5CEFA7F27C8N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA

Quantity 1,204 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CEFA7F27C8N – Cyclone® V E Field Programmable Gate Array (FPGA) 336 I/O, 672-BGA

The 5CEFA7F27C8N is a Cyclone® V E-series field programmable gate array (FPGA) from Intel, delivered in a 672-ball BGA package for surface-mount assembly. It combines a high logic capacity with substantial on-chip memory and dense I/O, making it suitable for applications that require integration of logic, memory, and interface functions within a commercial-temperature, low-voltage FPGA platform.

As part of the Cyclone V family, this device targets markets that demand power-conscious programmable logic with integrated transceivers and hard memory controllers, supporting use in industrial, wireless/wireline and military applications where commercial-grade temperature and supply ranges are acceptable.

Key Features

  • Core & process  Built on TSMC 28-nm low-power (28LP) process technology with a 1.1 V core architecture; this device lists a supply range of 1.07 V to 1.13 V.
  • Logic capacity  Approximately 149,500 logic elements for implementing complex programmable logic and control functions.
  • Embedded memory  Approximately 7.88 Mbits of on-chip RAM (7,880,704 total RAM bits) to support buffering, tables, and local data storage.
  • I/O and package  336 user I/O pins and a 672-ball FBGA package (27 × 27 mm footprint) optimized for high-density board designs; surface-mount package case.
  • Integration & interfaces  Cyclone V family devices feature integrated transceivers and hard memory controllers; the family also includes variable-precision DSP blocks and M10K embedded memory block types as described in the device overview.
  • Power and thermal  Commercial-grade operating temperature range of 0 °C to 85 °C and a defined core supply window of 1.07 V–1.13 V to guide power delivery and thermal design.
  • Standards and compliance  RoHS-compliant for environmental and regulatory consistency in mainstream electronic assemblies.

Typical Applications

  • Industrial control  Implement motor control, sensor aggregation, and deterministic logic functions using the device’s large logic element count and on-chip memory.
  • Telecom and wireline systems  Use the Cyclone V family’s integrated transceiver and memory controller capabilities to manage packet buffering, protocol bridging, and interface logic.
  • Wireless infrastructure  Apply variable-precision DSP blocks and embedded memory for signal processing blocks, filtering, and intermediate buffering.
  • Embedded compute and I/O consolidation  Consolidate glue logic, protocol translation, and I/O multiplexing for compact system designs that benefit from high I/O density and embedded RAM.

Unique Advantages

  • High integration in a single device: Reduces BOM and board area by combining substantial logic elements, embedded memory, and dense I/O in a single 672-FBGA package.
  • Low-voltage core operation: Narrow supply window (1.07 V–1.13 V) aligned with 28-nm low-power process enables focused power delivery and efficient thermal design.
  • Strong on-chip memory resource: Approximately 7.88 Mbits of embedded RAM provides local buffering and state storage without external memory for many use cases.
  • Commercial-temperature suitability: Rated for 0 °C to 85 °C to match a wide range of general-purpose electronic applications.
  • RoHS-compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose 5CEFA7F27C8N?

The 5CEFA7F27C8N delivers a balanced combination of logic capacity, embedded memory, and dense I/O in a compact 672-BGA footprint, making it appropriate for designs that need significant programmable logic and local memory without expanding board area. Its low-voltage, 28-nm process heritage and Cyclone V family capabilities (including integrated transceiver and hard memory controller options at the family level) provide a path to efficient, integrated system designs.

This device is well suited for engineering teams designing commercial-temperature embedded systems that require strong on-chip resources, high I/O count, and a RoHS-compliant component for production. It offers scalability within the Cyclone V family for projects that may grow in logic or interface complexity over time.

Request a quote or submit your requirements to receive pricing and availability information for the 5CEFA7F27C8N. Our team can provide lead-time details and assist with evaluating the device for your design.

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