5CEFA7F27I7N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Quantity 867 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CEFA7F27I7N – Cyclone V E FPGA, 149,500 logic elements, 672‑BGA

The 5CEFA7F27I7N is an Intel Cyclone® V E field-programmable gate array (FPGA) in a 672‑FBGA (27×27) package, offered in an industrial grade. It combines a high-density programmable fabric with on-chip embedded memory, I/O capacity and power-optimized silicon to address applications that require programmable logic, system integration, and low power operation.

Designed for industrial, wireless/wireline, military, and automotive market segments, this device targets high-bandwidth and cost-sensitive systems by integrating transceivers, hard memory controllers, and other hard IP alongside the FPGA fabric.

Key Features

  • High-density programmable fabric — 149,500 logic elements for complex custom logic and system integration.
  • Embedded memory — approximately 7.88 Mbits of on-chip RAM implemented in M10K memory blocks with soft error correction code (ECC) support referenced in the Cyclone V family documentation.
  • Advanced ALM and DSP support — enhanced 8‑input adaptive logic module (ALM) architecture and variable‑precision DSP blocks described for Cyclone V devices to support efficient logic and signal processing implementations.
  • Transceivers and high-bandwidth IP — integrated transceivers (documented at 3.125 Gbps and 6.144 Gbps in Cyclone V family literature) and hard memory controllers for external memory interfaces and high-throughput designs.
  • Hard Processor System (HPS) option — Cyclone V family devices include an available HPS with an integrated Arm Cortex‑A9 MPCore processor and tight FPGA/HPS integration where applicable.
  • I/O and package — 336 user I/O pins and a 672‑FBGA (27×27) package suitable for surface-mount assembly.
  • Power and voltage — specified core supply range of 1.07 V to 1.13 V consistent with the Cyclone V 1.1 V core architecture.
  • Industrial temperature range — rated for operation from −40 °C to 100 °C.
  • Regulatory — RoHS-compliant.
  • Configuration and flexibility — Cyclone V family features such as Configuration via Protocol (CvP), dynamic and partial reconfiguration are documented for enhanced system flexibility.

Typical Applications

  • Industrial control and automation — implement motor control, sensor aggregation, and custom logic processing using the device’s industrial temperature rating and abundant logic resources.
  • Communications and networking — use integrated transceivers and hard memory controllers for packet processing, line-side interfaces, and protocol offload functions.
  • Embedded SoC designs — combine programmable fabric with a Hard Processor System (HPS) option for tightly integrated processor+FPGA systems handling real-time control and application processing.
  • Test and measurement — leverage high I/O count and configurable logic to build flexible data acquisition and signal conditioning front-ends.

Unique Advantages

  • Large programmable capacity: 149,500 logic elements enable implementation of complex custom functions and multi-module systems on a single device, reducing system BOM.
  • Substantial on-chip memory: approximately 7.88 Mbits of embedded RAM supports buffering, packet queues, and on-chip data structures to improve throughput and reduce external memory dependence.
  • Integrated high-speed features: documented transceivers and hard memory controllers provide off-the-shelf building blocks for high-bandwidth interfaces and external memory subsystems.
  • Industrial robustness: specified operation from −40 °C to 100 °C and surface-mount 672‑FBGA packaging support deployment in temperature-challenging environments.
  • Power-optimized architecture: built around a 1.1 V core voltage and 28‑nm low-power family technology referenced in Cyclone V materials to help manage system power budgets.
  • Flexible configuration: family-level features like CvP and partial/dynamic reconfiguration enable field updates and design modularity.

Why Choose 5CEFA7F27I7N?

The 5CEFA7F27I7N delivers a balance of density, embedded memory, I/O capacity and industrial temperature range, making it suitable for engineers building cost-sensitive, high-bandwidth and ruggedized systems. Its Cyclone V family heritage provides documented low-power architecture, integrated transceivers and hard IP that simplify system design and accelerate time-to-market.

Choose this device when your design requires significant programmable logic, substantial on-chip RAM, a high I/O count and options for processor integration, all within a surface-mount 672‑FBGA footprint and an industrial operating window.

Request a quote or submit a pricing and availability inquiry to evaluate 5CEFA7F27I7N for your next design.

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