-power process with a ~1.1 V core supply range, enabling lower dynamic power for high-density logic implementations.
• Industrial Thermal Range: Rated from -40 °C to 100 °C to support deployment in harsh or temperature-variable installations.
• Regulatory and Assembly Friendly: RoHS compliance simplifies manufacturing and end-product declarations.

Why Choose 5CEFA7U19I7N?

The 5CEFA7U19I7N Cyclone V E FPGA offers a balanced combination of high programmable logic capacity, significant on‑chip memory, and plentiful I/O in a compact 484‑FBGA package. Its low-voltage 28 nm architecture and industrial temperature rating make it well suited to designs that demand energy-efficient, integrated solutions for communications, industrial automation, and defense applications.

For teams seeking scalability within the Cyclone V family, this device leverages family-level features—adaptive logic modules, M10K memory blocks, and DSP resources—to accelerate development and reduce system bill of materials while maintaining RoHS compliance.

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