5CEFA7F27I7

The 5CEFA7F27I7 is an Intel Cyclone V E family FPGA in a 672-ball BGA package, built for industrial applications that require programmable logic, on-chip memory, and substantial I/O density. This device delivers 149,500 logic elements and approximately 7.88 Mbits of embedded memory, making it suitable for complex control, signal processing, and communications tasks where integration and deterministic hardware behavior matter.

Packaged for surface-mount assembly with a 672-FBGA (27×27) footprint, the device operates over a -40 °C to 100 °C range and runs from a core supply between 1.07 V and 1.13 V, offering a compact, industrial-grade building block for embedded system designs.

Key Features

• Logic Capacity  149,500 logic elements provide the programmable fabric to implement substantial custom logic, state machines, and datapaths.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM for buffering, lookup tables, and state storage to support high‑throughput data handling.
• I/O Density  336 general-purpose I/O pins support wide parallel interfaces and multiple peripheral connections from a single device.
• Package & Mounting  672-BGA package (supplier device package: 672-FBGA, 27×27) optimized for surface-mount PCB assembly and compact board layouts.
• Power  Core supply range of 1.07 V to 1.13 V aligns with modern low-voltage FPGA system designs.
• Operating Range  Industrial-grade operating temperature from -40 °C to 100 °C for deployment in demanding environments.
• Compliance  RoHS-compliant device meeting common environmental requirements for commercial and industrial production.
• Cyclone V Family Capabilities  As part of the Cyclone V device family, the series includes architecture-level features such as integrated transceivers and hard memory controller options useful for communication and external memory interfaces (series-level information).

Typical Applications

• Industrial Control  Implement motor control, motor drives, PLC logic, and deterministic I/O handling with the device’s large logic capacity and industrial temperature rating.
• Wireless & Wireline Communications  Use on-chip memory and the Cyclone V family’s transceiver and memory-controller capabilities for packet buffering, protocol bridging, and interface adaptation.
• Defense & Aerospace Signal Processing  Deploy in military and aerospace subsystems requiring programmable acceleration, custom DSP pipelines, and rugged operating temperature support.
• Embedded System Integration  Consolidate multiple glue-logic and peripheral functions into a single FPGA to reduce PCB complexity and BOM for embedded appliances and instrumentation.

Unique Advantages

• High logic density: 149,500 logic elements enable substantial integration of custom logic and combinational/sequential functions on a single device.
• Significant on-chip memory: Approximately 7.88 Mbits of embedded RAM reduces reliance on external memory for buffering and state storage, simplifying design and improving latency.
• Broad I/O count: 336 I/Os provide flexibility for parallel interfaces, multiple serial links, and mixed-signal front-end connections without external multiplexing.
• Industrial operating range: Rated from -40 °C to 100 °C to meet temperature demands of factory-floor, field, and ruggedized systems.
• Compact BGA package: 672-FBGA (27×27) lets you pack high logic and I/O density into a small PCB area for space-constrained designs.
• Manufacturer backing: Part of the Intel Cyclone V family, leveraging family-level features and documentation for design migration and system scalability.

Why Choose 5CEFA7F27I7?

The 5CEFA7F27I7 combines large programmable logic capacity, substantial embedded memory, and high I/O count in an industrial-grade, surface-mount 672-BGA package. It is well suited to designers who need a single-component solution to consolidate control logic, buffering, and interface functions while maintaining operating margin across a wide temperature range.

As a Cyclone V family device from Intel, it benefits from the series’ architecture choices that support integration and migration between device densities, helping teams scale designs and leverage existing development assets over the product lifecycle.

Request a quote or submit a pricing inquiry to evaluate the 5CEFA7F27I7 for your next design and get assistance with availability and lead time information.