5CGXFC5C6F23C7N

IC FPGA 240 I/O 484FBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 5001216 77000 484-BGA

Quantity 670 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O240Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CGXFC5C6F23C7N – Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 5001216 77000 484-BGA

The 5CGXFC5C6F23C7N is a Cyclone® V GX series FPGA in a 484‑BGA package. It combines a high logic element count with on‑chip embedded memory and a broad I/O complement to address mid‑to‑high density programmable logic requirements.

Designed for applications that need integration of programmable logic with high‑speed interfaces and memory subsystems, this commercial‑grade device targets industrial, wireless and wireline, and military application segments where performance, integration and power efficiency are important.

Key Features

  • Logic Capacity — 77,000 logic elements (cells) for implementing complex digital functions and moderate‑to‑large FPGA designs.
  • Embedded Memory — Approximately 5.0 Mbits of on‑chip RAM (5,001,216 bits) to support data buffering, FIFOs and lookup tables inside the fabric.
  • I/O Density — 240 user I/O pins to interface with peripherals, memory devices and external logic.
  • Process Technology — Built on TSMC 28‑nm low‑power (28LP) process technology as part of the Cyclone V family, providing a balance of integration and power efficiency.
  • Integrated System Features (series) — Cyclone V family features include enhanced 8‑input adaptive logic modules, variable‑precision DSP blocks and hard memory controller/transceiver options at the series level.
  • Power Supply — Core voltage range 1.07 V to 1.13 V for the device core.
  • Package & Mounting — 484‑FBGA (23×23) package, surface‑mount for compact board integration.
  • Operating Temperature — Commercial grade operation from 0 °C to 85 °C.
  • Environmental Compliance — RoHS‑compliant.

Typical Applications

  • High‑bandwidth interfaces — Use the device’s I/O density and series transceiver options for bridging and protocol adaptation in wireless and wireline equipment.
  • Embedded memory buffering — On‑chip RAM enables data buffering, packet handling and mid‑rate memory interfaces in networking and communication systems.
  • Industrial control and automation — Implement motor control, sensor aggregation and custom logic functions where a commercial‑grade FPGA with ample I/O and logic is required.
  • Defense and military systems — Suitable for non‑automotive military applications that require programmable logic, provided system qualifications meet program needs.

Unique Advantages

  • Substantial programmable capacity: 77,000 logic elements provide the headroom for complex state machines, protocol engines and custom datapaths.
  • Integrated on‑chip RAM: Approximately 5.0 Mbits of embedded memory reduces external memory dependency and lowers BOM for many buffering tasks.
  • High I/O count: 240 I/O pins simplify system partitioning and reduce the need for external I/O expanders.
  • Compact, surface‑mount BGA: 484‑FBGA (23×23) package supports dense board layouts for space‑constrained designs.
  • Low‑voltage core operation: 1.07–1.13 V core supply supports modern low‑power board designs while aligning with Cyclone V series power characteristics.
  • Regulatory and assembly readiness: RoHS compliance and standard commercial temperature rating streamline production and procurement for commercial products.

Why Choose 5CGXFC5C6F23C7N?

The 5CGXFC5C6F23C7N delivers a balanced combination of logic density, embedded memory and I/O flexibility in a compact 484‑BGA footprint. As a Cyclone V GX device, it leverages series innovations in logic architecture and low‑power 28‑nm process technology to enable integrated, power‑efficient designs for communication, industrial and defense applications.

This part is suited to design teams that need scalable FPGA capacity with built‑in memory and ample I/O without moving to higher‑cost device families. Its commercial temperature range and RoHS status make it straightforward to integrate into production hardware for commercial programs.

Request a quote or submit a parts inquiry to get pricing and availability for 5CGXFC5C6F23C7N and to discuss how this Cyclone V GX FPGA can fit into your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up