5CEFA7U19C8N

The 5CEFA7U19C8N is an Intel Cyclone® V E Field Programmable Gate Array in a 484-FBGA package. It combines a high logic capacity fabric with embedded memory and a broad I/O count to address cost-sensitive applications that require integration, moderate on-chip memory, and flexible I/O.

Built as part of the Cyclone V family, the device leverages the series’ low-power 28 nm process characteristics and system-level features such as integrated transceivers and hard memory controllers, making it suitable for applications across industrial, wireless/wireline, and military markets.

Key Features

• Logic Capacity — 149,500 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory — Approximately 7.88 Mbits of on-chip RAM (7,880,704 total RAM bits) for local data storage and buffering.
• I/O Count — 240 user I/O pins to support multiple external interfaces and peripherals.
• Package & Mounting — 484-FBGA (484-UBGA 19×19) surface-mount package for compact board-level integration.
• Voltage Supply — Core supply specified between 1.07 V and 1.13 V, aligning with Cyclone V device core requirements.
• Operating Temperature — Commercial temperature range: 0 °C to 85 °C for standard commercial deployments.
• Low-Power Process — Device family leverages TSMC 28-nm low-power (28LP) technology, supporting lower power operation compared with previous generations.
• On-chip IP and Memory Blocks — Includes Cyclone V device features such as enhanced 8-input adaptive logic modules and M10K memory blocks with soft error correction code (ECC).
• Integrated System Features — Cyclone V devices are enhanced with integrated transceivers and hard memory controllers to simplify high-bandwidth and memory-centric designs.
• RoHS Compliant — Part is RoHS compliant for environmental compliance in standard commercial assemblies.

Typical Applications

• Industrial Control — Implement motor control, data aggregation, and custom logic functions using abundant logic elements and on-chip memory.
• Wireless and Wireline Infrastructure — Use integrated transceivers and hard memory controllers for protocol handling and buffering in communications equipment.
• Military Systems — Deploy in commercial-temperature subsystems that require configurable logic, moderate embedded RAM, and flexible I/O.

Unique Advantages

• Integrated Memory and Logic: Large on-chip memory (≈7.88 Mbits) combined with 149,500 logic elements reduces external memory dependency and simplifies board design.
• High I/O Density: 240 I/O pins provide flexibility to interface with multiple peripherals, sensors, and external memory devices without immediate need for expansion logic.
• Compact, Surface-Mount Packaging: 484-FBGA (19×19) enables high-density PCB layouts while retaining a robust soldered connection for production assemblies.
• Commercial Temperature Suitability: Rated 0 °C to 85 °C for standard commercial deployments where this temperature range is required.
• Environmentally Compliant: RoHS compliance supports regulatory requirements for many commercial electronic products.
• Aligned with Low-Power Fabric: Core supply range (1.07–1.13 V) and 28 nm low-power technology target reduced core power for cost-sensitive applications.

Why Choose 5CEFA7U19C8N?

The 5CEFA7U19C8N provides a balanced combination of logic capacity, embedded memory, and high I/O count in a compact 484-FBGA package—making it suited for designs that need substantial programmable logic and local RAM without large board area or complex power requirements. Its alignment with Cyclone V family features (low-power process, integrated transceivers, and hard memory controllers) offers designers a path to reduce external components and accelerate system integration.

This part is ideal for commercial applications in industrial automation, communications infrastructure, and other areas where configurable logic, moderate on-chip memory, and a dense I/O complement are key selection criteria. Its RoHS compliance and standard commercial temperature rating support mainstream production and deployment needs.

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