5CEFA7F27C7N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA |
|---|---|
| Quantity | 269 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7F27C7N – Cyclone® V E Field Programmable Gate Array (FPGA) IC, 672‑BGA
The 5CEFA7F27C7N is a Cyclone® V E family Field Programmable Gate Array (FPGA) in a 672‑ball BGA package. It combines high logic capacity, embedded memory, and plentiful I/O in a compact surface‑mount package for commercial embedded and communications designs.
Built on the Cyclone V device architecture, this device targets applications that require significant programmable logic and on‑chip memory while maintaining low power operation and system integration through family-level features such as 28‑nm low‑power process technology and integrated transceiver and memory controller capabilities.
Key Features
- Logic Capacity — 149,500 logic elements suitable for complex programmable logic, control and signal‑processing tasks.
- On‑chip Memory — Approximately 7.88 Mbits of embedded memory to support buffers, state machines and local data storage.
- I/O Density — 336 I/O pins to connect sensors, peripherals, and external memory or interfaces without additional expanders.
- Package & Mounting — 672‑BGA (supplier package: 672‑FBGA 27×27) in a surface‑mount format for compact board implementations.
- Power — Core supply range specified at 1.07 V to 1.13 V; aligns with Cyclone V family low‑power design practices.
- Operating Range & Grade — Commercial grade with an operating temperature of 0 °C to 85 °C for standard embedded and communications environments.
- Environmental Compliance — RoHS‑compliant to meet modern lead‑free assembly and regulatory requirements.
- Family‑level Integration — Cyclone V family features include TSMC 28 nm low‑power (28LP) process technology and integrated hard IP such as transceivers and memory controllers as documented for the device family.
Typical Applications
- Industrial Control — High logic count and embedded memory support motor control, motor drives, PLC functions and protocol bridging while maintaining compact PCB footprints.
- Wireless & Wireline Infrastructure — Family‑level integrated transceivers and hard memory controller capabilities make the device suitable for baseband processing, fronthaul/backhaul logic and packet handling.
- Defense & Military Systems — Programmable logic and abundant I/O enable custom I/O aggregation, data acquisition and real‑time processing in mission systems that require reconfigurable hardware.
- Embedded SoC Integration — Dense logic and memory allow implementation of custom accelerators, protocol stacks, and interface logic alongside system processors in FPGA‑centric designs.
Unique Advantages
- Substantial logic resource — 149,500 logic elements let designers implement large custom datapaths and control logic without immediate migration to higher‑end parts.
- Significant on‑chip memory — Approximately 7.88 Mbits of embedded memory reduces dependence on external RAM for many buffering and state‑storage needs.
- High I/O count — 336 I/O pins enable dense peripheral and interface connectivity, simplifying board design and reducing external multiplexing.
- Compact BGA footprint — 672‑BGA (672‑FBGA 27×27) provides a high‑pin‑count option in a manageable package for space‑constrained PCBs.
- Commercial temperature and RoHS compliant — Designed for standard commercial environments and compliant with lead‑free assembly requirements.
- Family architecture benefits — Leverages Cyclone V family characteristics such as 28‑nm low‑power process and integrated hard IP to balance performance and power.
Why Choose 5CEFA7F27C7N?
The 5CEFA7F27C7N delivers a balanced combination of high logic density, substantial embedded memory and robust I/O in a single commercial‑grade, surface‑mount BGA package. It is suited to engineers designing medium‑to‑high complexity FPGA implementations that require on‑chip memory and flexible interfacing while remaining mindful of board space and power.
For designs that benefit from Cyclone V family capabilities—such as low‑power 28‑nm process attributes and integrated hard IP—this device offers a scalable platform that fits a wide range of embedded, communications, and defense applications where reconfigurability and integration reduce system BOM and development time.
Request a quote or submit an availability inquiry to discuss pricing, lead times and purchasing options for the 5CEFA7F27C7N.

Date Founded: 1968
Headquarters: Santa Clara, California, USA
Employees: 130,000+
Revenue: $54.23 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018