5CEFA7U19A7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA |
|---|---|
| Quantity | 258 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-UBGA (19x19) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-FBGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 7880704 |
Overview of 5CEFA7U19A7N – Cyclone® V E Field Programmable Gate Array, 484-FBGA
The 5CEFA7U19A7N is a Cyclone V E series Field Programmable Gate Array (FPGA) in a 484-FBGA (484-UBGA 19×19) surface-mount package. It delivers a large programmable fabric — 149,500 logic elements — with substantial on-chip memory and I/O count for system-level integration.
Designed for markets that demand robust operation and integration, this device supports automotive qualification (AEC‑Q100) and an extended operating range of −40 °C to 125 °C. Its combination of logic capacity, approximately 7.88 Mbits of embedded memory, and 240 I/Os makes it suitable for compute- and I/O-intensive electronic control and communications applications.
Key Features
- Logic Capacity — 149,500 logic elements (LEs) for complex custom logic, state machines, and parallel data processing.
- Embedded Memory — Approximately 7.88 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
- I/O and Packaging — 240 user I/Os in a 484-FBGA (484-UBGA 19×19) surface-mount package for high-density board integration.
- Power and Core Voltage — Core supply voltage specified from 1.07 V to 1.13 V for compatibility with low-voltage system designs.
- Automotive Qualification & Temperature Range — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for temperature-demanding applications.
- Manufacturing & Compliance — Surface-mount package and RoHS-compliant construction.
- Cyclone V Architecture — Built on the Cyclone V device family architecture (28 nm low-power process), providing architectural features such as enhanced adaptive logic modules, embedded memory blocks, and family-level options for integrated hard IP (as described in the Cyclone V device documentation).
Typical Applications
- Automotive electronics — Electronic control units and domain controllers that require AEC‑Q100 qualification and extended temperature operation.
- Industrial control — Motor control, sensor aggregation, and industrial I/O systems that benefit from large logic capacity and robust thermal range.
- Wireless and wireline infrastructure — Control and data-path logic for communications equipment where on-chip memory and high I/O count support buffering and interfacing.
- Defense and ruggedized systems — Applications requiring reliable operation across wide temperatures and system-level programmability.
Unique Advantages
- High programmable density: 149,500 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
- Significant on-chip RAM: Approximately 7.88 Mbits of embedded memory supports local buffering and state storage without external memory dependency.
- Automotive-ready qualification: AEC‑Q100 qualification and −40 °C to 125 °C operation allow deployment in automotive and other temperature-demanding environments.
- Broad I/O capability: 240 I/Os in a compact 484-FBGA footprint help simplify system-level connectivity and routing.
- Low-voltage core operation: Narrow core voltage range (1.07 V to 1.13 V) supports efficient power delivery and predictable power budgeting.
- RoHS compliant: Environmentally compliant manufacturing supports regulatory requirements for product deployment.
Why Choose 5CEFA7U19A7N?
The 5CEFA7U19A7N combines substantial programmable logic resources, sizeable embedded memory, and a high I/O count in a qualified automotive package, making it well suited for designs that require integration, robustness, and predictable thermal performance. It is positioned for customers building systems where consolidation of control, I/O, and data-path logic into a single FPGA reduces BOM and simplifies board design.
Engineers developing automotive, industrial, communications, or rugged embedded systems will find this Cyclone V E device provides a balanced set of capabilities for long-term deployment, with family-level architecture and documentation to support development and scaling.
Request a quote or submit an inquiry to get pricing, availability, and ordering information for the 5CEFA7U19A7N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018