5CEFA7F31I7N

The 5CEFA7F31I7N is an Intel Cyclone V E field-programmable gate array (FPGA) delivered in an 896-ball BGA (896-FBGA, 31×31) package for surface-mount assembly. It provides a high-density FPGA fabric with 149,500 logic elements and approximately 7.88 Mbits of embedded memory, designed for industrial and high-volume, cost-sensitive applications that require flexible, programmable logic and generous I/O capacity.

Built on the Cyclone V family architecture, the device combines programmable logic, integrated memory resources, and a broad I/O set to support industrial instrumentation, wireless and wireline communications, and military applications where temperature range, power, and integration are key considerations.

Key Features

• Logic Capacity  Offers 149,500 logic elements to implement complex logic functions and control algorithms in a single device.
• Logic Modules  56,480 logic modules provide modular fabric resources for mapping combinatorial and sequential logic efficiently.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM for buffering, tables, and state storage within the FPGA fabric.
• I/O Density  480 user I/O pins enable broad connectivity to peripherals, sensors, memory devices, and high-pin-count system interfaces.
• Power  Core supply operation centered at 1.1 V with a specified operating supply range of 1.07 V to 1.13 V for predictable power design.
• Package & Mounting  896-ball FBGA (31×31) surface-mount package suited for board-level integration in compact systems.
• Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C, supporting extended temperature deployments.
• Standards & Compliance  RoHS-compliant for environmental and regulatory conformance in manufacturing.
• Cyclone V Family Capabilities  Series-level features include an enhanced 8-input adaptive logic module structure, variable-precision DSP blocks, hard memory controllers, and integrated transceiver options for higher bandwidth designs.

Typical Applications

• Industrial Control & Automation  Use the FPGA for motor control, PLC logic, real-time I/O aggregation and deterministic processing across extended temperature ranges.
• Communications & Networking  Implement protocol processing, packet handling, or mid-range transceiver interfaces leveraging the device’s abundant logic and embedded memory.
• Defense & Aerospace Electronics  Deploy in military and related systems that require flexible logic, high I/O count, and industrial temperature operation.
• Embedded System Integration  Offload custom peripherals, hardware accelerators, or pre/post-processing in systems that benefit from on-chip RAM and broad I/O connectivity.

Unique Advantages

• High logic density: 149,500 logic elements enable complex designs and consolidation of multiple functions into one device, reducing system BOM.
• Substantial embedded memory: Approximately 7.88 Mbits of on-chip RAM supports local buffering and stateful processing without external memory for many use cases.
• Robust I/O capability: 480 I/O pins provide the flexibility to interface with many peripherals and parallel buses without external multiplexing.
• Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact, manufacturable package: 896-FBGA (31×31) surface-mount package balances high pin-count with board-space efficiency for production designs.
• Series-level system features: Inherits Cyclone V family attributes such as enhanced ALM architecture, DSP blocks, hard memory controllers, and transceiver support for scalable system designs.

Why Choose 5CEFA7F31I7N?

The 5CEFA7F31I7N positions itself as a high-capacity, industrial-grade Cyclone V E FPGA that combines large programmable logic resources, significant on-chip memory, and a high I/O count in a production-ready BGA package. It is well suited for engineers who need to consolidate multiple functions, accelerate algorithmic workloads, or implement flexible hardware interfaces while maintaining industrial temperature performance.

For design teams targeting industrial, wireless/wireline, or defense applications, this device offers a balance of integration, predictable power requirements (nominal 1.1 V core) and a proven family feature set that supports migration and system-level IP reuse.

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