5CGTFD7B5M15I7N

The 5CGTFD7B5M15I7N is an Intel Cyclone V GT series FPGA in a 484-LFBGA (15×15 mm MBGA) package, offering a high-density programmable fabric with integrated I/O and on-chip memory for industrial applications. It combines a large logic capacity, embedded memory, and high-speed transceiver capability appropriate for industrial, wireless/wireline, and military applications that require flexible, reconfigurable hardware.

As a Cyclone V device, this FPGA is built on a 28 nm low-power process and is designed to deliver efficient logic integration with integrated system-level features such as hard memory controllers and transceivers, while operating across an extended industrial temperature range.

Key Features

• Logic Capacity  Approximately 149,500 logic elements provide substantial programmable resources for complex digital designs.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM suited for buffering, mid-size memory structures, and local data storage.
• I/O Density  240 general-purpose I/O pins to support broad peripheral interfacing and system integration.
• Process and Core Voltage  Built on TSMC's 28 nm low-power (28LP) process with a core voltage range of 1.07 V to 1.13 V (nominal 1.1 V), targeting reduced power consumption.
• Integrated Transceivers & Hard IP  Series-level Cyclone V documentation highlights integrated transceivers and hard memory controllers to support higher-bandwidth interfaces and external memory integration.
• Package & Mounting  484-LFBGA (484-MBGA, 15×15) surface-mount package for compact board-level integration.
• Industrial Temperature Rating  Qualified for operation from −40 °C to 100 °C to meet extended-temperature system requirements.
• RoHS Compliant  Meets RoHS environmental standards for lead-free manufacturing processes.

Typical Applications

• Industrial Control  Programmable logic and on-chip memory allow implementation of motor control, real-time I/O aggregation, and custom control algorithms in industrial systems.
• Wireless and Wireline Infrastructure  Integrated transceivers and hard memory controllers support high-bandwidth data paths and interface functions in networking and base station equipment.
• Defense and Military Systems  Extended temperature range and high logic density enable rugged, reconfigurable signal processing and interface handling for mission-critical applications.

Unique Advantages

• High Logic Density:  Large logic element count enables consolidation of multiple functions into a single programmable device, reducing board-level component count.
• Embedded Memory for Local Storage:  Approximately 7.88 Mbits of on-chip RAM reduces the need for external buffering and improves deterministic data handling.
• Industrial-Temperature Operation:  Rated from −40 °C to 100 °C for deployment in temperature-challenging environments without additional thermal qualification.
• Low-Voltage Core:  1.07–1.13 V supply range (nominal 1.1 V) and 28 nm low-power process help minimize core power consumption in deployed systems.
• Compact, High-Pin Package:  484-LFBGA (15×15 MBGA) offers a high I/O count (240 pins) in a compact footprint for dense, space-constrained designs.
• Standards-Aligned Manufacturing:  RoHS-compliant construction supports modern environmental and manufacturing requirements.

Why Choose 5CGTFD7B5M15I7N?

The 5CGTFD7B5M15I7N positions itself as a high-capacity, industrial-grade Cyclone V GT FPGA that balances logic density, embedded memory, and I/O flexibility for demanding embedded and communications designs. Its 28 nm low-power heritage and nominal 1.1 V core operation provide an efficient platform for integrating multiple functions and high-bandwidth interfaces within a single device.

Engineers building industrial, wireless/wireline, or military systems will find this device suitable when a combination of substantial programmable resources, on-chip RAM, extended temperature operation, and compact packaging is required. The device is supported by Cyclone V device documentation and development resources from the manufacturer to aid design and integration.

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