5CEFA7M15C6N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-LFBGA |
|---|---|
| Quantity | 1,054 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-MBGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7M15C6N – Cyclone® V E Field Programmable Gate Array (FPGA) IC
The 5CEFA7M15C6N is an Intel Cyclone V E series FPGA delivered in a 484-LFBGA (484-MBGA, 15×15) package. It combines a high logic capacity with substantial on-chip memory and a broad I/O count, making it suitable for cost- and power-sensitive designs that require programmable logic and interface flexibility.
As a member of the Cyclone V family, this device benefits from the series-level architecture built on TSMC's 28 nm low-power process technology and family features such as enhanced adaptive logic modules and embedded memory building blocks. Its combination of 149,500 logic elements, approximately 7.88 Mbits of embedded memory, and 240 I/Os targets applications that need integration, bandwidth, and low-voltage operation.
Key Features
- Logic Capacity 149,500 logic elements provide a large, flexible FPGA fabric for complex digital logic, control, and glue-logic functions.
- Embedded Memory Approximately 7.88 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive logic without relying solely on external memory.
- I/O and Package 240 general-purpose I/Os in a compact 484-LFBGA (484-MBGA, 15×15) surface-mount package for space-constrained board layouts.
- Power and Voltage Core voltage supply range specified at 1.07 V to 1.13 V to support low-voltage operation in power-sensitive systems.
- Process and Architecture (series-level) Cyclone V family architecture built on TSMC 28 nm low-power (28LP) process technology and featuring enhanced adaptive logic modules and embedded memory block structures.
- Operating Conditions Commercial-grade operation with an ambient temperature range of 0 °C to 85 °C and RoHS compliance.
- Mounting Surface-mount device in a ball-grid array package suitable for modern PCB assembly.
Typical Applications
- Wireless and Wireline Infrastructure Implements protocol offload, packet processing, and interface bridging where programmable logic and moderate on-chip memory accelerate data paths.
- Embedded SoC and Control Supports custom logic for embedded systems, offloading deterministic tasks and interfacing with processors or peripherals.
- Consumer and Networking Devices Enables feature-rich designs that require flexible I/O, local buffering, and programmable acceleration in a compact package.
- Prototyping and OEM FPGA Designs Offers a high-logic-count FPGA for validating system architectures and integrating multiple functions into a single programmable device.
Unique Advantages
- High logic density: 149,500 logic elements allow complex designs and multiple concurrent functions on a single device.
- Substantial on-chip RAM: Approximately 7.88 Mbits of embedded memory reduces dependence on external memory for buffering and local data storage.
- Versatile I/O in a compact footprint: 240 I/Os in a 15×15 mm BGA package provide broad connectivity while maintaining a small board area.
- Low-voltage core operation: A defined supply window of 1.07 V to 1.13 V supports designs targeting reduced power consumption.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match mainstream electronics and consumer applications.
- RoHS compliant: Meets environmental directives for lead-free manufacturing and assembly.
Why Choose 5CEFA7M15C6N?
The 5CEFA7M15C6N delivers a balance of logic capacity, embedded memory, and I/O flexibility in a compact surface-mount BGA package. It is well suited for developers and OEMs who need a programmable solution that supports substantial on-chip resources and a low-voltage core for efficient system designs.
As part of the Cyclone V family, the device aligns with a documented FPGA architecture based on 28 nm low-power process technology, enabling designers to leverage series-level features such as enhanced adaptive logic modules and embedded memory configurations while meeting commercial temperature and RoHS requirements.
Request a quote or submit an inquiry for pricing and availability of the 5CEFA7M15C6N to evaluate suitability for your next design.

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