5CGTFD5C5M13C7N
| Part Description |
Cyclone® V GT Field Programmable Gate Array (FPGA) IC 175 5001216 77000 383-TFBGA |
|---|---|
| Quantity | 969 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 383-MBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 383-TFBGA | Number of I/O | 175 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 29080 | Number of Logic Elements/Cells | 77000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5001216 |
Overview of 5CGTFD5C5M13C7N – Cyclone® V GT FPGA, 77,000 logic elements, ~5 Mbits embedded memory, 175 I/O, 383-TFBGA
The 5CGTFD5C5M13C7N is an Intel Cyclone® V GT field programmable gate array (FPGA) in a 383-TFBGA package. It combines a high-density FPGA fabric with on-chip embedded memory and extensive I/O to address cost-sensitive, bandwidth-focused designs.
As part of the Cyclone V family, this GT variant emphasizes integration for applications that require serial connectivity and hard memory controller functionality while maintaining a commercial-grade operating range and low-power core supply requirements.
Key Features
- Logic Fabric Approximately 77,000 logic elements provide the core programmable fabric for custom digital functions and control logic.
- Embedded Memory Approximately 5 Mbits of on-chip embedded memory (total RAM bits: 5,001,216) for buffering, LUT-based storage, and local data processing.
- I/O Density 175 general-purpose I/O pins enable broad interfacing to peripherals, sensors, and external devices.
- High-speed Transceivers (Series Feature) Cyclone V GT devices incorporate low-power serial transceivers with supported data rates in the family up to 3.125 Gbps and 6.144 Gbps for high-bandwidth links.
- Power Designed to operate with a core voltage range of 1.07 V to 1.13 V, aligning with the Cyclone V family’s low-power 28 nm process characteristics.
- Package & Mounting 383-TFBGA (supplier device package: 383-MBGA, 13×13) in a surface-mount form factor for compact board-level integration.
- Commercial Temperature Grade Rated for 0 °C to 85 °C operation and specified as Commercial grade.
- Environmental Compliance RoHS-compliant construction.
Typical Applications
- High-bandwidth serial links Use the GT transceiver capability for multi-gigabit serial communications in wireline and wireless backhaul or high-speed board-to-board links.
- Memory interface acceleration On-chip memory combined with Cyclone V hard memory controller capability (family feature) is suitable for designs requiring external memory management and buffering.
- Industrial control and automation Leverage the device’s I/O count and programmable fabric for motor control, sensor aggregation, and real-time control tasks in commercial industrial applications.
- Custom protocol and peripheral bridging Implement protocol translation, custom interfaces, and glue logic between heterogeneous subsystems using the array of I/O and programmable logic.
Unique Advantages
- High-density programmable fabric: The ~77,000 logic elements enable complex custom logic and multiple concurrent functions on a single device, reducing PCB complexity.
- Embedded memory for local buffering: Approximately 5 Mbits of on-chip RAM supports look-up tables, FIFOs, and temporary storage without immediate reliance on external memory.
- Integrated high-speed connectivity (family-level): The Cyclone V GT family’s transceiver integration reduces the need for discrete SERDES components and simplifies high-speed link design.
- Low-voltage core operation: A tight core voltage range (1.07–1.13 V) consistent with low-power 28 nm process operation helps plan power distribution and thermal budgets.
- Compact, surface-mount packaging: The 383-TFBGA (383-MBGA 13×13) package supports dense board layouts and automated assembly processes.
- Commercial-grade robustness: Specified operation from 0 °C to 85 °C accommodates a wide range of commercial applications and environments.
Why Choose 5CGTFD5C5M13C7N?
The 5CGTFD5C5M13C7N positions itself as a high-density, integrated FPGA solution for designs that require substantial programmable logic, embedded memory, and broad I/O in a compact surface-mount package. Its alignment with the Cyclone V GT family brings the benefits of integrated transceivers and memory controller capabilities, helping reduce external component count and simplify system architecture.
This part is well-suited for engineering teams developing cost- and power-sensitive commercial products that demand multi-gigabit connectivity, flexible peripheral interfacing, and scalable logic capacity backed by Intel’s Cyclone V device family documentation and ecosystem.
Request a quote or submit an RFQ to begin procurement for the 5CGTFD5C5M13C7N and evaluate how it fits into your next FPGA-based design.

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