5CGTFD5C5F23I7N
| Part Description |
Cyclone® V GT Field Programmable Gate Array (FPGA) IC 240 5001216 77000 484-BGA |
|---|---|
| Quantity | 763 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 29080 | Number of Logic Elements/Cells | 77000 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5001216 |
Overview of 5CGTFD5C5F23I7N – Cyclone® V GT Field Programmable Gate Array, 484-BGA
The 5CGTFD5C5F23I7N is an Intel Cyclone V GT Field Programmable Gate Array (FPGA) in a 484-ball BGA package. It combines a high-density programmable fabric with on-chip memory and integrated system IP to address industrial and communications-oriented designs.
Designed for low-power 28 nm process families, the device targets applications that require substantial logic capacity, embedded memory, and high I/O counts while operating across an industrial temperature range.
Key Features
- Logic Capacity — Approximately 77,000 logic elements for implementing complex custom logic and control functions.
- Embedded Memory — Approximately 5.0 Mbits of on-chip RAM (5,001,216 total RAM bits) for buffering, state storage, and small on-chip data structures.
- I/O Density — 240 user I/O pins to support broad external interfacing and parallel connectivity.
- Integrated System IP — Family documentation indicates integrated transceivers and hard memory controllers are part of the Cyclone V GT offering, enabling higher-bandwidth interfaces where required.
- Process and Core Voltage — Built on a 28 nm low-power process with an operating core supply range of 1.07 V to 1.13 V (nominal 1.1 V).
- Package and Mounting — 484-ball FBGA (23 × 23) surface-mount package (484-BGA) for compact system integration.
- Industrial Temperature — Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
- Compliance — RoHS-compliant manufacturing.
Typical Applications
- Industrial Automation — Implement motor control, PLC interfaces, and deterministic I/O handling leveraging the device’s logic density and industrial temperature rating.
- Wireless and Wireline Infrastructure — Use embedded memory and integrated transceiver capabilities (as provided by the Cyclone V GT family) for protocol handling, packet buffering, and interface bridging.
- Military Systems — Deploy in ruggedized or climate-variable environments where industrial-grade temperature operation and configurable logic are required.
- SoC and Embedded Systems — Combine programmable fabric and family-level hard IP to accelerate custom processing, peripheral control, and memory interfacing in compact designs.
Unique Advantages
- High Logic and Memory Integration: Approximately 77,000 logic elements paired with around 5.0 Mbits of embedded RAM reduces the need for external components and shortens signal paths.
- Compact, Surface-Mount Package: The 484-FBGA (23 × 23) package enables high-density board layouts while providing 240 I/O to support complex peripheral sets.
- Industrial Temperature Range: Rated –40 °C to 100 °C to meet the environmental demands of factory and field-deployed systems.
- Low-Voltage Core: Narrow core supply range (1.07 V–1.13 V) aligns with low-power 28 nm design practices for efficient system power management.
- RoHS Compliance: Manufactured to RoHS requirements, simplifying regulatory tracking for assemblies that require lead-free components.
Why Choose 5CGTFD5C5F23I7N?
The 5CGTFD5C5F23I7N Cyclone V GT FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 484-BGA footprint and industrial temperature rating. Its TSMC 28 nm low-power heritage and narrow core voltage window support energy-conscious designs without sacrificing programmable flexibility.
This device is suited for engineers and system integrators building industrial control, communications infrastructure, and embedded SoC solutions that require on-chip memory, significant programmable logic, and robust environmental performance. Choosing this FPGA helps reduce board-level component count while providing the configurability needed for evolving product requirements.
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