5CEFA7F27C8N
| Part Description |
Cyclone® V E Field Programmable Gate Array (FPGA) IC 336 7880704 149500 672-BGA |
|---|---|
| Quantity | 1,204 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 672-FBGA (27x27) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 672-BGA | Number of I/O | 336 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CEFA7F27C8N – Cyclone® V E Field Programmable Gate Array (FPGA) 336 I/O, 672-BGA
The 5CEFA7F27C8N is a Cyclone® V E-series field programmable gate array (FPGA) from Intel, delivered in a 672-ball BGA package for surface-mount assembly. It combines a high logic capacity with substantial on-chip memory and dense I/O, making it suitable for applications that require integration of logic, memory, and interface functions within a commercial-temperature, low-voltage FPGA platform.
As part of the Cyclone V family, this device targets markets that demand power-conscious programmable logic with integrated transceivers and hard memory controllers, supporting use in industrial, wireless/wireline and military applications where commercial-grade temperature and supply ranges are acceptable.
Key Features
- Core & process Built on TSMC 28-nm low-power (28LP) process technology with a 1.1 V core architecture; this device lists a supply range of 1.07 V to 1.13 V.
- Logic capacity Approximately 149,500 logic elements for implementing complex programmable logic and control functions.
- Embedded memory Approximately 7.88 Mbits of on-chip RAM (7,880,704 total RAM bits) to support buffering, tables, and local data storage.
- I/O and package 336 user I/O pins and a 672-ball FBGA package (27 × 27 mm footprint) optimized for high-density board designs; surface-mount package case.
- Integration & interfaces Cyclone V family devices feature integrated transceivers and hard memory controllers; the family also includes variable-precision DSP blocks and M10K embedded memory block types as described in the device overview.
- Power and thermal Commercial-grade operating temperature range of 0 °C to 85 °C and a defined core supply window of 1.07 V–1.13 V to guide power delivery and thermal design.
- Standards and compliance RoHS-compliant for environmental and regulatory consistency in mainstream electronic assemblies.
Typical Applications
- Industrial control Implement motor control, sensor aggregation, and deterministic logic functions using the device’s large logic element count and on-chip memory.
- Telecom and wireline systems Use the Cyclone V family’s integrated transceiver and memory controller capabilities to manage packet buffering, protocol bridging, and interface logic.
- Wireless infrastructure Apply variable-precision DSP blocks and embedded memory for signal processing blocks, filtering, and intermediate buffering.
- Embedded compute and I/O consolidation Consolidate glue logic, protocol translation, and I/O multiplexing for compact system designs that benefit from high I/O density and embedded RAM.
Unique Advantages
- High integration in a single device: Reduces BOM and board area by combining substantial logic elements, embedded memory, and dense I/O in a single 672-FBGA package.
- Low-voltage core operation: Narrow supply window (1.07 V–1.13 V) aligned with 28-nm low-power process enables focused power delivery and efficient thermal design.
- Strong on-chip memory resource: Approximately 7.88 Mbits of embedded RAM provides local buffering and state storage without external memory for many use cases.
- Commercial-temperature suitability: Rated for 0 °C to 85 °C to match a wide range of general-purpose electronic applications.
- RoHS-compliant: Meets common environmental requirements for modern electronic assemblies.
Why Choose 5CEFA7F27C8N?
The 5CEFA7F27C8N delivers a balanced combination of logic capacity, embedded memory, and dense I/O in a compact 672-BGA footprint, making it appropriate for designs that need significant programmable logic and local memory without expanding board area. Its low-voltage, 28-nm process heritage and Cyclone V family capabilities (including integrated transceiver and hard memory controller options at the family level) provide a path to efficient, integrated system designs.
This device is well suited for engineering teams designing commercial-temperature embedded systems that require strong on-chip resources, high I/O count, and a RoHS-compliant component for production. It offers scalability within the Cyclone V family for projects that may grow in logic or interface complexity over time.
Request a quote or submit your requirements to receive pricing and availability information for the 5CEFA7F27C8N. Our team can provide lead-time details and assist with evaluating the device for your design.

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