5CGTFD5C5F27C7N

IC FPGA 336 I/O 672FBGA
Part Description

Cyclone® V GT Field Programmable Gate Array (FPGA) IC 336 5001216 77000 672-BGA

Quantity 875 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package672-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case672-BGANumber of I/O336Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CGTFD5C5F27C7N – Cyclone® V GT FPGA IC, 336 I/O, 672-BGA

The 5CGTFD5C5F27C7N is an Intel Cyclone® V GT field-programmable gate array supplied in a 672-ball BGA package. As a member of the Cyclone V family, this commercial-grade FPGA combines substantial programmable logic capacity with high I/O density and family-level integration features such as integrated transceivers and hard memory controllers.

With approximately 77,000 logic elements, roughly 5 Mbits of embedded memory, and 336 general-purpose I/Os, this device targets applications that require a balance of logic density, on-chip memory, and compact footprint while operating at a low core voltage.

Key Features

  • Core logic  Approximately 77,000 logic elements for implementing complex custom logic, control functions, and data-paths.
  • Embedded memory  Approximately 5 Mbits of on-chip RAM to support buffers, lookup tables, and local storage without immediate reliance on external memory.
  • I/O and packaging  336 user I/Os in a compact 672-BGA (672-FBGA, 27×27) surface-mount package to maximize board-level connectivity in a small footprint.
  • Power and voltage  Core supply operating range of 1.07 V to 1.13 V; Cyclone V family devices are built on a 28 nm low-power (28LP) process to help reduce system power.
  • Integrated system features  Cyclone V devices are enhanced with integrated transceivers and hard memory controllers, enabling high-bandwidth interfaces and simplified external memory integration at the family level.
  • Commercial-grade thermal range  Rated for operation from 0 °C to 85 °C, suitable for commercial-environment deployments.
  • RoHS compliant  Device meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

  • Wireless and wireline infrastructure  High I/O count and family-level transceiver support suit PHY and protocol processing, fronthaul/backhaul, and data-path functions.
  • Industrial systems  Programmable logic and on-chip memory enable control, sensor aggregation, and custom I/O processing in automation equipment and machine control.
  • Defense and communication equipment  Logic density and integrated interface capabilities support custom processing, data buffering, and protocol adaptation in defense and specialized communications gear.
  • Embedded compute and acceleration  Logic elements and embedded RAM allow for offloading deterministic tasks, pre-processing, and custom accelerators within embedded platforms.

Unique Advantages

  • High programmable density: Approximately 77,000 logic elements enable complex functions and substantial parallelism on-chip.
  • On-chip memory for lower system cost: About 5 Mbits of embedded RAM reduces dependency on external memory for many buffering and control tasks.
  • Flexible board-level integration: 336 I/Os in a compact 672-BGA package provide dense connectivity while conserving PCB area.
  • Low-voltage operation: Narrow core-voltage window (1.07 V–1.13 V) and 28 nm low-power family technology help minimize core power consumption.
  • Family-level interface IP: Cyclone V devices include integrated transceivers and hard memory controllers to streamline high-speed links and external memory interfaces.
  • Commercial-ready and RoHS compliant: Designed for commercial-temperature operation (0 °C–85 °C) and RoHS-conformant production environments.

Why Choose 5CGTFD5C5F27C7N?

The 5CGTFD5C5F27C7N delivers a balance of logic capacity, embedded memory, and high I/O density in a compact 672-BGA package, making it a solid choice for designs that need sizeable programmable logic plus on-chip resources without a large board footprint. Its low-voltage operation and family-level integration features such as transceivers and hard memory controllers support efficient, high-bandwidth implementations while helping to control system cost and complexity.

This device is well suited to engineers and system designers building commercial-market communication, industrial, and defense-focused embedded systems who require programmable flexibility, built-in memory, and dense I/O in a single, RoHS-compliant device.

Request a quote or submit an RFQ to obtain pricing and availability information for the 5CGTFD5C5F27C7N.

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