5CEFA7F31C6N

The 5CEFA7F31C6N is a Cyclone V E series FPGA in an 896-BGA (896-FBGA, 31×31) surface-mount package. It combines a high logic capacity FPGA fabric with embedded memory and a broad I/O count to address high-volume, cost-sensitive designs such as wireless and wireline systems and other embedded applications.

Built around a low-voltage core and designed for commercial-temperature operation, this device targets applications that require substantial on-chip logic, a large number of I/Os, and integrated memory resources while maintaining a small board footprint.

Key Features

• Logic Capacity — 149,500 logic elements providing significant programmable fabric for complex logic, control, and processing functions.
• On-chip Memory — Approximately 7.88 Mbits of embedded memory (total RAM bits: 7,880,704) with support for embedded memory block types referenced in the Cyclone V family.
• I/O Density — 480 general-purpose I/Os to support wide external interfacing, parallel buses, and mixed-signal front-end connections.
• High-density Packaging — 896-BGA (supplier package: 896-FBGA, 31×31) surface-mount package for high pin-count designs in a compact footprint.
• Core Voltage — Narrow core supply range of 1.07 V to 1.13 V (nominal 1.1 V) enabling predictable power budgeting for system design.
• Commercial Temperature Range — Rated for 0 °C to 85 °C operation suitable for standard commercial applications.
• Low-power Process Technology (device family) — Cyclone V devices are built on a 28 nm low-power process and include architecture features such as enhanced ALMs and embedded memory blocks.
• Integrated I/O and Hard IP (series-level) — The Cyclone V family supports integrated transceivers and hard memory controllers as part of its device feature set.
• Compliance — RoHS-compliant.

Typical Applications

• Wireless and Wireline Systems — Implement protocol engines, data-path logic, and custom interfacing where large logic resources and plentiful I/Os are required.
• Embedded Processing and SoC Designs — Use the FPGA fabric and embedded memory for offload, preprocessing, and custom accelerators in embedded platforms.
• High-density Interface Aggregation — Aggregate multiple high-pin-count interfaces and bridge disparate bus standards using the device’s 480 I/Os.

Unique Advantages

• Substantial Logic Resource: 149,500 logic elements enable complex state machines, datapaths, and custom accelerators without external ASICs.
• Large On-chip Memory: Approximately 7.88 Mbits of embedded memory reduces dependency on external memory for buffering and intermediate storage.
• High I/O Count in a Compact Package: 480 I/Os in an 896-BGA package provide a high pin density while minimizing board area.
• Predictable Power Envelope: Narrow core voltage range (1.07–1.13 V) simplifies power-supply design and thermal planning for commercial deployments.
• Surface-mount, RoHS-compliant Packaging: 896-FBGA (31×31) surface-mount package supports standard PCB assembly flows and regulatory compliance for lead-free designs.
• Commercial-temperature Operation: Rated 0 °C to 85 °C for consistent behavior across typical commercial environments.

Why Choose 5CEFA7F31C6N?

The 5CEFA7F31C6N delivers a balanced combination of large programmable logic capacity, ample embedded memory, and a high I/O count packaged in a compact 896-BGA footprint. It is well suited to designers who need significant on-chip resources for protocol handling, data-path acceleration, and high-density interfacing while maintaining predictable power and thermal characteristics under commercial operating conditions.

For teams building cost-sensitive, high-volume solutions where board space and integration are critical, this Cyclone V E device offers a scalable, fabric-based platform that aligns with established development flows and the Cyclone V device feature set.

Request a quote or submit an inquiry to get pricing, availability, and lead-time information for part number 5CEFA7F31C6N.