5CEFA7F27I7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA |
|---|---|
| Quantity | 867 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7F27I7N – Cyclone V E FPGA, 149,500 logic elements, 672‑BGA
The 5CEFA7F27I7N is an Intel Cyclone® V E field-programmable gate array (FPGA) in a 672‑FBGA (27×27) package, offered in an industrial grade. It combines a high-density programmable fabric with on-chip embedded memory, I/O capacity and power-optimized silicon to address applications that require programmable logic, system integration, and low power operation.
Designed for industrial, wireless/wireline, military, and automotive market segments, this device targets high-bandwidth and cost-sensitive systems by integrating transceivers, hard memory controllers, and other hard IP alongside the FPGA fabric.
Key Features
- High-density programmable fabric — 149,500 logic elements for complex custom logic and system integration.
- Embedded memory — approximately 7.88 Mbits of on-chip RAM implemented in M10K memory blocks with soft error correction code (ECC) support referenced in the Cyclone V family documentation.
- Advanced ALM and DSP support — enhanced 8‑input adaptive logic module (ALM) architecture and variable‑precision DSP blocks described for Cyclone V devices to support efficient logic and signal processing implementations.
- Transceivers and high-bandwidth IP — integrated transceivers (documented at 3.125 Gbps and 6.144 Gbps in Cyclone V family literature) and hard memory controllers for external memory interfaces and high-throughput designs.
- Hard Processor System (HPS) option — Cyclone V family devices include an available HPS with an integrated Arm Cortex‑A9 MPCore processor and tight FPGA/HPS integration where applicable.
- I/O and package — 336 user I/O pins and a 672‑FBGA (27×27) package suitable for surface-mount assembly.
- Power and voltage — specified core supply range of 1.07 V to 1.13 V consistent with the Cyclone V 1.1 V core architecture.
- Industrial temperature range — rated for operation from −40 °C to 100 °C.
- Regulatory — RoHS-compliant.
- Configuration and flexibility — Cyclone V family features such as Configuration via Protocol (CvP), dynamic and partial reconfiguration are documented for enhanced system flexibility.
Typical Applications
- Industrial control and automation — implement motor control, sensor aggregation, and custom logic processing using the device’s industrial temperature rating and abundant logic resources.
- Communications and networking — use integrated transceivers and hard memory controllers for packet processing, line-side interfaces, and protocol offload functions.
- Embedded SoC designs — combine programmable fabric with a Hard Processor System (HPS) option for tightly integrated processor+FPGA systems handling real-time control and application processing.
- Test and measurement — leverage high I/O count and configurable logic to build flexible data acquisition and signal conditioning front-ends.
Unique Advantages
- Large programmable capacity: 149,500 logic elements enable implementation of complex custom functions and multi-module systems on a single device, reducing system BOM.
- Substantial on-chip memory: approximately 7.88 Mbits of embedded RAM supports buffering, packet queues, and on-chip data structures to improve throughput and reduce external memory dependence.
- Integrated high-speed features: documented transceivers and hard memory controllers provide off-the-shelf building blocks for high-bandwidth interfaces and external memory subsystems.
- Industrial robustness: specified operation from −40 °C to 100 °C and surface-mount 672‑FBGA packaging support deployment in temperature-challenging environments.
- Power-optimized architecture: built around a 1.1 V core voltage and 28‑nm low-power family technology referenced in Cyclone V materials to help manage system power budgets.
- Flexible configuration: family-level features like CvP and partial/dynamic reconfiguration enable field updates and design modularity.
Why Choose 5CEFA7F27I7N?
The 5CEFA7F27I7N delivers a balance of density, embedded memory, I/O capacity and industrial temperature range, making it suitable for engineers building cost-sensitive, high-bandwidth and ruggedized systems. Its Cyclone V family heritage provides documented low-power architecture, integrated transceivers and hard IP that simplify system design and accelerate time-to-market.
Choose this device when your design requires significant programmable logic, substantial on-chip RAM, a high I/O count and options for processor integration, all within a surface-mount 672‑FBGA footprint and an industrial operating window.
Request a quote or submit a pricing and availability inquiry to evaluate 5CEFA7F27I7N for your next design.

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