5CEFA7U19C7N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Quantity 1,642 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CEFA7U19C7N – Cyclone® V E Field Programmable Gate Array (484‑FBGA)

The 5CEFA7U19C7N is an Intel Cyclone V E field programmable gate array supplied in a 484‑FBGA package with surface‑mount mounting. It delivers a high logic capacity and embedded memory suitable for cost‑sensitive, high‑volume designs that require significant on‑chip resources and flexible I/O.

Built on the Cyclone V device family architecture, this device targets applications that benefit from integrated FPGA fabric, substantial embedded memory, and a broad I/O count while operating within a commercial temperature range.

Key Features

  • Logic Capacity  Approximately 149,500 logic elements for implementing complex digital logic and control functions.
  • Embedded Memory  Approximately 7.88 Mbits of on‑chip RAM (7,880,704 total RAM bits) to support large buffering, state storage, and local data processing.
  • I/O Resources  240 general‑purpose I/O pins to interface with peripherals, memory, and external devices.
  • Power and Core Voltage  Core voltage operating range of 1.07 V to 1.13 V, aligned with the Cyclone V family’s low‑power 28‑nm process characteristics.
  • Package and Mounting  484‑FBGA package (supplier device package: 484‑UBGA, 19×19 mm) in a surface‑mount form factor for compact board integration.
  • Operating Conditions  Commercial grade operation from 0 °C to 85 °C for standard embedded and industrial applications.
  • RoHS Compliant  RoHS‑compliant material status for regulatory and manufacturing compatibility.
  • Cyclone V Family Integration  Part of the Cyclone V family, which provides architecture features such as an enhanced ALM, M10K memory blocks, and family‑level support for integrated transceivers and hard memory controllers as outlined in the Cyclone V device documentation.

Typical Applications

  • Industrial control  Use for programmable logic in automation, motor control, and sensor aggregation where sizable logic and embedded memory are required.
  • Wireless and wireline infrastructure  Suitable for protocol handling, packet buffering, and front‑end logic in communications equipment that leverages on‑chip RAM and abundant I/O.
  • Embedded systems and SoC integration  Ideal for embedded designs that need configurable logic alongside ample memory and I/O for bridging processors, peripherals, and custom hardware accelerators.
  • High‑volume, cost‑sensitive products  Designed for production environments that prioritize low system cost and scalable device migration across Cyclone V densities.

Unique Advantages

  • High logic density: Approximately 149,500 logic elements provide the headroom for complex state machines, datapaths, and control logic without external glue logic.
  • Substantial embedded RAM: Approximately 7.88 Mbits of on‑chip RAM reduces dependence on external memory for buffering and temporary storage.
  • Generous I/O count: 240 I/O pins enable flexible interfacing options for sensors, memory, and high‑pin‑count peripherals.
  • Low core voltage operation: Narrow core voltage range (1.07–1.13 V) consistent with low‑power 28‑nm design practices to support power‑conscious systems.
  • Surface‑mount 484‑FBGA package: Compact 484‑FBGA (484‑UBGA, 19×19 mm) packaging simplifies board layout for dense, space‑constrained designs.
  • Family scalability: As a Cyclone V family device, it benefits from compatible package footprints and device migration options across family densities as described in Cyclone V documentation.

Why Choose 5CEFA7U19C7N?

The 5CEFA7U19C7N combines high logic capacity, multi‑megabit embedded RAM, and a large I/O complement in a commercial‑grade, surface‑mount 484‑FBGA package. It is well suited for engineers designing cost‑sensitive, high‑volume products that require substantial on‑chip resources and flexible interfacing.

As part of the Cyclone V family, this device provides architecture continuity and migration potential, enabling designers to scale designs within the family while leveraging documented device features and low‑power process advantages.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering information for 5CEFA7U19C7N. Our team can provide lead‑time estimates and support for your design needs.

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