5CGTFD7C5U19A7N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V GT Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Quantity 74 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits7880704

Overview of 5CGTFD7C5U19A7N – Cyclone® V GT FPGA, 484-FBGA

The 5CGTFD7C5U19A7N is a Cyclone® V GT Field Programmable Gate Array (FPGA) in a 484-FBGA package designed for high-density, cost-sensitive embedded designs. It combines a large programmable fabric with substantial on-chip RAM and broad I/O to address applications across automotive (AEC‑Q100 qualified), industrial, wireless/wireline, and military markets.

Built on the Cyclone V architecture, this device targets designs that require a balance of integration, power-efficient operation at a ~1.1 V core supply, and extended operating temperature range for demanding environments.

Key Features

  • Core Logic — 149,500 logic elements provide significant programmable capacity for control, data-path, and custom logic implementations.
  • Embedded Memory — Approximately 7.88 Mbits of on-chip RAM to support buffering, packet processing, and local storage requirements.
  • I/O and Packaging — 240 user I/Os in a 484‑FBGA (484‑UBGA, 19×19) surface-mount package, enabling dense board-level I/O routing and high pin count designs.
  • Voltage and Power — Operates with a core voltage range of 1.07 V to 1.13 V (nominal ~1.1 V), suitable for low-power system designs.
  • Temperature Range — Qualified for operation from −40 °C to 125 °C, supporting extended-temperature and harsh-environment applications.
  • Automotive Qualification — AEC‑Q100 qualification and Automotive grade designation for use in qualified in-vehicle systems.
  • Mounting — Surface-mount package compatible with standard PCB assembly processes for high-volume manufacturing.

Typical Applications

  • Automotive Systems — In-vehicle processing, sensor fusion, and domain controllers where AEC‑Q100 qualification and extended temperature support are required.
  • Industrial Control — Motor control, factory automation, and ruggedized controllers that need large logic capacity and deterministic I/O.
  • Wireless and Wireline Infrastructure — Protocol handling, packet buffering, and custom data-path acceleration leveraging the device’s logic and embedded RAM.
  • Military and Rugged Electronics — Systems demanding extended temperature range and qualified components for deployed, mission-critical equipment.

Unique Advantages

  • High Logic Density: 149,500 logic elements provide headroom for complex control and signal-processing architectures without immediate device migration.
  • Substantial On-Chip Memory: Approximately 7.88 Mbits of embedded RAM reduces external memory dependency and simplifies PCB routing for buffering and temporary storage.
  • Automotive-Grade Qualification: AEC‑Q100 qualification and Automotive grade designation enable confident selection for automotive system designs requiring qualified silicon.
  • Robust Thermal Range: −40 °C to 125 °C operating range supports deployment in harsh and temperature-variable environments.
  • Board-Level Integration: 240 I/Os in a 484-FBGA package provide dense connectivity for mixed-signal interfaces, sensors, and high-pin-count subsystems.
  • Low-Voltage Operation: Narrow core voltage window (1.07 V–1.13 V) supports consistent power budgeting and energy-efficient system architectures.

Why Choose 5CGTFD7C5U19A7N?

The 5CGTFD7C5U19A7N Cyclone V GT FPGA delivers a practical combination of programmable logic capacity, embedded memory, and robust environmental qualifications for designs that need scalable integration and dependable operation. Its automotive qualification and extended temperature range make it suitable for transportation and other harsh-environment applications, while the large logic and I/O resources address demanding control and data-path tasks in industrial and communications systems.

For engineering teams seeking a qualified, high-capacity FPGA with clear power and packaging characteristics, this device provides a balanced platform to optimize BOM, simplify board design, and accelerate time to prototype and production.

Request a quote or submit a purchase inquiry to get pricing and availability for part number 5CGTFD7C5U19A7N. Our team can provide lead-time estimates and support your design planning.

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