5CEFA7U19A7N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Quantity 258 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits7880704

Overview of 5CEFA7U19A7N – Cyclone® V E Field Programmable Gate Array, 484-FBGA

The 5CEFA7U19A7N is a Cyclone V E series Field Programmable Gate Array (FPGA) in a 484-FBGA (484-UBGA 19×19) surface-mount package. It delivers a large programmable fabric — 149,500 logic elements — with substantial on-chip memory and I/O count for system-level integration.

Designed for markets that demand robust operation and integration, this device supports automotive qualification (AEC‑Q100) and an extended operating range of −40 °C to 125 °C. Its combination of logic capacity, approximately 7.88 Mbits of embedded memory, and 240 I/Os makes it suitable for compute- and I/O-intensive electronic control and communications applications.

Key Features

  • Logic Capacity — 149,500 logic elements (LEs) for complex custom logic, state machines, and parallel data processing.
  • Embedded Memory — Approximately 7.88 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage.
  • I/O and Packaging — 240 user I/Os in a 484-FBGA (484-UBGA 19×19) surface-mount package for high-density board integration.
  • Power and Core Voltage — Core supply voltage specified from 1.07 V to 1.13 V for compatibility with low-voltage system designs.
  • Automotive Qualification & Temperature Range — AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for temperature-demanding applications.
  • Manufacturing & Compliance — Surface-mount package and RoHS-compliant construction.
  • Cyclone V Architecture — Built on the Cyclone V device family architecture (28 nm low-power process), providing architectural features such as enhanced adaptive logic modules, embedded memory blocks, and family-level options for integrated hard IP (as described in the Cyclone V device documentation).

Typical Applications

  • Automotive electronics — Electronic control units and domain controllers that require AEC‑Q100 qualification and extended temperature operation.
  • Industrial control — Motor control, sensor aggregation, and industrial I/O systems that benefit from large logic capacity and robust thermal range.
  • Wireless and wireline infrastructure — Control and data-path logic for communications equipment where on-chip memory and high I/O count support buffering and interfacing.
  • Defense and ruggedized systems — Applications requiring reliable operation across wide temperatures and system-level programmability.

Unique Advantages

  • High programmable density: 149,500 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
  • Significant on-chip RAM: Approximately 7.88 Mbits of embedded memory supports local buffering and state storage without external memory dependency.
  • Automotive-ready qualification: AEC‑Q100 qualification and −40 °C to 125 °C operation allow deployment in automotive and other temperature-demanding environments.
  • Broad I/O capability: 240 I/Os in a compact 484-FBGA footprint help simplify system-level connectivity and routing.
  • Low-voltage core operation: Narrow core voltage range (1.07 V to 1.13 V) supports efficient power delivery and predictable power budgeting.
  • RoHS compliant: Environmentally compliant manufacturing supports regulatory requirements for product deployment.

Why Choose 5CEFA7U19A7N?

The 5CEFA7U19A7N combines substantial programmable logic resources, sizeable embedded memory, and a high I/O count in a qualified automotive package, making it well suited for designs that require integration, robustness, and predictable thermal performance. It is positioned for customers building systems where consolidation of control, I/O, and data-path logic into a single FPGA reduces BOM and simplifies board design.

Engineers developing automotive, industrial, communications, or rugged embedded systems will find this Cyclone V E device provides a balanced set of capabilities for long-term deployment, with family-level architecture and documentation to support development and scaling.

Request a quote or submit an inquiry to get pricing, availability, and ordering information for the 5CEFA7U19A7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up