5CEFA7U19C7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA |
|---|---|
| Quantity | 1,642 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7U19C7N – Cyclone® V E Field Programmable Gate Array (484‑FBGA)
The 5CEFA7U19C7N is an Intel Cyclone V E field programmable gate array supplied in a 484‑FBGA package with surface‑mount mounting. It delivers a high logic capacity and embedded memory suitable for cost‑sensitive, high‑volume designs that require significant on‑chip resources and flexible I/O.
Built on the Cyclone V device family architecture, this device targets applications that benefit from integrated FPGA fabric, substantial embedded memory, and a broad I/O count while operating within a commercial temperature range.
Key Features
- Logic Capacity Approximately 149,500 logic elements for implementing complex digital logic and control functions.
- Embedded Memory Approximately 7.88 Mbits of on‑chip RAM (7,880,704 total RAM bits) to support large buffering, state storage, and local data processing.
- I/O Resources 240 general‑purpose I/O pins to interface with peripherals, memory, and external devices.
- Power and Core Voltage Core voltage operating range of 1.07 V to 1.13 V, aligned with the Cyclone V family’s low‑power 28‑nm process characteristics.
- Package and Mounting 484‑FBGA package (supplier device package: 484‑UBGA, 19×19 mm) in a surface‑mount form factor for compact board integration.
- Operating Conditions Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial applications.
- RoHS Compliant RoHS‑compliant material status for regulatory and manufacturing compatibility.
- Cyclone V Family Integration Part of the Cyclone V family, which provides architecture features such as an enhanced ALM, M10K memory blocks, and family‑level support for integrated transceivers and hard memory controllers as outlined in the Cyclone V device documentation.
Typical Applications
- Industrial control Use for programmable logic in automation, motor control, and sensor aggregation where sizable logic and embedded memory are required.
- Wireless and wireline infrastructure Suitable for protocol handling, packet buffering, and front‑end logic in communications equipment that leverages on‑chip RAM and abundant I/O.
- Embedded systems and SoC integration Ideal for embedded designs that need configurable logic alongside ample memory and I/O for bridging processors, peripherals, and custom hardware accelerators.
- High‑volume, cost‑sensitive products Designed for production environments that prioritize low system cost and scalable device migration across Cyclone V densities.
Unique Advantages
- High logic density: Approximately 149,500 logic elements provide the headroom for complex state machines, datapaths, and control logic without external glue logic.
- Substantial embedded RAM: Approximately 7.88 Mbits of on‑chip RAM reduces dependence on external memory for buffering and temporary storage.
- Generous I/O count: 240 I/O pins enable flexible interfacing options for sensors, memory, and high‑pin‑count peripherals.
- Low core voltage operation: Narrow core voltage range (1.07–1.13 V) consistent with low‑power 28‑nm design practices to support power‑conscious systems.
- Surface‑mount 484‑FBGA package: Compact 484‑FBGA (484‑UBGA, 19×19 mm) packaging simplifies board layout for dense, space‑constrained designs.
- Family scalability: As a Cyclone V family device, it benefits from compatible package footprints and device migration options across family densities as described in Cyclone V documentation.
Why Choose 5CEFA7U19C7N?
The 5CEFA7U19C7N combines high logic capacity, multi‑megabit embedded RAM, and a large I/O complement in a commercial‑grade, surface‑mount 484‑FBGA package. It is well suited for engineers designing cost‑sensitive, high‑volume products that require substantial on‑chip resources and flexible interfacing.
As part of the Cyclone V family, this device provides architecture continuity and migration potential, enabling designers to scale designs within the family while leveraging documented device features and low‑power process advantages.
Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for 5CEFA7U19C7N. Our team can provide lead‑time estimates and support for your design needs.

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