5CEFA9F27C8N

The 5CEFA9F27C8N is a Cyclone® V E field programmable gate array offered in a 672-ball BGA (27 × 27) package. It integrates 301,000 logic elements and approximately 14.25 Mbits of embedded memory to address cost-sensitive, performance-oriented designs requiring high logic density and on-chip memory.

Targeted for commercial applications, this device supports up to 336 I/O signals, operates from a core supply range of 1.07 V to 1.13 V, and is specified for 0 °C to 85 °C. The Cyclone V family features low-power 28 nm technology and architecture elements designed for flexible logic, DSP, and memory integration.

Key Features

• Logic Capacity  301,000 logic elements, enabling substantial programmable logic for complex control, signal processing, and glue-logic functions.
• Embedded Memory  Approximately 14.25 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage for accelerated processing.
• I/O and Package  336 user I/O pins presented in a 672-BGA (672-FBGA, 27 × 27 mm) package for dense board-level integration and flexible interfacing.
• Core Voltage  Designed to run from a narrow core supply range of 1.07 V to 1.13 V (nominal 1.1 V), consistent with low-power process operation.
• Commercial Temperature Grade  Specified for 0 °C to 85 °C operation for standard commercial deployments.
• Low-Power 28 nm Technology  Cyclone V family devices are built on a 28 nm low-power process and include architecture features such as 8-input adaptive logic modules and variable-precision DSP blocks to balance performance with efficiency.
• On-chip Memory Blocks  Family-level memory architecture includes M10K memory blocks with ECC support, enabling reliable embedded storage and error detection capabilities.
• Standards & Compliance  RoHS-compliant, supporting regulatory requirements for lead-free manufacturing processes.

Typical Applications

• Wireless and Wireline Communications  Use the device’s logic density and on-chip memory to implement protocol processing, packet buffering, and interface bridging in communications equipment.
• Embedded Processing & Acceleration  Leverage the combination of large logic fabric and embedded RAM for data-path acceleration, DSP functions, and custom co-processing in SoC designs.
• High-density I/O Control  With 336 I/O pins in a compact 672-BGA package, the device is suitable for applications requiring many system interfaces such as sensor aggregation and board-level glue logic.

Unique Advantages

• Substantial On-chip Resources:  301,000 logic elements and approximately 14.25 Mbits of embedded memory provide headroom for large finite-state machines, datapaths, and buffering without external RAM.
• Compact, High-pin Package:  The 672-FBGA (27 × 27) package packs 336 usable I/Os for dense system integration while keeping board area efficient.
• Low-voltage Core Operation:  A narrow 1.07 V–1.13 V core supply window aligns with low-power design goals and helps simplify power-supply design for the FPGA fabric.
• Architecture Optimized for Mixed Tasks:  Family features such as 8-input adaptive logic modules and variable-precision DSP blocks enable flexible mapping of control, signal-processing, and arithmetic workloads.
• Regulatory Ready:  RoHS compliance supports lead-free manufacturing and global environmental requirements.

Why Choose 5CEFA9F27C8N?

The 5CEFA9F27C8N balances high logic density, substantial embedded memory, and a compact BGA footprint to address commercial designs that require integrated logic and memory without excessive board-level complexity. Its narrow core-voltage range and 28 nm family architecture provide a pragmatic combination of power efficiency and programmable capability.

This device is well suited to engineers building communication front-ends, embedded accelerators, or high-I/O control systems who need a commercially graded FPGA with clear, verifiable specifications for core voltage, operating temperature, I/O count, and package type.

Request a quote or submit a purchase inquiry to evaluate 5CEFA9F27C8N for your next FPGA-based design.