5CGTFD7C5U19C7N

IC FPGA 240 I/O 484UBGA
Part Description

Cyclone® V GT Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-FBGA

Quantity 201 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-UBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56480Number of Logic Elements/Cells149500
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits7880704

Overview of 5CGTFD7C5U19C7N – Cyclone V GT FPGA, 484-FBGA

The Intel 5CGTFD7C5U19C7N is a Cyclone® V GT field-programmable gate array supplied in a 484-ball FBGA package. This commercial-grade FPGA combines large logic capacity, substantial embedded memory, and integrated high-speed transceiver capabilities to address bandwidth- and integration-driven designs.

Targeted use cases include industrial systems, wireless and wireline communications, and embedded platforms that require a balance of performance, low power, and system integration through hard IP blocks such as transceivers and memory controllers.

Key Features

  • Logic Capacity – 149,500 logic elements for implementing complex digital functions and large-scale programmable logic designs.
  • Embedded Memory – Approximately 7.88 Mbits of on-chip RAM to support buffering, packet storage, and local data processing without external memory.
  • High-Speed I/O – 240 I/O pins to support diverse peripheral interfaces and board-level connectivity.
  • Integrated Transceivers & Hard IP – Cyclone V GT architecture includes integrated serial transceivers and hard memory-controller IP to simplify high-bandwidth interfaces and external memory integration.
  • Process & Power – Built on a 28 nm low-power process with a device core supply range of 1.07 V to 1.13 V to optimize power for embedded systems.
  • Package & Mounting – 484-ball FBGA (484-UBGA, 19×19) surface-mount package for compact board integration.
  • Operating Conditions – Commercial-grade temperature range of 0 °C to 85 °C for standard embedded and industrial environments.
  • Compliance – RoHS compliant.

Typical Applications

  • Industrial Control – PLC front-ends, motion control and sensor aggregation tasks that require substantial logic and on-chip memory for deterministic processing.
  • Wireless & Wireline Communications – PHY and protocol processing leveraging integrated transceivers and embedded memory for packet buffering and data handling.
  • Embedded SoC Integration – Custom accelerators, bridging and protocol conversion in systems that benefit from hard IP blocks and high logic density.
  • High-speed Data Interfaces – Interface bridging and data-path logic where multiple I/Os and integrated serial transceivers reduce external component count.

Unique Advantages

  • Large programmable fabric: 149,500 logic elements enable implementation of extensive custom logic and IP cores on a single device, reducing system complexity.
  • Significant on-chip memory: Approximately 7.88 Mbits of embedded RAM supports buffering and local data processing, minimizing dependence on external memory.
  • Integrated high-speed connectivity: GT-class Cyclone V architecture includes built-in transceivers and hard memory controllers, streamlining high-bandwidth designs.
  • Low-power process: Built on 28 nm low-power technology with a tightly specified core supply (1.07–1.13 V) to help manage power across complex designs.
  • Compact, board-ready package: 484-FBGA (19×19) surface-mount package provides a high I/O count in a compact footprint for dense system boards.
  • Regulatory friendliness: RoHS compliance supports modern assembly and environmental requirements.

Why Choose 5CGTFD7C5U19C7N?

The 5CGTFD7C5U19C7N Cyclone V GT FPGA positions itself as a high-capacity, integration-focused solution for designs that require abundant logic, substantial embedded memory, and integrated high-speed interfaces. Its combination of 149,500 logic elements, approximately 7.88 Mbits of on-chip RAM, and 240 I/Os in a 484-FBGA package makes it well suited to embedded communication, control, and data-path applications where board-level integration and reduced BOM are priorities.

As a commercial-grade device built on 28 nm low-power process technology with defined core-voltage and temperature ranges, this Cyclone V GT device is appropriate for engineers and procurement teams seeking a verified platform with strong integration of hard IP and connectivity features.

Request a quote or submit an RFQ to get pricing and availability for 5CGTFD7C5U19C7N. Our team will respond with lead-time and ordering options tailored to your project timeline.

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