5CEFA7F27C7N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Quantity 269 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CEFA7F27C7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC, 672‑BGA

The 5CEFA7F27C7N is a Cyclone® V E family Field Programmable Gate Array (FPGA) in a 672‑ball BGA package. It combines high logic capacity, embedded memory, and plentiful I/O in a compact surface‑mount package for commercial embedded and communications designs.

Built on the Cyclone V device architecture, this device targets applications that require significant programmable logic and on‑chip memory while maintaining low power operation and system integration through family-level features such as 28‑nm low‑power process technology and integrated transceiver and memory controller capabilities.

Key Features

  • Logic Capacity — 149,500 logic elements suitable for complex programmable logic, control and signal‑processing tasks.
  • On‑chip Memory — Approximately 7.88 Mbits of embedded memory to support buffers, state machines and local data storage.
  • I/O Density — 336 I/O pins to connect sensors, peripherals, and external memory or interfaces without additional expanders.
  • Package & Mounting — 672‑BGA (supplier package: 672‑FBGA 27×27) in a surface‑mount format for compact board implementations.
  • Power — Core supply range specified at 1.07 V to 1.13 V; aligns with Cyclone V family low‑power design practices.
  • Operating Range & Grade — Commercial grade with an operating temperature of 0 °C to 85 °C for standard embedded and communications environments.
  • Environmental Compliance — RoHS‑compliant to meet modern lead‑free assembly and regulatory requirements.
  • Family‑level Integration — Cyclone V family features include TSMC 28 nm low‑power (28LP) process technology and integrated hard IP such as transceivers and memory controllers as documented for the device family.

Typical Applications

  • Industrial Control — High logic count and embedded memory support motor control, motor drives, PLC functions and protocol bridging while maintaining compact PCB footprints.
  • Wireless & Wireline Infrastructure — Family‑level integrated transceivers and hard memory controller capabilities make the device suitable for baseband processing, fronthaul/backhaul logic and packet handling.
  • Defense & Military Systems — Programmable logic and abundant I/O enable custom I/O aggregation, data acquisition and real‑time processing in mission systems that require reconfigurable hardware.
  • Embedded SoC Integration — Dense logic and memory allow implementation of custom accelerators, protocol stacks, and interface logic alongside system processors in FPGA‑centric designs.

Unique Advantages

  • Substantial logic resource — 149,500 logic elements let designers implement large custom datapaths and control logic without immediate migration to higher‑end parts.
  • Significant on‑chip memory — Approximately 7.88 Mbits of embedded memory reduces dependence on external RAM for many buffering and state‑storage needs.
  • High I/O count — 336 I/O pins enable dense peripheral and interface connectivity, simplifying board design and reducing external multiplexing.
  • Compact BGA footprint — 672‑BGA (672‑FBGA 27×27) provides a high‑pin‑count option in a manageable package for space‑constrained PCBs.
  • Commercial temperature and RoHS compliant — Designed for standard commercial environments and compliant with lead‑free assembly requirements.
  • Family architecture benefits — Leverages Cyclone V family characteristics such as 28‑nm low‑power process and integrated hard IP to balance performance and power.

Why Choose 5CEFA7F27C7N?

The 5CEFA7F27C7N delivers a balanced combination of high logic density, substantial embedded memory and robust I/O in a single commercial‑grade, surface‑mount BGA package. It is suited to engineers designing medium‑to‑high complexity FPGA implementations that require on‑chip memory and flexible interfacing while remaining mindful of board space and power.

For designs that benefit from Cyclone V family capabilities—such as low‑power 28‑nm process attributes and integrated hard IP—this device offers a scalable platform that fits a wide range of embedded, communications, and defense applications where reconfigurability and integration reduce system BOM and development time.

Request a quote or submit an availability inquiry to discuss pricing, lead times and purchasing options for the 5CEFA7F27C7N.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up